公开(公告)号：US20020100610A1

公开(公告)日：2002-08-01

申请号：US10040804

申请日：2001-11-08

Inventor： Masao Yasuda ,  Masato Sumikawa

IPC: H01L029/43 ,  H05K001/16

CPC classification number: H01L24/10 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/013

Abstract: An electronic component having an electrode structure to increase an allowance positional deviation in a mounting process as well as a method and a structure for mounting a semiconductor device are provided. The semiconductor device includes, on electrodes, connection materials connecting the semiconductor device and a substrate. The connection materials include a composite connection material formed of a core and a conductor covering the core, the core having an a low modulus of elasticity at room temperature smaller than that of the conductor at room temperature, and a single-layer connection material formed of a conductor.

Abstract translation: 提供了具有用于增加安装过程中的容许位置偏差的电极结构的电子部件以及用于安装半导体器件的方法和结构。 半导体器件在电极上包括连接半导体器件和衬底的连接材料。 连接材料包括由芯体和覆盖芯部的导体形成的复合连接材料，该芯在室温下的室温下的弹性模量低于室温下的导体的低弹性模量;以及单层连接材料，由 指挥

公开(公告)号：US20020067457A1

公开(公告)日：2002-06-06

申请号：US09988408

申请日：2001-11-19

Inventor： Akira Mase

IPC: G02F001/1339

CPC classification number: G02F1/13452 ,  G02F2203/69 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/148 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

公开(公告)号：US20020058449A1

公开(公告)日：2002-05-16

申请号：US09793911

申请日：2001-02-28

Inventor： Vedagiri Velpari ,  Kami Lammon-Hilinski ,  Ernest L. Lawton ,  Bruce E. Novich ,  William B. Rice ,  Walter J. Robertson ,  Xiang Wu

IPC: B32B005/02 ,  B32B027/04 ,  B32B027/12

CPC classification number: H05K1/0366 ,  B32B27/12 ,  C03C25/47 ,  H05K2201/0166 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/029 ,  H05K2203/127 ,  Y10T442/20 ,  Y10T442/2311 ,  Y10T442/2402 ,  Y10T442/30

Abstract: At least partially clad laminates comprising: (a) a cladding material; (b) a matrix material; and (c) at least one non-degreased fabric comprising at least one strand comprising a plurality of fibers, wherein at least a portion of the at least one non-degreased fabric comprises a coating which is compatible with the matrix material, and wherein at least a portion of the at least partially clad laminate has a roughness factor less than 8 microns using a one ounce clad, measured in either the warp direction or the fill direction of the at least one non-degreased. Electronic supports and electronic circuit boards comprising at least one at least partially clad laminate.

Abstract translation: 至少部分包覆的层压板，包括：（a）包层材料; （b）基质材料; 和（c）至少一种非脱脂织物，其包含至少一条包含多根纤维的链，其中所述至少一种非脱脂织物的至少一部分包含与所述基质材料相容的涂层，并且其中在 所述至少部分覆盖的层压板的至少一部分具有小于8微米的粗糙度因子，使用在至少一种未脱脂的经向或填充方向上测量的一盎司包层。 包括至少一个至少部分覆盖的层压板的电子支架和电子电路板。

公开(公告)号：US20020051684A1

公开(公告)日：2002-05-02

申请号：US09944125

申请日：2001-09-04

Inventor： Mitsuo Eziri ,  Shinya Komatsu ,  Masaru Taguchi ,  Norio Nagai

IPC: B23B035/00

CPC classification number: H05K3/0047 ,  B23Q11/10 ,  H05K2201/0212 ,  H05K2203/0152 ,  H05K2203/0214 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K2203/127 ,  Y10T408/03 ,  Y10T408/561

Abstract: A lubricant sheet for making a hole used for a printed circuit board, comprising an organic substance layer having a thickness of 0.02 to 3.0 mm and formed of a mixture (a) or a mixture (b) and a metal foil having a thickness of 0.05 to 0.5 mm, said organic substance layer being formed on one surface of said metal foil, said mixture (a) being a mixture containing polyether ester (I), a solid water-soluble lubricant (II) and polyethylene glycol (III) having a number average molecular weight of 200 to 600, and said mixture (b) being a mixture containing said polyether ester (I), said solid water-soluble lubricant (II) and a liquid water-soluble lubricant (IV), and a method of making a hole which uses the lubricant sheet.

Abstract translation: 一种用于制造用于印刷电路板的孔的润滑剂片，包括厚度为0.02至3.0mm并由混合物（a）或混合物（b）形成的有机物质层和厚度为0.05的金属箔 所述有机物质层形成在所述金属箔的一个表面上，所述混合物（a）是含有聚醚酯（I），固体水溶性润滑剂（II）和聚乙二醇（III）的混合物， 数均分子量为200〜600，所述混合物（b）为含有聚醚酯（I），固体水溶性润滑剂（II）和液态水溶性润滑剂（IV）的混合物， 制造使用润滑剂片的孔。

公开(公告)号：US06311888B1

公开(公告)日：2001-11-06

申请号：US09544456

申请日：2000-04-07

Applicant: Yoshitsugu Funada ,  Rieka Ohuchi

Inventor： Yoshitsugu Funada ,  Rieka Ohuchi

IPC: B23K3102

CPC classification number: B32B27/08 ,  B32B27/20 ,  B32B2250/40 ,  H01L24/29 ,  H01L24/45 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29083 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0379 ,  H05K2201/10674 ,  H05K2203/1189 ,  Y10T428/24942 ,  Y10T428/259 ,  Y10T428/31855 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/0503 ,  H01L2924/0504 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/48

Abstract: This invention provides a resin film preferably used for mounting a semiconductor chip on a substrate through flip-chip connection, and a method based on the use of such a resin film. The resin film has a laminated B/A/B structure where a first resin layer (A) having inorganic particles dispersed in an insulating resin is sandwiched by second and third resin layers (B) having no inorganic particles in their insulating resins. The method for connecting electronic parts comprises the steps of forming metal projections (bumps) on a plurality of connection terminals prepared on the surface of a first electronic part; preliminarily pressing the resin film against a plurality of connection terminal surfaces of the other electronic part; applying pressure onto the connection parts in the presence of heat after having properly aligned the metal projections of the first electronic part with the corresponding connection terminals of the other electronic part, thereby establishing electric connection and at the same time mechanical contact between the two electronic parts through the resin film melt and solidifying.

公开(公告)号：US06291374B1

公开(公告)日：2001-09-18

申请号：US09531947

申请日：2000-03-21

Applicant: Vincent R. Landi

Inventor： Vincent R. Landi

IPC: D03D300

CPC classification number: C08J5/24 ,  B32B15/08 ,  C08J2309/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  C08L23/16 ,  C08L53/00 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/2934 ,  Y10T442/2992 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3455 ,  C08L2666/06 ,  C08L2666/24

Abstract: An electrical substrate material is presented comprising a resin matrix which includes a thermosetting polybutadiene or polyisoprene resin, an ethylene propylene rubber, and optionally a thermoplastic unsaturated butadiene- or isoprene-containing polymer; a particulate filler, a flame retardant additive, a curing agent, and a woven or unwoven fabric. The presence of the ethylene propylene rubber enhances the heat age properties of the substrate material, particularly the dielectric strength and the mechanical properties, while other electrical, chemical, and mechanical properties of the material are not adversely effected.

Abstract translation: 提供一种电气基材材料，其包括包含热固性聚丁二烯或聚异戊二烯树脂的树脂基质，乙丙橡胶和任选的含热塑性不饱和丁二烯或含异戊二烯的聚合物; 颗粒状填料，阻燃添加剂，固化剂，织造或无纺织物。 乙烯丙烯橡胶的存在增强了基材材料的热老化性能，特别是介电强度和机械性能，而材料的其它电学，化学和机械性能也不会受到不利影响。

公开(公告)号：US06207265B1

公开(公告)日：2001-03-27

申请号：US09405723

申请日：1999-09-24

Applicant: John W. Holdren, II ,  Eric Martini

Inventor： John W. Holdren, II ,  Eric Martini

IPC: B32B514

CPC classification number: H05K3/0076 ,  H05K3/3452 ,  H05K2201/0212 ,  H05K2203/0769 ,  H05K2203/0786 ,  Y10S428/901 ,  Y10T428/249959 ,  Y10T428/249991 ,  Y10T428/31978 ,  Y10T428/31982 ,  Y10T428/31989

Abstract: A water soluble, non-ionic masking agent is used in the manufacture of printed circuit boards. The masking agent masks portions of the circuit board to prevent adhesion of solder, flux and the like. The masking agent includes a water soluble non-ionic binder resin, a cellulosic non-ionic filler, a non-ionic surfactant, at least one non-ionic associative thickener, and deionized water. The masking agent material is readily removed from the circuit board after manufacture and does not render further wash water processing ineffective. The masking agent is non-ionic, and thus does not agglomerate or clump downstream ion-exchange or filtration media.

Abstract translation: 在印刷电路板的制造中使用水溶性非离子掩蔽剂。 掩蔽剂掩蔽电路板的部分以防止焊料，焊剂等的粘附。 掩蔽剂包括水溶性非离子粘合剂树脂，纤维素非离子填料，非离子表面活性剂，至少一种非离子缔合增稠剂和去离子水。 掩蔽剂材料在制造后容易从电路板上除去，并且不会使得进一步的洗涤水处理无效。 掩蔽剂是非离子的，因此不会聚集或聚集下游的离子交换或过滤介质。

公开(公告)号：US06197425B1

公开(公告)日：2001-03-06

申请号：US09039485

申请日：1998-03-16

Applicant: Akio Sekimoto ,  Shinichi Yamada

Inventor： Akio Sekimoto ,  Shinichi Yamada

IPC: B32B1508

CPC classification number: H05K3/4661 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K2203/0796 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31522

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer. The curable resin composition comprises (A) epoxy resins and (B) an epoxy resin curing agent as essential components thereof and optionally contains a rubber component and a filler capable of being decomposed or dissolved by a coarsening agent. This composition contains in combination a bisphenol A type epoxy resin having an epoxy equivalent of not less than 400 and an epoxy resin having an epoxy equivalent of less then 400.

公开(公告)号：US6137164A

公开(公告)日：2000-10-24

申请号：US401568

申请日：1999-09-22

Applicant: Chee Klang Yew ,  Siu Waf Low ,  Min Yu Chan

Inventor： Chee Klang Yew ,  Siu Waf Low ,  Min Yu Chan

IPC: H01L23/498 ,  H01L25/065 ,  H05K3/34 ,  H01L23/02

CPC classification number: H01L23/49816 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/30107 ,  H05K2201/0212 ,  H05K2201/10234 ,  H05K2203/047 ,  H05K3/3463

Abstract: A thin, stacked face-to-face integrated circuit packaging structure includes a chips attached to both major surfaces of a rigid interposer, and interconnected by printed wiring traces and vias to external solder ball contacts attached to the interposer.

Abstract translation: 薄的堆叠的面对面的集成电路封装结构包括附接到刚性插入件的两个主表面的芯片，并且通过印刷的布线迹线和通孔连接到附接到插入件的外部焊球接触件。

公开(公告)号：US6010768A

公开(公告)日：2000-01-04

申请号：US854683

申请日：1997-05-12

Applicant: Toshihiko Yasue ,  Yasuji Hiramatsu ,  Hideki Yano ,  Yoshifumi Ishitani ,  Yoichiro Kawamura ,  Hideki Murase ,  Ayumi Suzuki ,  Masato Kawade ,  Motoo Asai

Inventor： Toshihiko Yasue ,  Yasuji Hiramatsu ,  Hideki Yano ,  Yoshifumi Ishitani ,  Yoichiro Kawamura ,  Hideki Murase ,  Ayumi Suzuki ,  Masato Kawade ,  Motoo Asai

IPC: H05K3/00 ,  H05K3/38 ,  H05K3/46 ,  B32B3/00

CPC classification number: H05K3/4661 ,  H05K3/0094 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773 ,  H05K3/382 ,  H05K3/384 ,  Y10S428/901 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/252

Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer, a lower conductor circuit layer and a resin insulating layer electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an layer made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer for electroless plating made from a heat-resistant resin as an upper layer, and if necessary, a resin is filled in a concave portion created between conductor insulating circuits of the lower layer so as to render the surface into the same plane as the surface of the conductor circuit.

Abstract translation: 提供一种具有优异的分辨率，层间绝缘性和耐冷热冲击性的多层印刷电路板，而不会在表面上形成不均匀性，并且即使树脂绝缘层的厚度薄，也降低剥离强度。 本发明提出了一种多层印刷电路板，包括上导体电路层，下导体电路层和电绝缘两个导体电路层的树脂绝缘层，其中树脂绝缘层是由由 耐热树脂难溶于作为下层的酸或氧化剂以及由耐热树脂作为上层制成的用于化学镀的粘合剂层，如果需要，树脂填充在导体绝缘 电路，以使表面进入与导体电路的表面相同的平面。