公开(公告)号：US2683839A

公开(公告)日：1954-07-13

申请号：US13824650

申请日：1950-01-12

Applicant: BECK S INC

Inventor： BECK JOHN T

IPC: H05K1/11 ,  H05K3/06 ,  H05K3/20 ,  H05K3/28 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/116 ,  H05K3/061 ,  H05K3/28 ,  H05K3/281 ,  H05K3/3447 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/09381 ,  H05K2201/2072 ,  H05K2203/0278 ,  H05K2203/0369 ,  H05K2203/063

公开(公告)号：US20240147631A1

公开(公告)日：2024-05-02

申请号：US18279175

申请日：2022-02-25

Applicant: Liquid Wire, LLC

Inventor： Jorge E. Carbo, JR. ,  Sai Srinivas Desabathina ,  Michael Adventure Hopkins ,  Charles J. Kinzel ,  Mark S. Kruskopf ,  Jesse Michael Martinez ,  Katherine M. Nelson ,  Taylor V. Neumann ,  Trevor Antonio Rivera ,  Mark William Ronay ,  Michael Jasper Wallans ,  Austin Michael Clarke

IPC: H05K3/26 ,  H05K1/09 ,  H05K3/32

CPC classification number: H05K3/26 ,  H05K1/092 ,  H05K3/321 ,  H05K2201/032 ,  H05K2201/0382 ,  H05K2203/0257 ,  H05K2203/176 ,  H05K2203/178

Abstract: Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.

公开(公告)号：US09743525B2

公开(公告)日：2017-08-22

申请号：US14963690

申请日：2015-12-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Bong-Soo Kim

IPC: H05K1/18 ,  H05K3/32 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K1/183 ,  H05K1/186 ,  H05K3/0047 ,  H05K3/325 ,  H05K3/326 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2203/107

Abstract: An electronic device embedded substrate and a method of manufacturing the same includes a substrate comprising a cavity formed therein, and an electronic device embedded in the cavity. The substrate and method thereof also include a first support pattern part formed on one surface of the substrate and pressing the electronic device to restrict a movement of the electronic device within the cavity, and a second support pattern part formed on another surface of the core substrate facing opposite to the one surface and extended toward an inside of the cavity to support the electronic device.

公开(公告)号：US20170079129A1

公开(公告)日：2017-03-16

申请号：US15308859

申请日：2015-05-11

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Tou Chin

IPC: H05K1/02 ,  H05K1/18 ,  H02G3/16

CPC classification number: H05K1/0204 ,  B60R16/02 ,  H02G3/16 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/0064 ,  H05K7/20854 ,  H05K2201/0382 ,  H05K2201/066 ,  H05K2201/10272 ,  H05K2201/10409

Abstract: Provided is a circuit assembly including a heatsink, an insulating sheet that is placed on the heatsink, and a circuit boarder that is placed on the heatsink via the insulating sheet. The circuit board is fixed to the heatsink by screwing, and a heat conductive member is arranged between insulating sheet and the circuit board.

Abstract translation: 提供了一种电路组件，其包括散热器，放置在散热器上的绝缘片，以及经由绝缘片放置在散热片上的电路板。 电路板通过旋拧固定到散热器，并且导热部件布置在绝缘片和电路板之间。

公开(公告)号：US09538638B2

公开(公告)日：2017-01-03

申请号：US14520504

申请日：2014-10-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui ,  Noboru Kato

IPC: H01P3/08 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/025 ,  H01P3/08 ,  H01P3/085 ,  H05K1/0221 ,  H05K1/0225 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/147 ,  H05K1/148 ,  H05K2201/0382

Abstract: A high-frequency signal transmission line includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided at the dielectric element assembly, and a first ground conductor provided on a first side in a direction of lamination relative to the signal line and including a plurality of openings arranged along the signal line. The dielectric layer positioned at an end of the first side in the direction of lamination includes an undulating portion provided on a first principal surface located on the first side in the direction of lamination, such that the undulating portion overlaps with the openings when viewed in a plan view in the direction of lamination.

Abstract translation: 高频信号传输线包括：介质元件组件，其包括彼此层压的多个电介质层，设置在电介质元件组件处的线性信号线;以及第一接地导体，其设置在层叠相对方向上的第一侧上 并且包括沿信号线布置的多个开口。 位于层叠方向上的第一侧端部的电介质层包括设置在层叠方向上位于第一侧的第一主表面上的起伏部分，使得当以层叠方式观察时起伏部分与开口重叠 在层叠方向的平面图。

公开(公告)号：US09436905B2

公开(公告)日：2016-09-06

申请号：US14753843

申请日：2015-06-29

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Hiroyoshi Gotou

IPC: G06K19/077 ,  H05K3/40

CPC classification number: G06K19/07783 ,  G06K19/07754 ,  H05K3/4038 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10098 ,  H05K2203/0195 ,  H05K2203/107 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: A method for manufacturing an antenna sheet. The method is for connecting at least one of an antenna coil and a connection pattern, to a conductive member. The at least one of the antenna coil and the connection pattern is provided on one surface of a substrate and the conductive member is provided on the other surface of the substrate. The method includes a pressing process performed to form a first through hole to the substrate, wherein the first through hole passes through the substrate, and to bring the at least one of the antenna coil and the connection pattern, and the conductive member into contact with each other. The method also includes a melting process performed to melt the at least one of the antenna coil and the connection pattern, and the conductive member to each other.

Abstract translation: 一种天线片的制造方法。 该方法用于将天线线圈和连接图案中的至少一个连接到导电构件。 天线线圈和连接图案中的至少一个设置在基板的一个表面上，并且导电构件设置在基板的另一个表面上。 该方法包括对基板形成第一通孔进行压制处理，其中第一通孔穿过基板，并使天线线圈和连接图案中的至少一个与导电部件接触 彼此。 该方法还包括将天线线圈和连接图案中的至少一个和导电构件彼此熔化的熔化过程。

公开(公告)号：US20160103146A1

公开(公告)日：2016-04-14

申请号：US14878457

申请日：2015-10-08

Applicant: Continental Automotive Systems, Inc.

Inventor： Gaetan Vich

IPC: G01P1/02 ,  G01P3/42

CPC classification number: G01P1/026 ,  G01P3/42 ,  H05K1/184 ,  H05K3/326 ,  H05K2201/0382 ,  H05K2201/0969 ,  H05K2201/10454 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A sensor assembly comprises an electronic component portion, wherein the electronic component is a metal electrode leadless face style component and a terminal portion, wherein the terminal portion defines a through hole and the electronic component portion is received within the through hole. The electronic component portion has a press fit with the terminal portion to retain the electronic component portion to the terminal portion.

Abstract translation: 传感器组件包括电子部件部分，其中电子部件是金属电极无引线表面型部件和端子部分，其中端子部分限定通孔并且电子部件部分被容纳在通孔内。 电子部件部分与端子部分压配合以将电子部件部分保持在端子部分。

公开(公告)号：US08959764B2

公开(公告)日：2015-02-24

申请号：US12614231

申请日：2009-11-06

Applicant: Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

Inventor： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

IPC: H01R43/00

CPC classification number: H01L24/14 ,  H01L21/486 ,  H01L23/48 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/11622 ,  H01L2224/1182 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/81101 ,  H01L2224/81208 ,  H01L2224/81899 ,  H01L2225/06513 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/15313 ,  H01L2924/15323 ,  H01L2924/15333 ,  H01R13/02 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/064 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.

Abstract translation: 一种用于制造用于微电子制造的接触结构的结构和方法，包括以下步骤：形成第一和第二金属片以形成多个向外延伸的凸起，每个限定腔。 将第一和第二金属板彼此相对地对称地配合，以形成每个限定其间的外壳的上凸块和下凸块，其中配合的第一和第二板形成接触结构。 用绝缘材料涂覆接触结构，并从上部和下部凸块制造螺旋形接触。 具有彼此成镜像关系的第一和第二部分的螺旋形接触件。

公开(公告)号：US20140326483A1

公开(公告)日：2014-11-06

申请号：US13887807

申请日：2013-05-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Craig N. DeVarney

IPC: H05K3/04 ,  H05K1/00

CPC classification number: H05K3/045 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2203/025

Abstract: Methods for fabricating printed circuit boards, devices for use in the fabrication of printed circuit boards, and structures for a printed circuit board. A mold may be formed as a device that includes a plurality of features, such as recesses, corresponding to a layout of a plurality of conductors for the printed circuit board. A sheet comprised of an electrically-conductive material may be deformed to match the features of the mold. A substrate may then be added to support the sheet, and the sheet may be selectively removed with a mechanical process to define the conductors of the printed circuit board.

Abstract translation: 制造印刷电路板的方法，用于制造印刷电路板的装置以及用于印刷电路板的结构。 模具可以形成为包括对应于用于印刷电路板的多个导体的布局的多个特征（例如凹部）的装置。 由导电材料构成的片材可以变形以匹配模具的特征。 然后可以添加衬底以支撑片材，并且可以用机械工艺选择性地去除片材以限定印刷电路板的导体。

公开(公告)号：US20140137380A1

公开(公告)日：2014-05-22

申请号：US14164327

申请日：2014-01-27

Applicant: YAZAKI CORPORATION

Inventor： Manabu SAKAI

IPC: H01R43/16 ,  B60Q3/00

CPC classification number: H01R43/16 ,  B60Q3/51 ,  F21S43/195 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10272 ,  Y10T29/5191

Abstract: A busbar cutting unit for cutting a blidge portion of a busbar plate having a plurality of busbars coupled to each other with the bridge portion so that the busbars serve as electric circuits respectively, includes an attachment portion to which the busbar plate is attached, a reception portion that receives bridge pieces formed by cutting the bridge portion of the busbar plate when the bridge portion of the busbar plate is pressed down toward the attachment portion, and a welding portion that is made of an electrical insulation material and is welded to the bridge pieces received in the reception portion.

Abstract translation: 一种母线切割单元，用于切割具有多个汇流条的母线板的凸起部分，所述母线彼此耦合到所述桥接部分，使得所述汇流条分别用作电路，包括附接部分，所述母线板附接到所述附接部分， 接收将母线板的桥接部分朝向安装部压下时通过切断母线板的桥接部而形成的桥接部的部分，以及由电绝缘材料制成并焊接在桥接件上的焊接部 在接收部分收到。