公开(公告)号：US20100155672A1

公开(公告)日：2010-06-24

申请号：US12714354

申请日：2010-02-26

Applicant: Lex KOSOWSKY ,  Robert Fleming

Inventor： Lex KOSOWSKY ,  Robert Fleming

IPC: H01B1/04 ,  H01B1/02 ,  H01B1/12

CPC classification number: H01C17/06586 ,  B82Y10/00 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0738

Abstract: One or more embodiments provide for a composition that includes (i) organic material that is conductive or semi-conductive, and (ii) conductor and/or semiconductor particles other than the organic material. The organic material and the conductor and/or semiconductor particles are combined to provide the composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of the voltage exceeding the characteristic voltage level.

Abstract translation: 一个或多个实施方案提供了组合物，其包括（i）导电或半导电的有机材料，和（ii）有机材料以外的导体和/或半导体颗粒。 有机材料和导体和/或半导体颗粒被组合以提供组合物的特征是：（i）不存在超过特征电压水平的电压的电介质，以及（ii）通过施加超过 特征电压电平。

公开(公告)号：US20100144085A1

公开(公告)日：2010-06-10

申请号：US12694231

申请日：2010-01-26

Applicant: Lih-Hsiung Chan ,  Ming-Chun Hsiao ,  Wei-Ling Lin ,  Gary Wei

Inventor： Lih-Hsiung Chan ,  Ming-Chun Hsiao ,  Wei-Ling Lin ,  Gary Wei

IPC: H01L51/40

CPC classification number: H01L29/0665 ,  B82Y10/00 ,  H01L29/0673 ,  H01L29/43 ,  H01L51/0097 ,  H05K1/0393 ,  H05K3/207 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2203/016

Abstract: Substrate structures and fabrication methods thereof. A substrate structure includes a bendable substrate and an inorganic electrode structure on the bendable structure, wherein the inorganic electrode structure includes a conductive layer or a semiconductor layer. The inorganic electrode structure includes carbon nanotubes, carbon nanofibers, a nanolinear material, or a micro-linear material. The bendable substrate includes polyethylene (PE), polyimide (PI), polyvinyl alcohol (PVA), or polymethyl methacrylate (PMMA).

Abstract translation: 基板结构及其制造方法。 基板结构包括可弯曲基板和可弯曲结构上的无机电极结构，其中无机电极结构包括导电层或半导体层。 无机电极结构包括碳纳米管，碳纳米纤维，纳米线材或微线材。 可弯曲基材包括聚乙烯（PE），聚酰亚胺（PI），聚乙烯醇（PVA）或聚甲基丙烯酸甲酯（PMMA）。

公开(公告)号：US20100119789A1

公开(公告)日：2010-05-13

申请号：US11398004

申请日：2006-04-05

Applicant: William J. Grande

Inventor： William J. Grande

IPC: C09D11/02 ,  B05D3/02 ,  B32B5/16 ,  B32B3/10 ,  H01B1/20 ,  H01B1/22

CPC classification number: C09D11/30 ,  B82Y10/00 ,  C09D11/52 ,  H05K1/095 ,  H05K2201/026 ,  Y10T428/24893 ,  Y10T428/24909

Abstract: The present invention relates to a conductive ink containing fine metallic particles, a polymer base, a solvent, and a nanotube containing conductive filler. Also disclosed is a method of printing conductive ink on a surface where the conductive ink is applied to the surface of a substrate and cured.

Abstract translation: 本发明涉及含有金属微粒，聚合物基质，溶剂和含有导电填料的纳米管的导电油墨。 还公开了在将导电油墨施加到基材表面并固化的表面上印刷导电油墨的方法。

公开(公告)号：US20100116431A1

公开(公告)日：2010-05-13

申请号：US12689383

申请日：2010-01-19

Applicant: Ivan Pawlenko ,  Larry Samson

Inventor： Ivan Pawlenko ,  Larry Samson

IPC: B32B37/00 ,  B05C11/00

CPC classification number: H05K9/0083 ,  B82Y30/00 ,  C08K3/041 ,  C08K7/06 ,  C08K2201/011 ,  H05K1/0218 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/09872 ,  H05K2203/0126 ,  Y10T428/25 ,  Y10T428/31678

Abstract: A thermally conductive polymer composition is applied to mounted components to provide both thermal control and RF radiation attenuation. In order to improve the RF attenuation performance, a plurality of discrete conductive elements may be incorporated into the polymer composition, with the sizing, spacing and configuration of the suppressed most efficiently by the particular composition. The discrete conductive elements are significantly larger, on the order of 1-5 mils (approximately 25-127 μm) than the filler materials utilized to render the base polymer conductive. Also disclosed is an apparatus and a method for preparing and applying such a polymer composition to an electronic component.

Abstract translation: 将导热聚合物组合物应用于安装的组件以提供热控制和RF辐射衰减。 为了提高RF衰减性能，可以将多个离散的导电元件结合到聚合物组合物中，具有通过特定组合最有效地抑制的尺寸，间距和构型。 离散导电元件显着地大于用于使基础聚合物导电的填充材料大约1-5密耳（约25-127μm）。 还公开了一种用于制备和应用这种聚合物组合物到电子部件的装置和方法。

公开(公告)号：US07679081B2

公开(公告)日：2010-03-16

申请号：US11625791

申请日：2007-01-22

Applicant: Lih-Hsiung Chan ,  Ming-Chun Hsiao ,  Wei-Ling Lin ,  Gary Wei

Inventor： Lih-Hsiung Chan ,  Ming-Chun Hsiao ,  Wei-Ling Lin ,  Gary Wei

IPC: H01L35/24 ,  H01L51/00

CPC classification number: H01L29/0665 ,  B82Y10/00 ,  H01L29/0673 ,  H01L29/43 ,  H01L51/0097 ,  H05K1/0393 ,  H05K3/207 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2203/016

Abstract: Substrate structures and fabrication methods thereof. A substrate structure includes a bendable substrate and an inorganic electrode structure on the bendable structure, wherein the inorganic electrode structure includes a conductive layer or a semiconductor layer. The inorganic electrode structure includes carbon nanotubes, carbon nanofibers, a nanolinear material, or a micro-linear material. The bendable substrate includes polyethylene (PE), polyimide (PI), polyvinyl alcohol (PVA), or polymethyl methacrylate (PMMA).

Abstract translation: 基板结构及其制造方法。 基板结构包括可弯曲基板和可弯曲结构上的无机电极结构，其中无机电极结构包括导电层或半导体层。 无机电极结构包括碳纳米管，碳纳米纤维，纳米线材或微线材。 可弯曲基材包括聚乙烯（PE），聚酰亚胺（PI），聚乙烯醇（PVA）或聚甲基丙烯酸甲酯（PMMA）。

公开(公告)号：US20100051332A1

公开(公告)日：2010-03-04

申请号：US12471396

申请日：2009-05-24

Applicant: CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  MENG-CHIEH HSU ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  MENG-CHIEH HSU ,  CHENG-HSIEN LIN

IPC: H05K1/02

CPC classification number: H05K1/186 ,  B82Y10/00 ,  H01L23/373 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19042 ,  H05K3/4038 ,  H05K2201/026

Abstract: A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.

Abstract translation: 电路基板包括其中形成有导电图案的导电层，具有通孔的绝缘层和位于导电层和绝缘层之间的复合层。 通孔被配置为具有安装在其上的电子部件。 复合层包括聚合物基质和嵌入聚合物基质中的至少一个碳纳米管束。 至少一个碳纳米管束的一端与导电图案接触，另一端暴露在绝缘层的通孔中。

公开(公告)号：US20090308650A1

公开(公告)日：2009-12-17

申请号：US12222176

申请日：2008-08-04

Applicant: Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

Inventor： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

IPC: H05K3/06 ,  H05K1/09

CPC classification number: H05K3/4069 ,  B82Y10/00 ,  H05K3/1291 ,  H05K3/4647 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/09827 ,  H05K2203/1126 ,  Y10T29/49155

Abstract: The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved.

Abstract translation: 使用在含有碳纳米管的可燃性糊料在第一金属层上形成凸块的方法，在第一金属层上焙烧包括凸块的第一金属层，形成绝缘层和第二金属层，制造印刷电路板， 并且对第一和第二金属层进行图案化，由此降低了印刷电路板的电阻率，提高了导电性和冷却性能。

公开(公告)号：US20090294159A1

公开(公告)日：2009-12-03

申请号：US12132277

申请日：2008-06-03

Applicant: Kuo-Ching CHIANG

Inventor： Kuo-Ching CHIANG

IPC: H05K1/09

CPC classification number: H05K1/092 ,  B82Y10/00 ,  H05K1/09 ,  H05K1/095 ,  H05K2201/0108 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2201/0329

Abstract: The present invention provides a multilayer print circuit board having at least an inner print circuit pattern and an outer print circuit pattern which are laminated on a substrate through an insulation layer and being electrically connected to each other through a blind hole provided in the insulation layer. The insulation layer is composed of a resin insoluble in an oxidization agent and inorganic powder dispersed in the resin. The inorganic powder is soluble in the oxidization agent. Wherein at least one circuit pattern is formed of non-metal material for electrically connection.

Abstract translation: 本发明提供一种具有至少内部印刷电路图案和外部印刷电路图案的多层印刷电路板，该印刷电路图案和外部印刷电路图案通过绝缘层层叠在基板上，并通过设置在绝缘层中的盲孔彼此电连接。 绝缘层由不溶于氧化剂的树脂和分散在树脂中的无机粉末组成。 无机粉末可溶于氧化剂。 其中至少一个电路图案由用于电连接的非金属材料形成。

公开(公告)号：US20090251846A1

公开(公告)日：2009-10-08

申请号：US12246030

申请日：2008-10-06

Applicant: Jae Chan LEE ,  Eun Sung LEE ,  Yoo Seong YANG

Inventor： Jae Chan LEE ,  Eun Sung LEE ,  Yoo Seong YANG

IPC: H01G4/002

CPC classification number: H01G4/06 ,  B82Y10/00 ,  H01G4/30 ,  H05K1/162 ,  H05K2201/0195 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T29/435

Abstract: An embedded capacitor including a dielectric layer disposed between opposing faces of electrodes, in which the dielectric layer includes a high-loss dielectric layer and one or more insulating layers in contact with the high-loss dielectric layer. The dielectric layer may have a two-layer structure or a three-layer structure in which an insulating layer is additionally interposed between the high-loss dielectric layer and the electrode, thereby decreasing the dielectric loss while maintaining a high dielectric constant, compared to capacitors including a single-layer dielectric structure.

Abstract translation: 一种嵌入式电容器，包括设置在电极的相对面之间的电介质层，其中介电层包括高损耗介电层和与高损耗介电层接触的一个或多个绝缘层。 电介质层可以具有两层结构或三层结构，其中在高损耗介电层和电极之间另外插入绝缘层，从而与电容器相比，保持高介电常数而降低介电损耗 包括单层电介质结构。

公开(公告)号：US07598609B2

公开(公告)日：2009-10-06

申请号：US10998741

申请日：2004-11-30

Applicant: Ruoh Huey Uang ,  Yu Chih Chen ,  Ren Jay Lin ,  Syh Yuh Cheng

Inventor： Ruoh Huey Uang ,  Yu Chih Chen ,  Ren Jay Lin ,  Syh Yuh Cheng

IPC: H01L23/12 ,  H01L35/24 ,  H01L23/48

CPC classification number: H01L23/49827 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K2201/026 ,  H05K2201/083 ,  H05K2201/10378 ,  H05K2203/0726 ,  H05K2203/104 ,  Y10S977/761 ,  Y10S977/762 ,  Y10S977/766 ,  Y10S977/77 ,  Y10S977/778 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.

Abstract translation: 提供由聚合物基体和小于微尺寸的多条导电线形成的复合导电膜及其制造方法。 导线彼此平行布置并间隔开，从而提供各向异性导电性。 本导电膜可以用作细间距芯片和基板之间的电连接。 此外，在导电膜的导电方向的两个相对侧上形成粘合剂层以增加粘合剂区域。 因此，使用导电膜的封装的强度和可靠性得到提高。