公开(公告)号：US20140339735A1

公开(公告)日：2014-11-20

申请号：US14449661

申请日：2014-08-01

Applicant: SCIVAX CORPORATION ,  MARUZEN PETROCHEMICAL CO., LTD.

Inventor： Takemori Toshifumi ,  Yoshiaki Takaya ,  Takahito Mita ,  Tetsuya Iizuka ,  Yuji Hashima ,  Takahisa Kusuura ,  Mitsuru Fujii ,  Takuji Taguchi ,  Anupam Mitra

IPC: B29C59/00 ,  B29C59/02

CPC classification number: B29C59/005 ,  B29C59/026 ,  B29K2045/00 ,  C08F232/08 ,  H05K1/032 ,  H05K3/0014 ,  H05K3/107 ,  H05K2201/0158 ,  H05K2203/0108

Abstract: A cyclic-olefin-based thermoplastic resin for thermal imprint to be used in the production of a sheet or a film which contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]

Abstract translation: 一种用于热压印的环烯烃类热塑性树脂，用于制造在主链中包含由以下化学式1或以下化学式2表示的至少一种骨架的片材或膜。 玻璃化转变温度Tg（℃）和MFR在260℃下的值（[M]）满足下列等式1，[M] <30。 热压印特性（转印性，脱模特性等）优异，生产率（生产率）提高​​。

公开(公告)号：US20140151095A1

公开(公告)日：2014-06-05

申请号：US14097036

申请日：2013-12-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Hyeon Cho ,  Tae Hong Min ,  Seung Yeop Kook ,  Jung Han Lee ,  Hye Jin Kim

IPC: H05K1/03 ,  H05K3/42 ,  H05K3/28

CPC classification number: H05K1/0306 ,  H05K1/03 ,  H05K3/108 ,  H05K3/426 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09563 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet.

Abstract translation: 这里公开了一种印刷电路板，包括：复合片，其包括绝缘材料和与绝缘材料接合的玻璃板; 以及形成在复合片上的电路层。

公开(公告)号：US08501870B2

公开(公告)日：2013-08-06

申请号：US13615167

申请日：2012-09-13

Applicant: Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

Inventor： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

IPC: C08F8/00

CPC classification number: H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract translation: 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US08404769B2

公开(公告)日：2013-03-26

申请号：US12596165

申请日：2008-04-25

Applicant: Daisuke Fujimoto ,  Yasuyuki Mizuno ,  Kazutoshi Danjoubara ,  Hikari Murai

Inventor： Daisuke Fujimoto ,  Yasuyuki Mizuno ,  Kazutoshi Danjoubara ,  Hikari Murai

IPC: C08K3/26 ,  B32B15/08

CPC classification number: H05K1/0353 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2274/00 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/726 ,  B32B2457/08 ,  C08J3/246 ,  C08J5/24 ,  C08J2387/00 ,  C08K3/013 ,  C08L9/00 ,  C08L15/00 ,  C08L21/00 ,  C08L47/00 ,  C08L71/00 ,  C08L71/12 ,  H05K1/024 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T428/31696 ,  C08L2666/14

Abstract: Provided is a process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process includes the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer; and a resin varnish, a prepreg, and a metal-clad laminate provided using the same.

Abstract translation: 本发明提供了含有未固化的半IPN复合材料，无机填料和饱和热塑性弹性体的热固性树脂组合物的热固性树脂清漆的制造方法，其中，该方法包括以下步骤：（i）预反应（B ）丁二烯聚合物，其分子中含有其侧链中具有1,2-乙烯基的1,2-丁二烯单元的40％以上且未进行化学改性，（C）交联剂， 在（A）聚苯醚存在下，得到未固化的半IPN复合材料的聚苯醚改性丁二烯预聚物; （ii）将（D）无机填料和（E）饱和热塑性弹性体混合在一起得到混合物; 和（iii）将所得混合物和聚苯醚改性的丁二烯预聚物混合在一起; 以及使用该树脂清漆，预浸料坯和覆金属层压板。

公开(公告)号：US08394731B2

公开(公告)日：2013-03-12

申请号：US12447653

申请日：2007-11-07

Applicant: Akira Sato ,  Akira Fujinoki ,  Hiroyuki Nishimura ,  Tsukasa Sakaguchi

Inventor： Akira Sato ,  Akira Fujinoki ,  Hiroyuki Nishimura ,  Tsukasa Sakaguchi

IPC: D03D15/00

CPC classification number: H05K1/0366 ,  D02G3/04 ,  D02G3/18 ,  D03D1/0082 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/0011 ,  D03D15/0016 ,  D03D15/0027 ,  D10B2101/06 ,  D10B2201/00 ,  D10B2321/02 ,  D10B2321/021 ,  D10B2321/022 ,  D10B2321/121 ,  H05K1/024 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/029 ,  Y10T442/30 ,  Y10T442/313 ,  Y10T442/3138 ,  Y10T442/3976

Abstract: Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 μm or more and 16 μm or less, and the composite woven fabric has a thickness of 200 μm or less.

Abstract translation: 公开了实现高速，高频半导体器件所需的印刷线路板的目的的印刷线路板，即具有低介电常数，低介电损耗角正切和低线膨胀系数的印刷线路板。 还公开了适合用作这种印刷线路板的基材的复合机织织物。 具体公开了含有石英玻璃纤维和聚烯烃纤维的复合机织织物，其中石英玻璃纤维与复合机织织物的比率设定在10体积％以上且90体积％以下。 优选石英玻璃纤维的长丝直径为3μm以上且16μm以下，复合织物的厚度为200μm以下。

公开(公告)号：US20130056906A1

公开(公告)日：2013-03-07

申请号：US13666339

申请日：2012-11-01

Applicant: SCIVAX CORPORATION ,  MARUZEN PETROCHEMICAL CO., LTD.

Inventor： Takemori Toshifumi ,  Yoshiaki Takaya ,  Takahito Mita ,  Tetsuya Iizuka ,  Yuji Hashima ,  Takahisa Kusuura ,  Mitsuru Fujii ,  Takuji Taguchi ,  Anupam Mitra

IPC: B29C59/02

CPC classification number: B29C59/005 ,  B29C59/026 ,  B29K2045/00 ,  C08F232/08 ,  C08G61/06 ,  C08G61/08 ,  H05K1/032 ,  H05K3/0014 ,  H05K3/107 ,  H05K2201/0158 ,  H05K2203/0108

Abstract: A resin for thermal imprint include a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]>10. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved. Tg(° C.)

Abstract translation: 用于热压印的树脂包括在主链中含有由以下化学式1或以下化学式2表示的骨架中的至少一种的环状烯烃系热塑性树脂。 玻璃化转变温度Tg（℃）和MFR在260℃下的值（[M]）满足下列等式1，[M]> 10。 热压印特性（转印性，脱模特性等）优异，生产率（生产率）提高​​。 Tg（℃）<219×log [M] -104 [等式1]

公开(公告)号：US20120273257A1

公开(公告)日：2012-11-01

申请号：US13098394

申请日：2011-04-29

Applicant: CHAO-CHIEH CHU

Inventor： CHAO-CHIEH CHU

IPC: H05K1/09 ,  C23C14/28 ,  B05D5/12

CPC classification number: G06F3/044 ,  G06F2203/04103 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/0326

Abstract: A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of embedded conductive circuits embedded into the first coating layer and arranged to form a predetermined embedded circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger, any type of touch pen, or etc.) to touch.

Abstract translation: 施加到触摸面板的透明导电结构包括基板单元，第一涂覆单元，透明导电单元和第二涂覆单元。 基板单元包括透明基板。 第一涂布单元包括形成在透明基板的顶表面上的第一涂层。 透明导电单元包括形成在第一涂层的顶表面上的透明导电层。 透明导电层包括嵌入到第一涂层中并被布置成形成预定嵌入电路图案的多个嵌入式导电电路。 第二涂布单元包括形成在透明导电层的顶表面上的第二涂层。 第二涂层具有在其顶侧上形成的触摸表面，并且触摸表面允许外部对象（诸如用户的手指，任何类型的触摸笔等）触摸。

公开(公告)号：US20120214009A1

公开(公告)日：2012-08-23

申请号：US13463541

申请日：2012-05-03

Applicant: Yasuyuki MIZUNO ,  Daisuke FUJIMOTO ,  Kazutoshi DANJOBARA ,  Hikari MURAI

Inventor： Yasuyuki MIZUNO ,  Daisuke FUJIMOTO ,  Kazutoshi DANJOBARA ,  Hikari MURAI

IPC: B32B15/08 ,  B32B37/10 ,  B05D5/12 ,  C08G81/02 ,  C09D109/00

CPC classification number: H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract translation: 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有1,2-乙烯基和（C）交联剂，处于相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US08138263B2

公开(公告)日：2012-03-20

申请号：US12344484

申请日：2008-12-27

Applicant: Shur-Fen Liu ,  Meng-Huei Chen ,  Man-Chun Yu

Inventor： Shur-Fen Liu ,  Meng-Huei Chen ,  Man-Chun Yu

IPC: C08K3/22 ,  C08L101/00 ,  H01B3/30

CPC classification number: C08K3/22 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/0209 ,  C08L21/00

Abstract: A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 μm, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.

Abstract translation: 提供了用于制造柔性基底的柔性低介电损耗组合物。 该组合物包括：SrTiO 3和/或Ba（Sr）TiO 3陶瓷颗粒，其特征尺寸在30nm和2μm之间，其量为组合物重量的20-80％; 至少一种柔性大分子的量为组合物重量的1.0-50％，其中大分子具有羟基，羧基，烯丙基，氨基或链脂族环氧基的官能团; 和热固性有机树脂。

公开(公告)号：US08097545B2

公开(公告)日：2012-01-17

申请号：US11867091

申请日：2007-10-04

Applicant: Satoru Amou ,  Haruo Akahoshi ,  Hiroshi Shimizu ,  Akinori Hanawa

Inventor： Satoru Amou ,  Haruo Akahoshi ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC: B32B27/04 ,  B32B27/00

CPC classification number: B32B5/02 ,  B32B27/04 ,  C08F290/06 ,  C08K5/0025 ,  C08L53/02 ,  C08L53/025 ,  H05K1/032 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/31757 ,  Y10T442/2631 ,  Y10T442/2738 ,  C08L2666/02

Abstract: It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regions; and a multilayer printed wiring board using the same.This invention relates to a polybutadiene resin composition, comprising: a crosslinking component (A) comprising repeating units represented by the following formula (1) and having a number average molecular weight of 1000 to 20000; a radical polymerization initiator (B), the one-minute half-life temperature of which is 80° C. to 140° C.; and a radical polymerization initiator (C), the one-minute half-life temperature of which is 170° C. to 230° C.; wherein 3 to 10 parts by weight of the component (B) and 5 to 15 parts by weight of the component (C) are contained relative to 100 parts by weight of the component (A). The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same.

Abstract translation: 本发明的目的是获得：通过控制1,2-聚丁二烯树脂组合物的相分离而不会在高频区域表现出的介电性能降低，从而加工性，介电特性，耐热性和粘合性优异; 和使用其的多层印刷线路板。 本发明涉及一种聚丁二烯树脂组合物，其包含：交联组分（A），其包含由下式（1）表示的数均分子量为1000至20000的重复单元; 自由基聚合引发剂（B），其一分钟半衰期温度为80℃至140℃; 和自由基聚合引发剂（C），其一分钟的半衰期温度为170℃至230℃; 相对于100重量份的成分（A），含有3〜10重量份的成分（B）和5〜15重量份的成分（C）。 本发明还涉及使用其制造的预浸料坯，层压板和印刷线路板。