公开(公告)号：US5117300A

公开(公告)日：1992-05-26

申请号：US501042

申请日：1990-03-29

Applicant: Wolfram Wiemer

Inventor： Wolfram Wiemer

IPC: G02F1/13 ,  H05K1/03 ,  H05K1/09 ,  H05K3/20 ,  H05K3/32 ,  H05K3/36 ,  H05K3/38

CPC classification number: G02F1/13452 ,  H05K1/09 ,  H05K3/386 ,  H05K1/0306 ,  H05K2201/0326 ,  H05K2201/0355 ,  H05K2201/0391 ,  H05K3/20 ,  H05K3/323 ,  H05K3/361

Abstract: An electrical device including a glass substrate, an intrgrated circuit chip, an electrical device and electrical conductor paths applied to the surface of the glass substrate and connected to electrical terminals of the integrated circuit chip and the electrical device. The conductor paths are divided into supply conductor paths for supplying voltage to the integrated circuit chip and actuation conductor paths for actuating the electronic device. The actuation conductor paths are composed of layers of indium tin oxide deposited on the glass surface and the supply conductor paths are composed of metal films glued on the glass surface.

Abstract translation: 一种电气装置，包括玻璃基板，集成电路芯片，电气装置和施加到玻璃基板的表面并连接到集成电路芯片和电气装置的电端子的电导体路径。 导体路径被分成用于向集成电路芯片提供电压的电源导体路径和用于致动电子设备的致动导体路径。 驱动导体路径由沉积在玻璃表面上的铟锡氧化物层组成，供电导体路径由胶合在玻璃表面上的金属膜构成。

公开(公告)号：US4824693A

公开(公告)日：1989-04-25

申请号：US157933

申请日：1988-02-19

Applicant: Michael Schlipf ,  Rolf Zondler

Inventor： Michael Schlipf ,  Rolf Zondler

IPC: B23K1/20 ,  C23C18/18 ,  G02F1/1343 ,  G02F1/1345 ,  G09F9/00 ,  H01R43/16 ,  H05K3/24 ,  B05D5/12

CPC classification number: H05K3/24 ,  G02F1/1345 ,  H05K2201/0326 ,  H05K2201/0347 ,  H05K2201/0761

Abstract: To deposit a solderable metal layer on conductive paths (4) of ITO on substrates of display devices (1) by an electroless method, the conductive paths are activated, prior to the deposition, and the areas not covered by the conductive paths are subsequently inactivated. The activated paths are then metallized with a solderable metal layer so that integrated circuits can be soldered to the metallized conductive paths.

Abstract translation: 为了通过无电镀方法将可焊接的金属层沉积在ITO的导电路径（4）上，在沉积之前，导电路径被激活，并且未被导电路径覆盖的区域随后被钝化 。 激活的路径然后用可焊接金属层进行金属化，使得集成电路可以焊接到金属化导电路径。

公开(公告)号：US4362903A

公开(公告)日：1982-12-07

申请号：US220331

申请日：1980-12-29

Applicant: Charles W. Eichelberger ,  Wesley K. Waldron ,  Robert J. Wojnarowski

Inventor： Charles W. Eichelberger ,  Wesley K. Waldron ,  Robert J. Wojnarowski

IPC: H01R4/02 ,  H01R12/04 ,  H01R12/32 ,  H05K1/09 ,  H05K1/14 ,  H05K3/24 ,  B23K1/20 ,  G02F1/13

CPC classification number: H05K3/246 ,  H05K1/095 ,  H05K2201/0326 ,  H05K2201/0347 ,  H05K3/244

Abstract: An electrical conductor interconnect is disclosed which permits hard-to-contact substrates, such as the glass substrate in liquid crystal display cells, to be connected to electrical apparatus by conventional soldering techniques. The interconnect conductor involves the use of a polymer loaded with both a conducting powder and a non-noble metal powder whose top surface is coated with a contiguous layer of an adherent solderable metal by an augmentation replacement reaction.

Abstract translation: 公开了一种电导体互连件，其允许诸如液晶显示单元中的玻璃基板的难接触的基板通过常规的焊接技术连接到电气设备。 互连导体包括使用负载有导电粉末和非贵金属粉末的聚合物，其顶表面通过增加置换反应被粘附的可焊接金属的邻接层涂覆。

公开(公告)号：US3210214A

公开(公告)日：1965-10-05

申请号：US24082062

申请日：1962-11-29

Applicant: SYLVANIA ELECTRIC PROD

Inventor： SMITH BRADFORD K

IPC: H01B1/00 ,  H05B33/26 ,  H05K3/02

CPC classification number: H05K3/02 ,  H01B1/00 ,  H05B33/26 ,  H05K2201/0326 ,  H05K2203/1142 ,  Y10S428/901 ,  Y10T428/24537 ,  Y10T428/24545 ,  Y10T428/24612 ,  Y10T428/24752 ,  Y10T428/24917

公开(公告)号：US3061911A

公开(公告)日：1962-11-06

申请号：US71235558

申请日：1958-01-31

Applicant: XEROX CORP

Inventor： MITCHELL BAKER

IPC: H05K1/16 ,  H05K3/06 ,  H05K3/18

CPC classification number: H05K1/167 ,  H05K3/067 ,  H05K3/181 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2201/0344 ,  Y10T29/49099 ,  Y10T29/49156

公开(公告)号：US20190191560A1

公开(公告)日：2019-06-20

申请号：US16322070

申请日：2017-08-17

Applicant: The University of North Carolina at Chapel Hill ,  EASTMAN CHEMICAL COMPANY

Inventor： Rene Lopez ,  Qian Dong ,  Yukihiro Hara ,  Patrick Daniel Puzzo

IPC: H05K1/03 ,  G03F7/00 ,  G03F7/20 ,  G03F7/40 ,  H05K1/02

CPC classification number: H05K1/0393 ,  G02F1/133305 ,  G03F7/0002 ,  G03F7/2053 ,  G03F7/40 ,  G09F9/301 ,  H01L51/0097 ,  H05K1/0274 ,  H05K1/028 ,  H05K2201/0108 ,  H05K2201/0326

Abstract: The invention generally relates to articles and methods of making thereof. More specifically, articles comprising a substrate and a film deposited on the substrate, wherein the article is bendable to a bending diameter of about 3.8 mm or less without substantial structural failure of the film. Further, methods of making these articles are further disclosed. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

公开(公告)号：US10080298B2

公开(公告)日：2018-09-18

申请号：US14257546

申请日：2014-04-21

Applicant: PANASONIC CORPORATION

Inventor： Hideki Eifuku ,  Koji Motomura

IPC: H05K1/11 ,  H05K3/36 ,  H05K1/09 ,  H05K1/03 ,  H05K3/32

CPC classification number: H05K3/361 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/323 ,  H05K2201/0326 ,  H05K2201/10136 ,  H05K2201/10234

Abstract: Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material.

公开(公告)号：US10076030B2

公开(公告)日：2018-09-11

申请号：US15039629

申请日：2014-11-24

Applicant: Corning Precision Materials Co., Ltd.

Inventor： Jin Nyoung Heo ,  Tae Hyo Park ,  Dong Keun Shin ,  Jong Taek Kim ,  Sang Yoon Oh ,  Jin Sung Lim

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/09

CPC classification number: H05K1/0393 ,  B32B17/064 ,  G02F1/133305 ,  H05K1/0224 ,  H05K1/0306 ,  H05K1/0353 ,  H05K1/09 ,  H05K1/095 ,  H05K1/097 ,  H05K3/0067 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K2201/026 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2203/0113 ,  H05K2203/1545

Abstract: The present invention relates to a flexible hybrid substrate for a display and a method for manufacturing the same and, more specifically, to a flexible hybrid substrate for a display, which has a reduced occurrence of cracks, an improved level of flexibility, and can be used in a high-temperature process for manufacturing a display element, and a method for manufacturing the same. To this end, the present invention provides a flexible hybrid substrate for a display and a method for manufacturing the same, the flexible hybrid substrate for a display comprising: an ultra-thin plate glass; a first transparent thin film formed on one surface of the ultra-thin plate glass; and a second transparent thin film formed on the other surface of the ultra-thin plate glass, wherein the second transparent thin film includes a transparent conductive polymer.

公开(公告)号：US10069054B2

公开(公告)日：2018-09-04

申请号：US15591112

申请日：2017-05-10

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Hiroto Tamaki

IPC: H01L33/62 ,  H01L33/64 ,  H01L33/60 ,  H01L33/28 ,  H01L33/32 ,  H01L33/30 ,  H01L33/56 ,  H01L33/50 ,  H05K1/03 ,  H05K1/11 ,  H05K1/09 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/282 ,  H05K2201/0209 ,  H05K2201/0326 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer, an internal conductive layer, a lower conductive layer, vias, and a covering layer. The upper conductive layer is disposed on an upper surface of the uppermost ceramic layer. The internal conductive layer is interposed between the ceramic layers. The lower conductive layer is disposed on a lower surface of the lowermost ceramic layer. The vias connect the upper conductive layer, the internal conductive layer, and the lower connective layer. The covering layer covers a portion of the upper conductive layer. The upper conductive layer includes a covered region covered with the covering layer and an element mount region. An upper surface of the element mount region is higher than an upper surface of the covered portion.

公开(公告)号：US10039181B2

公开(公告)日：2018-07-31

申请号：US14074698

申请日：2013-11-07

Applicant: TPK Touch Systems (Xiamen) Inc.

Inventor： Chen-Hsin Chang ,  Bin Zhong ,  Fuding Wang ,  Zhenjun Fei ,  Lixian Chen

IPC: H05K1/02 ,  H05K3/40 ,  G06F3/044

CPC classification number: H05K1/0213 ,  G06F3/044 ,  G06F2203/04111 ,  H05K3/40 ,  H05K2201/0326 ,  H05K2201/10128

Abstract: The present disclosure provides a touch-sensing electrode structure, which includes a plurality of touch-sensing electrodes. Each of the touch-sensing electrodes includes a main body and a connecting portion connected to an end of the main body; wherein the width of the connecting portion is not less than a half width of the end of the main body. The touch-sensing electrode structure also includes a plurality of signal-transmitting wires, each of which includes a head portion and a tail wire connected to the head portion. The head portions of the signal-transmitting wires is superimposed on the connecting portions and electrically connected to the connecting portions respectively. Furthermore, a method of manufacturing the above touch-sensing electrode structure is also provided.