Nanospike hybrid carbon black
    78.
    发明授权
    Nanospike hybrid carbon black 有权
    纳米磷杂交炭黑

    公开(公告)号:US09550875B2

    公开(公告)日:2017-01-24

    申请号:US14741938

    申请日:2015-06-17

    Abstract: A nanospike hybrid carbon black product includes a plurality of carbon black aggregates. Each of the carbon black aggregates has a surface with a plurality of carbon nanospike formed thereon. The carbon nanospikes may each have a length between about 5 nm and 100 nm, and a width between about 5 nm and about 50 nm. A method for manufacturing the nanospike hybrid carbon black product includes the steps of injecting a primary carbon feedstock into a carbon black reactor, and combusting the carbon feedstock under a predetermined high temperature in the carbon black reactor to form carbon black aggregates. A catalyst is then deposited on surfaces of the carbon black aggregates. A secondary carbon feedstock is injected into the carbon black reactor, and reacted with the catalyst to grow carbon nanospikes on the surfaces of the carbon black aggregates.

    Abstract translation: 纳米级混合炭黑产品包括多个炭黑聚集体。 每个炭黑聚集体具有在其上形成有多个碳纳摩丝的表面。 碳纳米尺度可以各自具有在约5nm和100nm之间的长度以及约5nm和约50nm之间的宽度。 制备纳米级杂化炭黑产品的方法包括以下步骤:将一次碳原料注入炭黑反应器中,并在碳黑反应器中将预定高温下的碳原料燃烧以形成炭黑聚集体。 然后将催化剂沉积在炭​​黑聚集体的表面上。 将二次碳原料注入炭黑反应器中,并与催化剂反应生长炭黑聚集体表面上的碳纳米尺度。

    Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate
    80.
    发明授权
    Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate 有权
    氮化硼/树脂复合电路板,以及包含氮化硼/树脂复合材料与散热板一体化的电路板

    公开(公告)号:US09516741B2

    公开(公告)日:2016-12-06

    申请号:US14911707

    申请日:2014-08-12

    Abstract: A boron nitride/resin composite circuit board having high heat dissipation characteristics and high reliability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5 mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50 μm, and 70 to 15 volume % of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150° C. (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150° C. (CTE2) (CTE1/CTE2) is 0.5 to 2.0.

    Abstract translation: 提供具有高散热特性和高可靠性的氮化硼/树脂复合电路板。 一种氮化硼/树脂复合电路板,包括:板厚为0.2〜1.5mm的板状树脂浸渍氮化硼烧结体,含有30〜85体积%的板状树脂浸渍氮化硼烧结体 具有三维结合的氮化硼颗粒的氮化硼烧结体,平均长径为5〜50μm的氮化硼颗粒和70〜15体积%的树脂; 以及附着在板状树脂浸渍氮化硼烧结体的两个主平面上的金属电路,金属电路为铜或铝,其中:树脂浸渍硼的平面方向的线性热膨胀系数的比例 40℃〜150℃(CTE1)的金属电路的线性热膨胀系数(CTE2)(CTE1 / CTE2)为40〜150℃。

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