公开(公告)号：US20150208506A1

公开(公告)日：2015-07-23

申请号：US14420681

申请日：2012-08-10

Applicant: Igor Perez-Uria ,  Per Ferm ,  Benny Gustafson

Inventor： Igor Perez-Uria ,  Per Ferm ,  Benny Gustafson

IPC: H05K1/14 ,  H05K3/10 ,  H05K3/42 ,  H05K1/11

CPC classification number: H05K1/144 ,  H05K1/115 ,  H05K1/141 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3494 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4053 ,  H05K3/42 ,  H05K2201/0248 ,  H05K2201/0305 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10878 ,  H05K2201/10916 ,  H05K2203/0338 ,  H05K2203/0455 ,  H05K2203/1105 ,  Y10T29/49124

Abstract: The present invention relates to a printed circuit board arrangement and a method for forming an electrical connection at a printed circuit board. The printed circuit board arrangement comprises a printed circuit board having an electrical connection electrically connecting a first conductive layer on a first side of the printed circuit board and a second conductive layer on a second side of the printed circuit board. The electrical connection comprises a passage extending from an opening in one of the sides of the printed circuit board through the printed circuit board between the first and second layers. Electrically conducting material is formed on the walls of the passage and forms a first path electrically connecting the first conductive layer with the second conductive layer. At least one first ball is enclosed by the passage and forms part of a second electrical path between the first and second conductive layers of the printed circuit board, said second electrical path having a lower resistance than the first path.

Abstract translation: 本发明涉及印刷电路板装置和在印刷电路板上形成电连接的方法。 印刷电路板布置包括印刷电路板，其具有电连接印刷电路板的第一侧上的第一导电层和印刷电路板的第二侧上的第二导电层的电连接。 电连接包括从印刷电路板的一侧的开口延伸穿过第一和第二层之间的印刷电路板的通道。 导电材料形成在通道的壁上，并形成将第一导电层与第二导电层电连接的第一路径。 至少一个第一球被通道包围，并形成印刷电路板的第一和第二导电层之间的第二电路的一部分，所述第二电路具有比第一路径更低的电阻。

公开(公告)号：US09041171B2

公开(公告)日：2015-05-26

申请号：US13340430

申请日：2011-12-29

Applicant: Sam Ziqun Zhao ,  Kevin Kunzhong Hu ,  Sampath K. V. Karikalan ,  Rezaur Rahman Khan ,  Pieter Vorenkamp ,  Xiangdong Chen

Inventor： Sam Ziqun Zhao ,  Kevin Kunzhong Hu ,  Sampath K. V. Karikalan ,  Rezaur Rahman Khan ,  Pieter Vorenkamp ,  Xiangdong Chen

IPC: H01L21/326 ,  H01L23/495 ,  H05K1/11 ,  B82Y99/00 ,  H01L23/498 ,  H05K1/02 ,  H01L21/48 ,  H05K3/40

CPC classification number: H01L23/49827 ,  B82Y10/00 ,  H01L21/485 ,  H01L21/486 ,  H01L23/49822 ,  H01L2224/16225 ,  H05K1/029 ,  H05K3/4038 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10378 ,  H05K2203/104 ,  H05K2203/105

Abstract: An exemplary implementation of the present disclosure includes a programmable interposer having top and bottom interface electrodes and conductive particles interspersed within the programmable interposer. The conductive particles are capable of forming an aligned configuration between the top and bottom interface electrodes in response to application of an energy field to the programmable interposer so as to electrically connect the top and bottom interface electrodes. The conductive particles can have a conductive outer surface. Also, the conductive particles can be spherical. The conductive particles can be within a bulk material in an interface layer in the programmable interposer, and the bulk material can be cured to secure programmed paths between the top and bottom interface electrodes.

Abstract translation: 本公开的示例性实现包括具有顶部和底部接口电极和散布在可编程插值器内的导电粒子的可编程插值器。 响应于将能量场施加到可编程内插器，导电颗粒能够在顶部和底部界面电极之间形成对准的构造，以便电连接顶部和底部界面电极。 导电颗粒可具有导电外表面。 此外，导电粒子可以是球形的。 导电颗粒可以在可编程插入器中的界面层中的体积材料内，并且可以固化块状材料以确保顶部和底部界面电极之间的编程路径。

公开(公告)号：US20150136219A1

公开(公告)日：2015-05-21

申请号：US14402006

申请日：2013-05-08

Applicant: Material Concept, Inc.

Inventor： Junichi Koike ,  Hoang Tri Hai

IPC: H01L31/02 ,  H01B1/02 ,  H01B1/22 ,  H05K3/12

CPC classification number: H01L31/02013 ,  B22F1/0011 ,  B22F1/0059 ,  C22C1/0425 ,  C22C9/00 ,  H01B1/026 ,  H01B1/22 ,  H01L31/022425 ,  H05K1/092 ,  H05K3/1291 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2203/1131 ,  Y02E10/50 ,  Y10T428/2982

Abstract: This conductive paste is such that the printing properties and sintering properties are superior and is formed such that resistance of wiring after sintering is lowered. This conductive paste is characterized by being formed from copper-based metal particles and by an aspect ratio (dmax/dmin), which is defined as the ratio of the maximum diameter (dmax) and minimum diameter (dmin) for the metal particles, being greater than or equal to 1.0 and smaller than 2.2.

Abstract translation: 该导电性糊料使得印刷性能和烧结性能优异，并且形成为使得烧结后的布线的电阻降低。 该导电性糊剂的特征在于由铜基金属粒子形成，长宽比（dmax / dmin）定义为金属粒子的最大直径（dmax）与最小直径（dmin）的比例，为 大于或等于1.0且小于2.2。

公开(公告)号：US08760606B2

公开(公告)日：2014-06-24

申请号：US12905664

申请日：2010-10-15

Applicant: Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

Inventor： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

IPC: G02F1/1333

CPC classification number: H01L31/022425 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01B1/02 ,  H01L27/1421 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/022466 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/1884 ,  H01L33/38 ,  H01L33/40 ,  H01L51/0021 ,  H01L51/0048 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5212 ,  H05K1/095 ,  H05K1/097 ,  H05K3/06 ,  H05K3/245 ,  H05K3/249 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10S977/95 ,  Y10T29/49155

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是透明的，可图案化的，并且适合作为诸如触摸屏，液晶显示器，等离子显示面板等的视觉显示装置中的透明电极。

公开(公告)号：US20130220677A1

公开(公告)日：2013-08-29

申请号：US13770225

申请日：2013-02-19

Applicant: Hitachi Cable, Ltd. ,  Hitachi Cable Fine-Tech, Ltd.

Inventor： Satoru AMOU ,  Tomiya ABE ,  Daisuke SHANAI ,  Hiroaki KOMATSU ,  Kenichi MURAKAMI

IPC: C09J181/06 ,  H05K1/02 ,  B32B5/00

CPC classification number: C09J171/00 ,  B32B3/08 ,  B32B5/00 ,  B32B7/12 ,  B32B15/08 ,  B32B27/08 ,  B32B27/281 ,  B32B2307/306 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2457/08 ,  C08G2650/54 ,  C08L79/08 ,  C09J181/06 ,  H05K1/02 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/2826 ,  Y10T428/31681 ,  Y10T428/31721 ,  C08K5/3415 ,  C08K7/04

Abstract: Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film.

Abstract translation: 提供了保存稳定性，可靠性和低温粘合性优异的热固性粘合剂组合物; 以及使用该组合物得到的卷曲耐热膜和布线膜。 热固性粘合剂组合物包含100重量份在其结构中具有双酚S骨架的苯氧基树脂; 5〜30重量份在其结构中含有多个马来酰亚胺基团的马来酰亚胺化合物; 和3〜20体积％的无机针状填料。 通过将热固性粘合剂组合物涂布在聚酰亚胺膜上，然后干燥获得耐热粘合剂膜。 通过将导体布线层放置在耐热粘合膜上而获得布线膜。

公开(公告)号：US08507803B2

公开(公告)日：2013-08-13

申请号：US12722810

申请日：2010-03-12

Applicant: Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Ayao Kariya ,  Katsuhiro Satou ,  Yasuhiro Okuda

Inventor： Masamichi Yamamoto ,  Kyouichirou Nakatsugi ,  Ayao Kariya ,  Katsuhiro Satou ,  Yasuhiro Okuda

IPC: H05K1/03

CPC classification number: H05K3/323 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/104 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

Abstract translation: 本发明提供一种板连接结构，其可以提供具有细间距的电极，并且可以组合绝缘性能和连接可靠性。 连接印刷电路板10和20的结构在第一板11上彼此相邻设置的多个第一电极12和13与设置成彼此相邻的多个第二电极22和23电连接 第二板21通过含有导电粒子31并具有各向异性导电性的粘合剂30。 通过加热和加压位于相互相对的第一电极12和第二电极22之间以及相互面对的第一电极13和第二电极23之间的粘合剂，在第一板11和第二板21之间形成粘接层30a， 粘合层30a，在第一电极12和13之间以及第二电极22和23之间形成空腔部分33。

公开(公告)号：US08216672B2

公开(公告)日：2012-07-10

申请号：US11152984

申请日：2005-06-14

Applicant: James David Blackhall Smith ,  Gary Stevens ,  John William Wood

Inventor： James David Blackhall Smith ,  Gary Stevens ,  John William Wood

IPC: B32B7/12 ,  H01L23/24

CPC classification number: C08K3/22 ,  C08K3/14 ,  C08K3/28 ,  C08K2201/016 ,  H05K1/0373 ,  H05K2201/0248 ,  Y10T428/24994 ,  Y10T428/249986 ,  Y10T428/28 ,  Y10T442/2418 ,  Y10T442/2992 ,  Y10T442/50

Abstract: In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler 30. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystal 40 polymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids 60.

Abstract translation: 在一个实施方案中，本发明提供了包含主体高度结构化树脂基质和高导热性填料30的高导热性高结构化树脂。高热导率填料的长度为1-1000nm，高导热性 填料的纵横比在3-100之间。 特别高度结构化的高度结构化树脂包括液晶40聚合物，互穿网络，树枝状聚合物基质，膨胀聚合物，梯形聚合物，星形聚合物和结构化有机 - 无机杂化物60中的至少一种。

公开(公告)号：US20120119626A1

公开(公告)日：2012-05-17

申请号：US13359037

申请日：2012-01-26

Applicant: Wataru TAKAHASHI ,  Hitoshi YOSHIKAWA ,  Jun KOBAYASHI

Inventor： Wataru TAKAHASHI ,  Hitoshi YOSHIKAWA ,  Jun KOBAYASHI

IPC: H01B5/00 ,  H05K1/09 ,  H01L41/16

CPC classification number: H05K1/095 ,  C08K2201/001 ,  G06F3/044 ,  H01L41/0478 ,  H02N1/006 ,  H05K1/162 ,  H05K2201/0133 ,  H05K2201/0245 ,  H05K2201/0248

Abstract: To provide a conductive film that is flexible, extendable and contractible, and for which the electrical resistance hardly increases even when the conductive film is extended. The conductive film contains an elastomer and metallic filler particles, and satisfies a condition (A) [an average value of reference numbers is 0.8 (1/μm) or more, or the metallic filler particles include flake-like metallic filler particles having a thickness of 1 μm or less and an aspect ratio of 26 or more and the average value of the reference numbers is 0.4 (1/μm) or more] and a condition (B) [a number of unit areas for which an area percentage of the elastomer is 60% or more is 20 or more], the condition (A) being a conductivity indicator and the condition (B) being a flexibility indicator.

Abstract translation: 为了提供柔性，可延伸和收缩的导电膜，并且即使当导电膜延伸时，其电阻也几乎不增加。 导电膜含有弹性体和金属填料粒子，满足条件（A）[参考数字的平均值为0.8（1 /μm）以上），或者金属填料粒子包含具有厚度的片状金属填料粒子 为1μm以上，纵横比为26以上，基准数的平均值为0.4（1 /μm）以上]和条件（B）[单位面积的面积百分比 弹性体为60％以上为20以上]，条件（A）为电导率指标，条件（B）为柔性指标。

公开(公告)号：US20110256342A1

公开(公告)日：2011-10-20

申请号：US13141497

申请日：2009-12-03

Applicant: Hideaki Toshioka ,  Yasuhiro Okuda

Inventor： Hideaki Toshioka ,  Yasuhiro Okuda

IPC: C09J7/00 ,  C09J163/02 ,  B32B7/00

CPC classification number: C09J171/00 ,  C08G2650/40 ,  C08G2650/56 ,  C08L33/068 ,  C08L63/00 ,  C08L71/00 ,  C08L2205/03 ,  C08L2205/05 ,  C08L2666/02 ,  C08L2666/14 ,  C09J133/068 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0248 ,  H05K2203/104 ,  Y10T428/24174 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

Abstract: Provided is a film adhesive that has a high flexibility and a high adhesion strength and is easy to prepare by mixing. The film adhesive contains, as essential components, a bisphenol A phenoxy resin having a molecular weight of 30,000 or more, an epoxy resin having a molecular weight of 500 or less, a glycidyl methacrylate copolymer, a rubber-modified epoxy resin, and a latent hardener. Preferably, the weight of the glycidyl methacrylate copolymer per epoxy equivalent is 1000 or less.

Abstract translation: 提供了具有高柔性和高粘合强度并且易于通过混合制备的胶粘剂。 作为必要成分，膜粘合剂含有分子量为30,000以上的双酚A苯氧基树脂，分子量为500以下的环氧树脂，甲基丙烯酸缩水甘油酯共聚物，橡胶改性环氧树脂和潜在的 硬化剂 优选地，每环氧当量的甲基丙烯酸缩水甘油酯共聚物的重量为1000以下。

公开(公告)号：US20110031001A1

公开(公告)日：2011-02-10

申请号：US12701676

申请日：2010-02-08

Applicant: Dai ISHIKAWA ,  Tomiya ABE ,  Masanobu ITO

Inventor： Dai ISHIKAWA ,  Tomiya ABE ,  Masanobu ITO

IPC: H05K1/09 ,  B32B15/04 ,  B22F7/04 ,  B22F1/02 ,  H01B9/02

CPC classification number: H05K1/097 ,  B22F2998/10 ,  B22F2999/00 ,  C23C24/087 ,  H05K3/105 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2203/125 ,  Y10T428/12028 ,  Y10T428/12181 ,  B22F9/24 ,  B22F1/0062 ,  B22F1/0003 ,  B22F3/20 ,  B22F1/0018 ,  B22F1/0048 ,  B22F1/0025 ,  B22F2001/0037

Abstract: A composite metal fine particle material is provided, in which spherical silver nanoparticles synthesized from a silver compound, a solvent, a reducing agent, and a dispersant, and conductive fillers compose of non-spherical metal fine particles, are mixed. For example, the conductive fillers composed of the non-spherical metal fine particles are formed into slender columnar shapes, plate shapes, or ellipsoidal shapes.

Abstract translation: 提供一种复合金属微粒材料，其中由银化合物，溶剂，还原剂和分散剂合成的球形银纳米颗粒和由非球形金属微粒组成的导电填料混合。 例如，由非球形金属微粒构成的导电填料形成细长的柱状，板状或椭圆形。