公开(公告)号：US11649383B2

公开(公告)日：2023-05-16

申请号：US16313622

申请日：2017-06-27

Applicant: UNIVERSITY OF LIMERICK

Inventor： Bin Zhao ,  Conor McCarthy

IPC: C09J11/04 ,  C09J163/00 ,  C09J9/02 ,  C08K3/04 ,  C08K3/22 ,  C08K7/06 ,  C08K7/24

CPC classification number: C09J11/04 ,  C09J9/02 ,  C09J163/00 ,  C08K3/042 ,  C08K3/22 ,  C08K7/06 ,  C08K7/24 ,  C08K2003/2275 ,  C08K2201/001 ,  C08K2201/005 ,  C09J2301/314 ,  C09J2301/412 ,  C09J2301/502 ,  C09J163/00 ,  C08K2003/2275 ,  C09J163/00 ,  C08K2201/001 ,  C09J163/00 ,  C08K7/24 ,  C09J163/00 ,  C08K3/042 ,  C08K2003/2275

Abstract: An adhesive composition degradable by dielectric heating. The adhesive composition comprises a thermosetting polymer and a material sensitive to dielectric heating. The material sensitive to dielectric heating is selected from any one or more of hollow nanospheres, nanotubes, nanorods, nanofibres, nanosheets, graphene, graphene derivatives, nano/micro hybrids and mixtures of two or more nanoscale particles. The adhesive composition may be particularly useful in the assembly and disassembly of parts, particularly parts which have complicated and/or blocked joined surfaces. A method of joining at least two parts of an article together and a method of disassembling at least two parts of an article, using the adhesive composition are also provided. The adhesive composition may provide a reworkable nano-composite adhesive. The adhesive composition may be used to reversibly bond a biomedical or dental implant to a part of a human or animal body.

公开(公告)号：US20230144307A1

公开(公告)日：2023-05-11

申请号：US17918217

申请日：2021-05-27

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Hiroki KUDOH ,  Miho ISHIHARA

IPC: C09K5/14 ,  C08J5/12 ,  C08K13/04 ,  H05K7/20 ,  F28F21/06 ,  B32B27/28 ,  B32B27/20 ,  B32B7/12 ,  B32B37/15 ,  B32B38/00 ,  B32B27/08

CPC classification number: C09K5/14 ,  C08J5/12 ,  C08K13/04 ,  H05K7/20445 ,  F28F21/065 ,  B32B27/283 ,  B32B27/20 ,  B32B7/12 ,  B32B37/15 ,  B32B38/0004 ,  B32B27/08 ,  C08K2201/001 ,  C08K2201/014 ,  C08K7/06

Abstract: The present invention is a thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, and a compressive load at a sheet area of 25.4 mm×25.4 mm when the thermally conductive sheet is 30% compressed from a direction perpendicular to an adhesion plane on which the plurality of unit layers are adhered to each other is 7.0 kgf or less. According to the present invention, it is possible to improve the thermal conductivity and enhance the softness of a thermally conductive sheet using a silicone resin as a matrix component and composed of a large number of unit layers laminated as compared with the conventional one.

公开(公告)号：US20230141757A1

公开(公告)日：2023-05-11

申请号：US17910567

申请日：2021-03-10

Applicant: SUMITOMO METAL MINING CO., LTD.

Inventor： Hiroshi Kobayashi ,  Tatsuo Kibe ,  Satoshi Kashiwaya

IPC: C08J5/18 ,  C08K3/22

CPC classification number: C08J5/18 ,  C08K3/22 ,  C08J2300/22 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005

Abstract: Provided is a thermally conductive composition that can easily be shaped into a sheet or the like, and is capable of effectively suppressing pump out. Specifically provided is a thermally conductive composition that includes a base oil composition and an inorganic powder filler, wherein: the base oil composition contains a base oil, a thermoplastic resin that has a softening point of 50-150° C., and a thixotropic agent; the inorganic powder filler contains a first inorganic powder filler having an average particle size in the range of 10-100 µm, a second inorganic powder filler, and a third inorganic powder filler; and the thermoplastic resin is included at a proportion of 50-200 parts by mass and the thixotropic agent is included at a proportion of 1-10 parts by mass per 100 parts by mass of the base oil.

公开(公告)号：US20190206587A1

公开(公告)日：2019-07-04

申请号：US16325934

申请日：2017-08-30

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Shike Sou ,  Masahiro Itou ,  Shuujirou Sadanaga

IPC: H01B1/22 ,  H01B5/16 ,  C08L101/12 ,  C08K3/16 ,  C09J9/02 ,  H01R11/01

CPC classification number: H01B1/22 ,  C08K3/16 ,  C08K2201/001 ,  C08L101/12 ,  C09J9/02 ,  H01B1/00 ,  H01B1/02 ,  H01B5/16 ,  H01R11/01

Abstract: The present invention provides a conductive material in which, even when the conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, yellowing of the conductive material can be sufficiently suppressed during heating. The conductive material according to the present invention contains a plurality of conductive particles having solder at an outer surface portion of a conductive portion, a curable compound, and a boron trifluoride complex.

公开(公告)号：US20190198878A1

公开(公告)日：2019-06-27

申请号：US16331669

申请日：2017-09-08

Applicant: ZEON CORPORATION

Inventor： Koji ANNAKA ,  Takuya ISHII

IPC: H01M4/62 ,  H01M4/525 ,  H01M4/505 ,  H01M10/0525 ,  C08F220/48 ,  C08K3/22 ,  C08K3/04 ,  C08K7/06

CPC classification number: H01M4/622 ,  C08F220/48 ,  C08F2800/20 ,  C08K3/04 ,  C08K3/22 ,  C08K7/06 ,  C08K2003/2293 ,  C08K2201/001 ,  H01M4/131 ,  H01M4/1391 ,  H01M4/505 ,  H01M4/525 ,  H01M4/62 ,  H01M4/625 ,  H01M10/0525 ,  H01M10/0566 ,  H01M2004/028

Abstract: Provided is a slurry composition for a non-aqueous secondary battery positive electrode that has excellent stability and enables formation of a positive electrode mixed material layer that causes a non-aqueous secondary battery to display excellent output characteristics. The slurry composition contains a positive electrode active material and a copolymer. The proportion constituted by nickel among transition metal in the positive electrode active material is at least 30.0 mol % and not more than 100.0 mol %. The copolymer includes a nitrile group-containing monomer unit in a proportion of at least 70.0 mass % and not more than 96.0 mass % and a basic group-containing monomer unit in a proportion of at least 0.1 mass % and not more than 5.0 mass %.

公开(公告)号：US20190194518A1

公开(公告)日：2019-06-27

申请号：US16330265

申请日：2017-09-08

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Melvina Leolukman ,  Appuswamy Devasenapathi ,  Arokiaraj Jesudoss ,  HongQian Bao

IPC: C09K5/14 ,  C09D183/08 ,  C09D7/61 ,  C08K3/04 ,  C08K3/28 ,  C08K3/38

CPC classification number: C09K5/14 ,  C01B21/0632 ,  C01B21/064 ,  C01B21/0648 ,  C01B21/072 ,  C01B21/0728 ,  C01B32/20 ,  C01B35/146 ,  C08G77/14 ,  C08G77/28 ,  C08K3/04 ,  C08K3/28 ,  C08K3/38 ,  C08K2003/385 ,  C08K2201/001 ,  C09D7/61 ,  C09D183/06 ,  C09D183/08

Abstract: The present invention relates to a composite material for use as a thermal interface material between a heat source and a heat sink. The present invention also relates to the method of synthesizing such a composite material. The composite material has high thermal conductivity, low thermal resistance and functions as an adhesive.

公开(公告)号：US20190092924A1

公开(公告)日：2019-03-28

申请号：US15843154

申请日：2017-12-15

Applicant: Hyundai Motor Company ,  Kia Motors Corporation ,  Hanwha Compound

Inventor： Seung Woo Choi ,  Min Jae Kim ,  Jong Sung Park ,  Byoung Chul Park ,  Jin Soo Han

IPC: C08K7/06 ,  C08K3/04 ,  C08K9/08 ,  H05K9/00

CPC classification number: C08K7/06 ,  C08K3/04 ,  C08K3/041 ,  C08K9/08 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/004 ,  C08K2201/005 ,  C08K2201/006 ,  C08K2201/011 ,  C08K2201/014 ,  C08K2201/016 ,  H01B1/24 ,  H02G3/081 ,  H05K9/0083 ,  H05K9/009

Abstract: Provided herein is a thermoplastic composite resin composition for shielding electromagnetic waves that may exhibit excellent mechanical properties and superior electromagnetic wave shielding performance without including a metal material.

公开(公告)号：US20190023929A1

公开(公告)日：2019-01-24

申请号：US16067001

申请日：2017-01-02

Applicant: UNIVERSIDADE DO MINHO ,  DYNASOL ELASTOMEROS S.A.

Inventor： Senen LANCEROS MENDEZ ,  Pedro Filipe RIBEIRO DA COSTA ,  Juliana Alice FERREIRA OLIVEIRA ,  Bruna FERREIRA GONÇALVES ,  Sergio CORONA GALVÀN

IPC: C09D11/52 ,  C09D11/106 ,  C09D11/033 ,  G01L1/18 ,  G01B7/16

CPC classification number: C09D11/52 ,  C08K3/041 ,  C08K3/042 ,  C08K3/046 ,  C08K3/08 ,  C08K5/41 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2201/001 ,  C08K2201/011 ,  C08L71/02 ,  C09D11/033 ,  C09D11/037 ,  C09D11/106 ,  G01B7/16 ,  G01B7/20 ,  G01L1/18

Abstract: The present disclosure relates to a piezoresistive ink composition for sensors production. This ink, change linearly their electrical resistivity with an applied deformation and can easily recover when the external applied stress is released. The composition comprises flexible polymers as thermoplastic elastomers from the styrene-butadiene-styrene family (SBS, SEBS or others), nanostructures of carbon or metal, polar solvents and dispersive agents. With this ink, the user can print the sensor with any desired geometry and use different printing techniques, including drop casting, spray, screen and inkjet printing.

公开(公告)号：US20190016888A1

公开(公告)日：2019-01-17

申请号：US16066764

申请日：2016-11-17

Applicant: LOTTE ADVANCED MATERIALS CO., LTD.

Inventor： Won Young CHOI ,  Doo Young KIM ,  Kyun Ha BAN ,  Chang Min HONG

IPC: C08L77/06 ,  C08L71/12 ,  C08L77/02 ,  C08L25/06 ,  C08L23/02 ,  C08K5/092 ,  C08K3/013 ,  C08J3/00

CPC classification number: C08L77/06 ,  C08J3/005 ,  C08J3/201 ,  C08J3/203 ,  C08J2377/06 ,  C08J2425/04 ,  C08J2471/12 ,  C08K3/013 ,  C08K3/04 ,  C08K5/005 ,  C08K5/092 ,  C08K5/13 ,  C08K5/20 ,  C08K7/06 ,  C08K2201/001 ,  C08L23/02 ,  C08L25/06 ,  C08L53/025 ,  C08L71/12 ,  C08L77/02 ,  C08L71/00 ,  C08L25/04 ,  C08K3/041

Abstract: The present invention relates to a polyamide/polyphenylene ether resin composition containing: a base resin comprising polyphenylene ether, a polyamide and an impact modifier; a compatibilizer; and a polyamine, and to: a polyamide/polyphenylene ether resin composition having a notched Izod impact strength of about 12 kJ/m2 or more when measured at 23° C. according to the ISO 180 standard, and a number of checkerboard lattices, in which peeling off occurs, being about 5% or less of the total number of checkerboard lattices in a 1 mm-gap checkerboard pattern test for testing adhesion to acrylic paints and a melamine-based paints according to the JIS K5600-5-6 standard; and a preparation method therefor.

公开(公告)号：US20180363361A1

公开(公告)日：2018-12-20

申请号：US15779973

申请日：2016-11-29

Applicant: Corning Incorporated

Inventor： Michael Paul HECKMAN ,  Linda Frances REYNOLDS-HEFFER ,  Wageesha SENARATNE

IPC: E06B3/663 ,  C03C17/00 ,  C03C17/22 ,  C03C23/00 ,  C09D7/61 ,  C09D1/02 ,  C09D183/04 ,  C09D5/00 ,  C09D7/20 ,  C09K5/14

CPC classification number: E06B3/663 ,  C03B23/245 ,  C03C17/007 ,  C03C17/009 ,  C03C17/22 ,  C03C23/002 ,  C03C23/0025 ,  C03C27/10 ,  C03C2217/28 ,  C03C2217/445 ,  C03C2217/47 ,  C03C2217/475 ,  C04B28/26 ,  C04B2111/00362 ,  C04B2111/00482 ,  C08K3/30 ,  C08K11/00 ,  C08K13/08 ,  C08K2003/265 ,  C08K2003/3009 ,  C08K2003/343 ,  C08K2201/001 ,  C09D1/02 ,  C09D5/00 ,  C09D7/20 ,  C09D7/61 ,  C09D183/04 ,  C09K5/14 ,  E06B3/6612 ,  E06B3/66304 ,  E06B3/66333 ,  E06B3/673 ,  E06B2003/66338 ,  Y02W30/97 ,  C04B14/043 ,  C04B14/20 ,  C04B14/28 ,  C04B18/245 ,  C04B22/14 ,  C04B24/02 ,  C04B24/42 ,  C04B2103/40

Abstract: A window with low frictive compositions and methods of making the same. The low frictive composition is applied to top portion of at least one glass bump contacting an opposing pane in a window. The low frictive composition may include an inorganic powder and a binder. The inorganic powder includes disulfide, molybdenum disulfide, tungsten diselenide, and molybdenum diselenide. The binder includes silsesquioxanes and alkali silicates.