公开(公告)号：US6143414A

公开(公告)日：2000-11-07

申请号：US150791

申请日：1998-09-10

Applicant: Felip Balsells Coca ,  Antonio Rodriguez Siurana

Inventor： Felip Balsells Coca ,  Antonio Rodriguez Siurana

IPC: B29C70/08 ,  B29C70/88 ,  H05K1/03 ,  B32B27/38

CPC classification number: B29C70/081 ,  B29C70/885 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0293 ,  Y10T428/31511 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T442/3488 ,  Y10T442/3602

Abstract: It includes two outer sheets of continuous-strand fiberglass fabric and a core of non-woven fiberglass formed by sheets of fiberglass paper, all sheets being impregnated with epoxy resin, and presenting at least one sheet of conducting material, on one or both outer sides; it is characterized in that it incorporates in the non-woven fiberglass core at least one intermediate sheet of fiberglass fabric impregnated with resin.It allows manufacturing of reliable printed circuits, even when using surface-mounted components, while at the same time its cost is relatively low; it is particularly suitable for the field of consumer and semi-professional electronics.

Abstract translation: 它包括两片连续的玻璃纤维织物外层和由玻璃纤维纸片形成的无纺玻璃纤维芯，所有片材都浸渍有环氧树脂，并且在一个或两个外侧上呈现至少一片导电材料 ; 其特征在于，其在无纺玻璃纤维芯中包含浸渍有树脂的至少一个玻璃纤维织物中间片。 即使使用表面贴装元件，也可制造可靠的印刷电路，同时成本相对较低; 它特别适用于消费电子和半专业电子领域。

公开(公告)号：US5716168A

公开(公告)日：1998-02-10

申请号：US616918

申请日：1996-03-18

Applicant: Marshall A. Janoff

Inventor： Marshall A. Janoff

IPC: B23B35/00 ,  H05K3/00

CPC classification number: H05K3/0047 ,  B23B35/005 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0156 ,  H05K2203/0214 ,  Y10T408/03 ,  Y10T408/561 ,  Y10T428/24983 ,  Y10T428/31946 ,  Y10T428/31964

Abstract: A back-up board for use in drilling holes in printed circuit boards is disclosed. The inventive back-up board comprises outer layers of paper impregnated with a high-density resin, and a core consisting of alternating layers of paper impregnated with low-density resin and dry paper.

Abstract translation: 公开了一种用于在印刷电路板上钻孔的备用板。 本发明的支撑板包括浸渍有高密度树脂的外层纸和由浸渍有低密度树脂和干纸的交替的纸层组成的芯。

公开(公告)号：US5498471A

公开(公告)日：1996-03-12

申请号：US467325

申请日：1995-06-06

Applicant: Jorg Hausdorf ,  Thomas Kuhlmann ,  Rolf Schneider ,  Steffen Kosack ,  Werner Schafer ,  Volker Siekermann

Inventor： Jorg Hausdorf ,  Thomas Kuhlmann ,  Rolf Schneider ,  Steffen Kosack ,  Werner Schafer ,  Volker Siekermann

IPC: B32B27/04 ,  B32B15/14 ,  B32B27/18 ,  C08J5/24 ,  C08K3/02 ,  C08K3/32 ,  H05K1/03 ,  B32B5/16

CPC classification number: H05K1/0346 ,  B32B15/14 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/125 ,  Y10S428/901 ,  Y10T442/268

Abstract: A thermostable substrate for flexible circuit boards having excellent flame-resistance, handling, and storage qualities may be produced by treating a substrate of a nonwoven fabric or paper with a flame-resistant, halogen-free polymeric composition. The polymeric composition comprises an aqueous mixture of a copolymerizate of acrylic acid esters and styrene, and an aminoplastic or phenoplastic precondensate to which a mixture of fine-particle red phosphorus and fine-particle ammonium polyphosphate is also added.

Abstract translation: 具有优异的阻燃性，处理性和储存性的柔性电路板的耐热基材可以通过用无阻燃的无卤聚合物组合物处理非织造织物或纸的基材来制备。 聚合物组合物包含丙烯酸酯和苯乙烯的共聚物的水性混合物，以及也加入微粒红磷和细颗粒多磷酸铵的混合物的氨基塑料或酚醛预缩合物。

公开(公告)号：US4994133A

公开(公告)日：1991-02-19

申请号：US737134

申请日：1985-05-23

Applicant: Masayuki Oizumi ,  Masakazu Uekira ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

Inventor： Masayuki Oizumi ,  Masakazu Uekira ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

IPC: B32B37/00 ,  B29C57/00 ,  B29C63/00 ,  B29C67/00 ,  B29C70/00 ,  B29C70/50 ,  B32B15/08 ,  B32B27/04 ,  B32B38/08 ,  D21H25/06 ,  H05K1/03 ,  H05K3/02

CPC classification number: B32B38/08 ,  B29C70/50 ,  B32B27/04 ,  D21H25/06 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1545 ,  H05K3/022 ,  Y10S428/901 ,  Y10T156/1085 ,  Y10T29/49124 ,  Y10T442/3431 ,  Y10T442/3528 ,  Y10T442/656 ,  Y10T442/67

Abstract: A continuous process for producing reinforced resin laminates comprising the steps of impregnating a fibrous substrate with a liquid resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous byproducts, laminating a plurality of the resin-impregnated substrates into a unitary member, sandwiching the laminate between a pair of covering sheets, and curing the laminate between said pair of covering sheets without applying appreciable pressure. The improvement comprises adjusting the final resin content in said resin impregnated substrate at 10 to 90% by weight based on the total weight of said impregnated substrate.

公开(公告)号：US4990409A

公开(公告)日：1991-02-05

申请号：US225355

申请日：1988-07-28

Applicant: Kazuyuki Tanaka ,  Etsuji Iwami ,  Akinori Hanawa ,  Mitsuo Yokota

Inventor： Kazuyuki Tanaka ,  Etsuji Iwami ,  Akinori Hanawa ,  Mitsuo Yokota

IPC: B32B27/10 ,  B32B27/04 ,  D21H17/53 ,  H05K1/03

CPC classification number: H05K1/0366 ,  D21H17/53 ,  H05K1/034 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/921 ,  Y10T428/31616 ,  Y10T428/31627 ,  Y10T428/3179 ,  Y10T428/31866 ,  Y10T428/31964

Abstract: A flame retardant electrical laminate prepared by impregnating a base material with a halogen-containing unsaturated polyester resin which is prepared by dissolving a halogen-containing unsaturated polyester into a polymerizable monomer; and then curing the halogen-containing unsaturated polyester resin; wherein the halogen-containing unsaturated polyester has a molecular weight per 1 mole of unsaturated group of 350 to 1,000, and the cured halogen-containing unsaturated polyester resin has a glass transition temperature of 30.degree. to 90.degree. C.Such electrical laminates not only have excellent flame redardancy but also excellent puching quality at wide temperature range including room temperature.

公开(公告)号：US4883708A

公开(公告)日：1989-11-28

申请号：US201685

申请日：1988-06-02

Applicant: Kenichi Kariya ,  Masayuki Noda ,  Takahiro Yamaguchi ,  Katsuji Takahashi

Inventor： Kenichi Kariya ,  Masayuki Noda ,  Takahiro Yamaguchi ,  Katsuji Takahashi

IPC: B32B15/08 ,  C08J5/04 ,  H05K1/03

CPC classification number: C08J5/047 ,  B32B15/08 ,  H05K1/0346 ,  H05K1/0366 ,  C08J2363/00 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/0355 ,  Y10T428/31681 ,  Y10T442/3138 ,  Y10T442/3252 ,  Y10T442/3415 ,  Y10T442/656

Abstract: A metal foil covered laminate comprising a sheet-like base formed of at least two of meta-aramid fiber, polyethylene terephthalate fiber and glass fiber and impregnated with epoxy resin including acrylonitrile/butadiene copolymer having terminal carboxyl groups and a metal foil covering on the sheet-like base.

公开(公告)号：US4698267A

公开(公告)日：1987-10-06

申请号：US839270

申请日：1986-03-13

Applicant: Edward W. Tokarsky

Inventor： Edward W. Tokarsky

IPC: D21H13/26 ,  H05K1/03 ,  B32B27/34 ,  D21F11/00

CPC classification number: H05K1/0366 ,  D21H13/26 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/12646 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/3154 ,  Y10T428/31562 ,  Y10T428/31591 ,  Y10T428/31681 ,  Y10T428/31699 ,  Y10T428/31725 ,  Y10T428/3175 ,  Y10T428/31993

Abstract: High density para-aramid papers comprising 5 to 25 percent, by weight, binder and an amount of para-aramid fibers selected from the group consisting of para-aramid pulp, para-aramid floc and mixtures thereof, compacted to provide a volume percent para-aramid fiber of at least 53 minus 0.13 times the volume percent floc in the paper are useful in the preparation of circuit board substrates having a low coefficient of thermal expansion.

公开(公告)号：US4486505A

公开(公告)日：1984-12-04

申请号：US441634

申请日：1982-11-15

Applicant: Yasuo Fushiki ,  Masayuki Oizumi ,  Masaharu Abe ,  Makoto Watanabe

Inventor： Yasuo Fushiki ,  Masayuki Oizumi ,  Masaharu Abe ,  Makoto Watanabe

IPC: B32B15/08 ,  H05K1/03 ,  H05K3/38 ,  B32B15/12 ,  B32B27/04 ,  B32B27/42

CPC classification number: H05K1/0373 ,  B32B15/08 ,  H05K1/034 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/122 ,  Y10S428/92 ,  Y10S428/921 ,  Y10T428/31522 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31703

Abstract: A flame retarded copper clad laminate is provided comprising a plurality of paper substrate layers each impregnated with a halogen-containing unsaturated polyester resin containing about 1% to about 30% by weight of a basic filler, and a copper cladding adhesively bonded onto at least one side of the laminate.

Abstract translation: 提供了一种阻燃铜包覆层压板，其包括多个纸基材层，每个纸基材层浸渍含有约1重量％至约30重量％的碱性填料的含卤素的不饱和聚酯树脂，并且铜包被粘合到至少一个 侧面。

公开(公告)号：US4442139A

公开(公告)日：1984-04-10

申请号：US102576

申请日：1979-12-11

Applicant: Alan Brigham

Inventor： Alan Brigham

IPC: B32B27/08 ,  H01B1/24 ,  H01M4/96 ,  H05B3/14 ,  H05F3/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/38 ,  H05K9/00 ,  B05D5/12

CPC classification number: H05K9/009 ,  B32B27/08 ,  H01B1/24 ,  H01M4/96 ,  H05B3/145 ,  H05F3/02 ,  H05K1/0366 ,  H05K3/102 ,  H05K1/036 ,  H05K1/095 ,  H05K2201/0251 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0323 ,  H05K3/38 ,  Y10T428/23914 ,  Y10T428/23921 ,  Y10T428/24893 ,  Y10T428/2918 ,  Y10T428/30

Abstract: An element comprises a support, preferably a continuous polymeric film, and fibrous material, preferably a spun glass fiber web, which is secured to the support and protrudes therefrom, the protruding fibrous material being part of a layer comprising randomly distributed fibers having solid material, especially particulate material, adhered thereto. The element can be prepared from a composition containing solid material dissolved or dispersed in a liquid medium by applying said composition to fibrous material which is partially embedded in one surface of a support and then drying to evaporate the liquid medium.

Abstract translation: 元件包括支撑件，优选连续聚合物膜，以及纤维材料，优选玻璃纤维网，其被固定到支撑件并从其突出，所述突出的纤维材料是包含具有固体材料的随机分布的纤维的层的一部分， 特别是颗粒材料。 该元件可以由含有固体材料的组合物制备，所述组合物通过将所述组合物施加到部分地嵌入载体的一个表面中然后干燥以蒸发液体介质的纤维材料，溶解或分散在液体介质中。

公开(公告)号：US4140831A

公开(公告)日：1979-02-20

申请号：US890470

申请日：1978-03-27

Applicant: Stephen A. Miller

Inventor： Stephen A. Miller

IPC: B32B15/14 ,  H05K1/03 ,  B32B15/08 ,  D04H1/58

CPC classification number: H05K1/0366 ,  B29C70/22 ,  B32B15/14 ,  H05K1/0326 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31681 ,  Y10T442/655

Abstract: Flame-retardant metal-clad dielectric sheeting useful in printed circuitry manufacture comprising an electrically conductive metallic layer adhered to a compacted dimensionally stable non-woven web by a polyester diepoxide adhesive system. The diepoxide is formed by end-capping a polyester formed from neopentyl glycol and an acid selected from the group consisting of azelaic, sebasic, and adipic acids with a moderately brominated bisphenol A-epichlorohydrin epoxy. The curing agent for the diepoxide system is a polyanhydride selected from the group consisting of polyazelaic, polyadipic, and polysebasic anhydrides.

Abstract translation: 用于印刷电路制造中的阻燃金属包覆介质薄片包括通过聚酯二环氧化物粘合剂体系粘附到压实的尺寸稳定的非织造网上的导电金属层。 二环氧化物通过将由新戊二醇形成的聚酯和选自壬二酸，癸二酸和己二酸的酸与中等溴化双酚A-表氯醇环氧树脂封端而形成。 用于二环氧化物体系的固化剂是选自聚天麻，多偶氮和多硫酸酐的聚酐。