公开(公告)号：US20120074527A1

公开(公告)日：2012-03-29

申请号：US13230035

申请日：2011-09-12

Applicant: Fabrice Casset ,  Lionel Cadix ,  Perceval Coudrain ,  Alexis Farcy ,  Laúrent-Lüc Chapelon ,  Yacine Felk ,  Pascal Ancey

Inventor： Fabrice Casset ,  Lionel Cadix ,  Perceval Coudrain ,  Alexis Farcy ,  Laúrent-Lüc Chapelon ,  Yacine Felk ,  Pascal Ancey

IPC: H01L29/06 ,  H01L21/283

CPC classification number: B81C1/00246 ,  B81B2201/014 ,  B81B2201/0235 ,  B81B2201/0271 ,  B81B2203/0353 ,  B81B2207/012 ,  B81C1/005 ,  G01P15/125 ,  G01P2015/082 ,  H01L2924/0002 ,  H03H3/0073 ,  H03H9/2426 ,  H01L2924/00

Abstract: The integrated circuit comprises a support substrate having opposite first and second main surfaces. A cavity passes through the support substrate and connects the first and second main surfaces. The integrated circuit comprises a device with a mobile element, the mobile element and a pair of associated electrodes of which are included in a cavity. An anchoring node of the mobile element is located at the level of the first main surface. The integrated circuit comprises a first elementary chip arranged at the level of the first main surface and electrically connected to the device with a mobile element.

Abstract translation: 集成电路包括具有相对的第一和第二主表面的支撑基板。 空腔通过支撑基板并连接第一和第二主表面。 集成电路包括具有移动元件的装置，移动元件和一对相关联的电极包括在空腔中。 移动元件的锚定节点位于第一主表面的水平面上。 集成电路包括布置在第一主表面的电平处的第一基本芯片，并与移动元件电连接到该装置。

公开(公告)号：US20110284995A1

公开(公告)日：2011-11-24

申请号：US13112587

申请日：2011-05-20

Applicant: Jan H. Kuypers ,  Andrew Sparks ,  Klaus Juergen Schoepf ,  Reimund Rebel

Inventor： Jan H. Kuypers ,  Andrew Sparks ,  Klaus Juergen Schoepf ,  Reimund Rebel

IPC: H01L29/06 ,  H01L21/324 ,  H01L21/316

CPC classification number: B81C1/00658 ,  B81B7/02 ,  B81B2201/0271 ,  B81C1/00158 ,  B81C2201/0169 ,  H03H9/02275 ,  H03H9/2405 ,  H03H2009/241

Abstract: Micromechanical membranes suitable for formation of mechanical resonating structures are described, as well as methods for making such membranes. The membranes may be formed by forming cavities in a substrate, and in some instances may be oxidized to provide desired mechanical properties. Mechanical resonating structures may be formed from the membrane and oxide structures.

Abstract translation: 描述适于形成机械共振结构的微机械膜以及制造这种膜的方法。 膜可以通过在基底中形成空腔而形成，并且在一些情况下可以被氧化以提供期望的机械性质。 机械共振结构可以由膜和氧化物结构形成。

公开(公告)号：US20110277808A1

公开(公告)日：2011-11-17

申请号：US13053634

申请日：2011-03-22

Applicant: Andrei J. Pavlov ,  Yelena V. Pavlova

Inventor： Andrei J. Pavlov ,  Yelena V. Pavlova

IPC: H01L31/042 ,  H01L31/06

CPC classification number: H01J45/00 ,  B81B7/02 ,  B81B2201/0271

Abstract: A microelectromechanical system (MEMS) solar cell device. The MEMS solar cell device includes a substrate, a sensing membrane exposed to light radiation being spaced from the substrate, a collector electrode disposed between the substrate and the sensing membrane, and a cavity defined between the sensing membrane and the collector electrode. The collector electrode collects charge carriers generated by light radiation on the sensing membrane within the cavity. A solar module or panel may be provided including a plurality of the cells arranged in an array on a substrate.

Abstract translation: 一种微机电系统（MEMS）太阳能电池装置。 MEMS太阳能电池器件包括衬底，暴露于与衬底间隔开的光辐射的感测膜，设置在衬底和感测膜之间的集电极，以及限定在感测膜和集电极之间的空腔。 集电极收集由腔内的感应膜上的光辐射产生的电荷载体。 可以提供太阳能模块或面板，其包括在基板上排列成阵列的多个单元。

公开(公告)号：US07956517B1

公开(公告)日：2011-06-07

申请号：US12204713

申请日：2008-09-04

Applicant: Mehrnaz Motiee ,  Roger T. Howe ,  Emmanuel P. Quevy ,  David H. Bernstein

Inventor： Mehrnaz Motiee ,  Roger T. Howe ,  Emmanuel P. Quevy ,  David H. Bernstein

IPC: H01L23/34

CPC classification number: H03H3/0076 ,  B81B3/0072 ,  B81B2201/0271 ,  H03H9/02338 ,  H03H9/2431 ,  H03H9/2463 ,  H03H9/2473 ,  H03H2009/02496 ,  H03H2009/02503

Abstract: A MEMS structure having a temperature-compensated resonator member is described. The MEMS structure comprises an asymmetric stress inverter member coupled with a substrate. A resonator member is housed in the asymmetric stress inverter member and is suspended above the substrate. The asymmetric stress inverter member is used to alter the thermal coefficient of frequency of the resonator member by inducing a stress on the resonator member in response to a change in temperature.

Abstract translation: 描述了具有温度补偿谐振器元件的MEMS结构。 MEMS结构包括与衬底耦合的不对称应力逆变器部件。 谐振器构件容纳在不对称应力逆变器构件中并悬置在衬底上。 不对称应力逆变器构件用于通过响应于温度变化在谐振器构件上引起应力来改变谐振器构件的频率的热系数。

公开(公告)号：US20110109405A1

公开(公告)日：2011-05-12

申请号：US13007130

申请日：2011-01-14

Applicant: Leena Paivikki Buchwalter ,  Kevin Kok Chan ,  Timothy Joseph Dalton ,  Christopher Vincent Jahnes ,  Jennifer Louise Lund ,  Kevin Shawn Petrarca ,  James Louis Speidell ,  James Francis Ziegler

Inventor： Leena Paivikki Buchwalter ,  Kevin Kok Chan ,  Timothy Joseph Dalton ,  Christopher Vincent Jahnes ,  Jennifer Louise Lund ,  Kevin Shawn Petrarca ,  James Louis Speidell ,  James Francis Ziegler

IPC: H03H9/24

CPC classification number: B81C1/00246 ,  B81B2201/0271 ,  B81C1/0023 ,  B81C2203/0735 ,  H03H3/0072 ,  H03H9/2405

Abstract: A microelectromechanical system (MEMS) resonator or filter including a first conductive layer, one or more electrodes patterned in the first conductive layer which serve the function of signal input, signal output, or DC biasing, or some combination of these functions, an evacuated cavity, a resonating member comprised of a lower conductive layer and an upper structural layer, a first air gap between the resonating member and one or more of the electrodes, an upper membrane covering the cavity, and a second air gap between the resonating member and the upper membrane.

Abstract translation: 一种微机电系统（MEMS）谐振器或滤波器，其包括第一导电层，在第一导电层中图案化的一个或多个电极，其用于信号输入，信号输出或DC偏置的功能，或这些功能的某些组合;抽真空腔 ，由下导电层和上结构层构成的谐振构件，在谐振构件和一个或多个电极之间的第一气隙，覆盖空腔的上膜，以及谐振构件和第二气隙之间的第二气隙 上膜。

公开(公告)号：US07907025B2

公开(公告)日：2011-03-15

申请号：US12017186

申请日：2008-01-21

Applicant: Akinori Hashimura

Inventor： Akinori Hashimura

IPC: G04C3/10

CPC classification number: B81C1/00142 ,  B81B2201/0271

Abstract: An electromechanical resonator includes a resonator portion which includes a fixed electrode and an oscillator formed separately from the fixed electrode with a gap. The gap has a first gap region and a second gap region which are arranged in a thickness direction of the fixed electrode. The first gap region is different in width from the second gap region.

Abstract translation: 机电谐振器包括谐振器部分，其包括固定电极和与具有间隙的固定电极分开形成的振荡器。 间隙具有沿固定电极的厚度方向排列的第一间隙区域和第二间隙区域。 第一间隙区域的宽度与第二间隙区域不同。

公开(公告)号：US07876029B2

公开(公告)日：2011-01-25

申请号：US12361031

申请日：2009-01-28

Applicant: Kiyotaka Matsugi

Inventor： Kiyotaka Matsugi

IPC: H01L41/053 ,  H01L41/08

CPC classification number: H03H9/1021 ,  B81B7/0041 ,  B81B2201/0271 ,  B81C2203/0145 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  Y10T29/42 ,  H01L2924/00

Abstract: A piezoelectric device includes: a piezoelectric resonator element; a package storing the piezoelectric resonator element therein in a manner to mount the piezoelectric resonator element on a base portion thereof composed of at least three layers that are layered; and a through hole penetrating through the base portion. In the device, the through hole includes a first hole formed on a first layer which is positioned to face the piezoelectric resonator element among the three layers; a second hole formed on a second layer contacting with the first layer; a third hole formed larger than the second hole on a third layer contacting with the second layer; and a metal coat formed on an inner wall surface of the second hole, and a sealing part for sealing the package is formed with a sealant in at least the second hole.

Abstract translation: 压电装置包括：压电谐振元件; 以压电谐振元件的方式将压电谐振元件安装在由层叠的至少三层构成的基底部分上的封装; 以及穿过基部的通孔。 在该装置中，通孔包括形成在第一层上的第一孔，该第一层定位成面对三层之间的压电谐振元件; 形成在与第一层接触的第二层上的第二孔; 在与第二层接触的第三层上形成比第二孔大的第三孔; 以及形成在第二孔的内壁表面上的金属涂层和用于密封包装的密封部分至少在第二孔中形成有密封剂。

公开(公告)号：US20100301434A1

公开(公告)日：2010-12-02

申请号：US12853814

申请日：2010-08-10

Applicant: Florian Schoen ,  Wolfgang Raberg ,  Bernhard Winkler ,  Werner Weber

Inventor： Florian Schoen ,  Wolfgang Raberg ,  Bernhard Winkler ,  Werner Weber

IPC: H01L29/84 ,  H01L21/30

CPC classification number: B81C1/00182 ,  B81B2201/0271 ,  H01L41/0933 ,  Y10S977/732

Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.

Abstract translation: 公开了微机电系统（MEMS）装置及其制造方法。 在一个实施例中，MEMS器件包括第一半导体材料和设置在第一半导体材料中的至少一个沟槽，所述至少一个沟槽具有侧壁。 绝缘材料层设置在第一半导体材料中的至少一个沟槽的侧壁的上部上方，以及靠近侧壁的第一半导体材料的顶表面的一部分之上。 第二半导体材料或导电材料设置在至少一个沟槽内，并且至少在绝缘材料层的上方设置在靠近侧壁的第一半导体材料的顶表面的部分之上。

公开(公告)号：US07830074B2

公开(公告)日：2010-11-09

申请号：US11881461

申请日：2007-07-27

Applicant: Randall L. Kubena ,  David T. Chang

Inventor： Randall L. Kubena ,  David T. Chang

IPC: H01L41/09

CPC classification number: H04R17/10 ,  B81B2201/0271 ,  B81B2207/012 ,  B81C1/00253 ,  H04R31/00 ,  Y10T29/42

Abstract: An oscillator having a quartz resonator, and a base wafer containing active electronics, wherein the quartz resonator is bonded directly to the base wafer and subsequently hermetically capped.

Abstract translation: 具有石英谐振器的振荡器和包含有源电子器件的基底晶片，其中所述石英谐振器直接接合到所述基底晶片并随后密封。

公开(公告)号：US07825509B1

公开(公告)日：2010-11-02

申请号：US12543309

申请日：2009-08-18

Applicant: John Charles Baumhauer, Jr. ,  Alan Dean Michel ,  Joshua R. Barber ,  Christopher Todd Welsh ,  Jeffrey Phillip McAteer

Inventor： John Charles Baumhauer, Jr. ,  Alan Dean Michel ,  Joshua R. Barber ,  Christopher Todd Welsh ,  Jeffrey Phillip McAteer

IPC: H01L23/34

CPC classification number: H01L24/97 ,  B81B2201/0257 ,  B81B2201/0271 ,  B81C1/0023 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A surface mountable transducer package is provided, the design of which allows a thin package profile to be achieved. An encapsulation layer bonds to a surface of each of the terminal pads and encapsulates a portion of the transducer and at least a portion of the signal processing IC.

Abstract translation: 提供了可表面安装的换能器封装，其设计允许实现薄的封装形状。 封装层结合到每个端子焊盘的表面，并封装传感器的一部分和信号处理IC的至少一部分。