Abstract:
An electronic device including a substrate and an optoelectronic device package is provided. The optoelectronic device package includes a light source, an image sensor and a plurality of connecting pins. The light source is configured to emit light toward a direction of a bottom surface of the optoelectronic device package. The image sensor is configured to receive reflected light from the direction of the bottom surface. The connecting pins are bended toward an opposite direction of the direction of the bottom surface and electrically connected to the substrate thereby increasing a discharge path of the electrostatic discharge.
Abstract:
A photoelectric conversion device includes a circuit board, light-emitting modules, light-receiving modules, an optical coupling module, and a protecting member. The light-emitting modules and the light-receiving modules are mounted on the circuit board. The optical coupling module is mounted on the circuit board, and includes first and second optical surfaces, a reflection surface, first converging lenses formed on the first optical surface and corresponding to the light-emitting modules and the light-receiving modules, and second converging lenses formed on the second optical surface and corresponding to the first converging lenses. The protecting member is mounted on the circuit board to shield the optical coupling module, the light-emitting modules, and the light-receiving modules, and only exposes the second converging lenses.
Abstract:
A photoreception device includes: a substrate; a photoreceptor element including a photoreceptor portion upon an upper surface thereof and a lower surface thereof is mounted upon the substrate; and an insulating resin mass that contains a flat upper surface and an opening that exposes the photoreceptor portion of the photoreceptor element, that is formed upon the substrate to be thicker than thickness of the photoreceptor element, and that adheres closely against side surfaces of the photoreceptor element, the side surfaces surrounding the photoreceptor element. The insulating resin mass contains a step portion that is provided to a height between the flat upper surface thereof and the upper surface of the photoreceptor portion; and the step portion extends parallel to at least one pair of mutually opposed side surfaces of the photoreceptor element, at a periphery of the opening.
Abstract:
An improved EMI shielded detection system. The disclosed system may include features configured to increase radio wave and microwave absorbance while retaining significant transparency at visible and/or infrared wavelengths, thus increasing EMI shielding efficiency. This may be accomplished through the use of a conductive mesh having appropriately chosen dimensions and spacing, and embedded in a transparent medium. To minimize the impact of the mesh on the effective aperture of the medium, the strands of the mesh may be made relatively narrow, and to provide sufficient shielding despite the narrow strand width, the mesh may be embedded relatively deeply in the medium.
Abstract:
Methods for generating a customized spectral profile, which can be used to generate a corresponding filter, lamp or other type of illuminant. A trial spectrum can be generated. A reference spectrum can be determined or otherwise obtained. A SOURCE spectrum can be determined or otherwise obtained. One or more optical indices can be calculated using the trial spectrum and one or more of the optical indices are optimized by varying the trial spectrum to generate the customized spectral profile. A radiation force parameter can be used to minimize unsafe build-up of light in spectral regions. Adaptations of color rendering parameters can be used in the optimization process. Smoothing parameters can be used to enable easier design of filter structures. A reflectance camera can be used to measure reflectance data at one or more pixels of a digital representation of an object to be illuminated.
Abstract:
Customized spectral profiles, and filters and illuminants having a customized spectral profile, optimized to reduce light in one or more wavelength regions for which one or more pigments are relatively more susceptible to perceptible changes in appearance.
Abstract:
An infrared detector includes a circuit block carrying an infrared sensor element and electronic components. The circuit block is composed of a dielectric resin layer and a first substrate formed with a circuit pattern and mounting the electronic components. The dielectric resin layer is formed in its top with a recess which defines around its periphery with a shoulder for supporting opposite ends of the infrared sensor. The first substrate is integrated to the lower end of the dielectric resin layer with at least one of the electronic components being molded into the dielectric resin layer to make the circuit block of a unified mold structure. Thus, a part or all of the electronic components are molded into the dielectric layer to realize the circuit block of a simple and low profile structure, while retaining an advantage of keeping the infrared sensor element sufficiently away from the electronic components and an associated electronic circuit, thereby assuring to give the infrared detector which is simple in construction, economical in cost, and reliable in the infrared detection.
Abstract:
A method and apparatus are provided for processing light from a light source. The method includes the steps of measuring a predetermined set of characteristics of the light source and detecting flicker when the predetermined set of characteristics exceed a corresponding flicker fusion threshold value.
Abstract:
A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially rectangular opening in a package. The supporting portions support an optical filter, disposed so as to cover the opening, at positions that are lower than an upper end of an inner peripheral wall defining the opening. While the optical filter is supported by the supporting portions as a result of inserting a portion of a surface side of the optical filter facing the supporting portions into the opening, the optical filter is secured to the package. The optical filter and the package are joined and secured, and electrically connected to each other through a conductive adhesive.
Abstract:
A testing device equipped with: a microchip having a receiver for a test fluid, a discharge lamp which emits light into the microchip test fluid receiver, a light source housing in which the discharge lamp is located, and an arithmetic calculation mechanism, which calculates the concentration of the component to be detected, based on the intensity of the light emitted from the test fluid container unit. To reduce the size of the device and to shield the arithmetic calculation mechanism from electromagnetic waves generated around the light source, the light source housing is equipped with shielding connected to the ground on the outside of the light source housing made of insulating material. The light source housing is positioned within an enclosure of the testing device holding the microchip and containing the arithmetic calculation mechanism, analysis output device(s), etc.