公开(公告)号：US20050017344A1

公开(公告)日：2005-01-27

申请号：US10828160

申请日：2004-04-21

Applicant: Hisanobu Utsunomiya

Inventor： Hisanobu Utsunomiya

IPC: H05K1/18 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L25/00 ,  H05K1/02 ,  H05K1/14 ,  H01L23/053

CPC classification number: H01L24/10 ,  H01L23/48 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/145 ,  H05K2201/1053 ,  H05K2201/10583 ,  H01L2924/00

Abstract: The wide usable interconnecting component of the present invention is capable of reducing number of components or electric elements and reducing number of interconnecting sections without limiting circuit design. The interconnecting component electrically interconnects electric components, and the interconnecting component acts as an electric element. Namely, the interconnecting component acts as a passive element or an active element.

Abstract translation: 本发明的广泛可用的互连部件能够减少部件或电气元件的数量并减少互连部件的数量而不限制电路设计。 互连部件电连接电气部件，并且互连部件用作电气元件。 即，互连部件用作无源元件或有源元件。

公开(公告)号：US20040235317A1

公开(公告)日：2004-11-25

申请号：US10488270

申请日：2004-03-01

Inventor： Peter Schiefer

IPC: H01R012/00

CPC classification number: H05K9/0026 ,  H05K1/181 ,  H05K3/301 ,  H05K5/0056 ,  H05K5/0069 ,  H05K9/0037 ,  H05K9/0049 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10583 ,  H05K2203/1572 ,  Y02P70/611

Abstract: The invention relates to a housing device for an electrical device (1), with at least two housing parts (2, 3) and an electronic circuit on a printed circuit board (4), which can be disposed in the device (1) and has a conductive layer that is connected to the housing mass of at least one metallic housing part (2). A housing part (3) is a plastic part into which is integrated at least the connecting device (9) for supplying power to the device and/or for transmitting signals to the electronic circuit. The printed circuit board (4) is equipped on both sides: components (5) that are sensitive to radiated interference are disposed on the side that is largely enclosed by the metallic housing part (2) and the conductive layer, and other components (6) and contacts of a connecting device (9) are disposed on the other side of the printed circuit board (4).

Abstract translation: 本发明涉及一种用于电气设备（1）的壳体装置，其中至少两个壳体部分（2,3）和印刷电路板（4）上的电子电路，其可以设置在装置（1）和 具有连接到至少一个金属壳体部分（2）的壳体的导电层。 壳体部分（3）是塑料部分，其中至少集成有连接装置（9），用于向装置提供电力和/或向电子电路发送信号。 印刷电路板（4）装在两面：对辐射干扰敏感的部件（5）设置在主要由金属外壳部分（2）和导电层封闭的一侧以及其它部件（6） ）和连接装置（9）的触点设置在印刷电路板（4）的另一侧。

公开(公告)号：US5786745A

公开(公告)日：1998-07-28

申请号：US597307

申请日：1996-02-06

Applicant: Alexander J. Elliott ,  Lonne L. Mays

Inventor： Alexander J. Elliott ,  Lonne L. Mays

IPC: H01C1/084 ,  H05K3/30 ,  H01C1/08

CPC classification number: H01C1/084 ,  H05K3/303 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10651 ,  Y02P70/613

Abstract: A package (10) has outermost surfaces (12, 13, 14, 16) that form a polygon shape. The body (11) of the package (10) has axial symmetry about an axis (21). A lead (22) exits the package along the axis (21).

Abstract translation: 包装（10）具有形成多边形形状的最外表面（12,13,14,16）。 包装体（10）的主体（11）具有围绕轴线（21）的轴向对称性。 引线（22）沿轴线（21）离开封装。

公开(公告)号：US5679976A

公开(公告)日：1997-10-21

申请号：US367191

申请日：1995-01-13

Applicant: Yoshiaki Nishikawa ,  Yasuyuki Takeda ,  Masanaga Kikuzawa

Inventor： Yoshiaki Nishikawa ,  Yasuyuki Takeda ,  Masanaga Kikuzawa

IPC: B29C45/26 ,  B29C45/14 ,  B29K105/20 ,  B29L31/34 ,  H01G2/06 ,  H01G4/224 ,  H01G13/00 ,  H01L23/28 ,  H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H01L23/48 ,  H01L23/34

CPC classification number: H01G4/224 ,  H01G2/065 ,  H05K1/141 ,  H05K3/301 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4918 ,  H01L2924/13033 ,  H01L2924/30107 ,  H05K1/0284 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/049 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K3/3442 ,  H05K3/368 ,  Y02P70/611

Abstract: The present invention provides a molded electric part which does not include any lead wires and is preferably compact in size and light in weight. The molded electric part of the invention can effectively prevent deterioration of an electric element by molding the element with a resin. The invention is also directed to a method of simultaneously manufacturing a number of products having fixed dimensions and excellent electrical properties through injection molding with a multi-forming mold complex. A molded film capacitor (1) of the invention includes a film capacitor element (2) and an element-receiving body (3) mainly composed of a synthetic resin with high dielectric ability. The film capacitor element (2) is accommodated in an element-receiving recess (7) formed in a substantial center of the element-receiving body (3). A couple of electrodes (2a,2a) formed on both side faces of the film capacitor element (2) are electrically connected with solder (5,5) to a film conductive pattern (4) formed by metal-plating a surface of the element-receiving body (3). Part of the conductive pattern (4) arranged on a bottom face of the element-receiving body (3) forms an outside connection terminal film (8). The film capacitor element (2) is further molded with a sealing resin (6) in an airtight manner for protecting the element-receiving recess (7) from outside humidity.

Abstract translation: PCT No.PCT / JP94 / 00960 Sec。 371日期1995年1月13日 102（e）日期1995年1月13日PCT提交1994年6月14日PCT公布。 第WO94 / 29887号公报 日期1994年12月22日本发明提供一种不包含任何引线的成型电气部件，其重量轻，重量轻。 本发明的模制电气部件可以通过用树脂模制元件来有效地防止电气元件的劣化。 本发明还涉及通过具有多成形模具复合体的注射成型同时制造具有固定尺寸和优异电性能的多种产品的方法。 本发明的成型薄膜电容器（1）包括膜电容器元件（2）和主要由具有高介电能力的合成树脂构成的元件容纳体（3）。 薄膜电容器元件（2）容纳在形成在元件容纳体（3）的大致中心的元件容纳凹部（7）中。 形成在薄膜电容器元件（2）的两个侧面上的几个电极（2a，2a）与焊料（5,5）电连接到薄膜导电图案（4），该导电图案通过金属镀覆元件的表面而形成 接收体（3）。 布置在元件接收体（3）的底面上的导电图案（4）的一部分形成外部连接端子膜（8）。 薄膜电容器元件（2）进一步用密封树脂（6）以气密的方式模制，以保护元件容纳凹部（7）不受外部湿度的影响。

公开(公告)号：US5590029A

公开(公告)日：1996-12-31

申请号：US371720

申请日：1995-01-12

Applicant: H. Scott Estes

Inventor： H. Scott Estes

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/42 ,  H05K7/02

CPC classification number: H05K1/184 ,  H05K1/141 ,  H05K3/301 ,  H05K1/023 ,  H05K1/183 ,  H05K2201/049 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/429 ,  Y02P70/611

Abstract: A space-saving circuit board mounting of a Surface Mounted Technology (SMT) device, such as a resistor, capacitor, ferrite or clock oscillator, is achieved using (1) a single through hole extending transversely through the board substrate, and (2) a cylindrical adapter having a first longitudinal portion coaxially received in the through hole and a second longitudinal portion projecting outwardly therefrom. The second longitudinal adapter portion has a radially inwardly extending notch that receives the SMT device and positions it with its electrically conductive opposite end sections spaced apart in a direction parallel to the axis of the through hole. Spaced apart external metal plating sections on the adapter connect the SMT device end portions to circumferentially separated metal plating segments on the surface of the through hole which, in turn, are representatively connected to ground and signal plane structures within the interior of the board substrate.

Abstract translation: 使用（1）横向延伸穿过基板的单个通孔实现诸如电阻器，电容器，铁氧体或时钟振荡器的表面贴装技术（SMT）器件的节省空间的电路板安装，以及（2） 圆柱形适配器具有同轴地容纳在通孔中的第一纵向部分和从其向外突出的第二纵向部分。 第二纵向适配器部分具有径向向内延伸的凹口，其接收SMT装置并且使其具有在平行于通孔的轴线的方向间隔开的导电相对端部分。 适配器上的间隔开的外部金属镀层部分将SMT器件端部连接到通孔表面上的周向分离的金属电镀部分，其又代表性地连接到板基板内部的接地和信号平面结构。

公开(公告)号：US5564182A

公开(公告)日：1996-10-15

申请号：US438026

申请日：1995-05-08

Applicant: Shary Nassimi

Inventor： Shary Nassimi

IPC: H01C1/02 ,  H01L23/04 ,  H05K3/34

CPC classification number: H01C1/02 ,  H01L23/041 ,  H05K3/341 ,  H05K3/3415 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/10166 ,  H05K2201/10583 ,  H05K2201/10651 ,  H05K2201/10659 ,  H05K2203/0455 ,  H05K3/3447 ,  H05K3/3468 ,  Y02P70/613 ,  Y10T29/49142 ,  Y10T29/49144

Abstract: A method for installing an axial multiple connection component, for connecting to a circuit board, comprising a shell, the shell substantially cylindrical, having two opposite ends. Conducting leads extend from the opposite ends along the axis, for providing two isolated connections to other components on the circuit board. At least one contact ring encircles the shell with the axis at the center of the contact ring, and provides another connection to the other components on the circuit board. The conducting leads are inserted into lead holes on the circuit board, and the contact ring rests against a metallically plated through ring hole. The component is either manually solder utilizing a solder melting tool or alternatively wave soldered onto the circuit board, with the solder wicking up the plated through ring hole to the contact ring to make a good electrical contact therebetween.

Abstract translation: 一种用于安装用于连接到电路板的轴向多重连接部件的方法，包括壳体，壳体基本上为圆柱形，具有两个相对的端部。 导线从轴的相对端延伸，用于提供与电路板上其他部件的两个隔离连接。 至少一个接触环围绕壳体，轴线处于接触环的中心，并提供与电路板上其他部件的另一连接。 导电引线插入电路板上的导线孔中，接触环支撑在金属电镀通孔环上。 组件是使用焊料熔化工具手工焊接或者焊接到电路板上的焊料，焊料将电镀通孔环穿过接触环，以在它们之间形成良好的电接触。

公开(公告)号：US5406458A

公开(公告)日：1995-04-11

申请号：US164977

申请日：1993-12-10

Applicant: Joachim Schutt

Inventor： Joachim Schutt

IPC: H05K1/11 ,  H05K3/34 ,  H05K7/10

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed circuit board (23) having a plurality of solder coated contact pads (24, 26) for the surface mounting of electrical components (10.sup.1) thereon. Each pad (24, 26) has a rectangular portion and a triangular portion extending in the direction of the component's body (18) so as to reduce the amount of solder (28) located under the body (18) while not disadvantageously affecting the tolerance with which connector caps (20, 22) of the components (10.sup.1) can be mounted on, and bonded to, the pads (24, 26). This arrangement inhibits the formation of solder droplets on the printed circuit board (23) during the bonding process. At least one of the components fixed to the connector pads has an elongated electrically insulating body portion provided at its ends with connector portions which are respectively bonded to the connector pads. The dimension of the rectangular portion of each pad which is at right angles to the longitudinal axis of the associated component is less than the transverse dimension of the associated connector portion of the associated component. The connector portions of the electrical component extend over and are soldered to parts of both the rectangular and the triangular portions of each of the pads.

Abstract translation: 一种印刷电路板（23），其具有用于在其上表面安装电气部件（101）的多个焊料涂覆的接触焊盘（24,26）。 每个垫（24,26）具有矩形部分和在部件本体（18）的方向上延伸的三角形部分，以便减少位于主体（18）下方的焊料（28）的量，同时不影响公差 组件（101）的连接器帽（20,22）可以安装在衬垫（24,26）上并结合到衬垫（24,26）上。 这种布置抑制了在接合过程中印刷电路板（23）上的焊料液滴的形成。 固定到连接器焊盘的部件中的至少一个具有细长的电绝缘主体部分，其在其端部设置有连接器部分，连接器部分分别连接到连接器焊盘。 每个垫的与相关联的部件的纵向轴线成直角的矩形部分的尺寸小于相关部件的相关联的连接器部分的横向尺寸。 电气部件的连接器部分延伸并焊接到每个焊盘的矩形和三角形部分的部分。

公开(公告)号：US4873764A

公开(公告)日：1989-10-17

申请号：US260852

申请日：1988-10-21

Applicant: Frank W. Grimm

Inventor： Frank W. Grimm

IPC: H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K1/184 ,  H05K1/036 ,  H05K1/145 ,  H05K2201/0133 ,  H05K2201/043 ,  H05K2201/091 ,  H05K2201/09845 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K3/4046 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/53174

Abstract: A process is disclosed for use in the manufacture of layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon. The assembly has at least one inner layer between the first and second layers for receiving and retaining a surface-mount device inserted through aligned holes in the layers. The device has an electrically conductive cap at each end for electrical connection to the conductive patterns. The inner layer physically retains the surface-mount device in place pending the electrical connection of the end caps to the conductive patterns, and by virtue of its being inherently compliant and yielding, provides for physically retaining the surface-mount device in place pending the electrical and mechanical connection of the electrically conductive end caps to the conductive patterns.

Abstract translation: 公开了一种用于制造具有其上具有导电图案的第一和第二层的分层印刷电路板组件的方法。 组件在第一和第二层之间具有至少一个内层，用于接收和保持插入层中对准的孔的表面安装装置。 该装置在每个端部具有导电盖，用于与导电图案电连接。 内层将表面贴装器件物理地保持在适当位置，等待端盖与导电图案的电连接，并且由于其本身具有柔顺性和屈服性，从而将表面贴装器件物理地保持在适当位置，等待电气 以及导电端盖与导电图案的机械连接。

公开(公告)号：US3197164A

公开(公告)日：1965-07-27

申请号：US38457664

申请日：1964-07-16

Applicant: HANSEN CIAUDE A

Inventor： HANSEN CIAUDE A

IPC: F16L3/04 ,  F16L3/123 ,  F16L3/233 ,  H05K3/30

CPC classification number: H05K3/301 ,  F16L3/04 ,  F16L3/1236 ,  F16L3/233 ,  H05K2201/10287 ,  H05K2201/10583 ,  H05K2201/10598 ,  H05K2201/10606 ,  Y10S411/907 ,  Y10S411/92 ,  Y10T24/1498 ,  Y10T24/3444

公开(公告)号：US20240321483A1

公开(公告)日：2024-09-26

申请号：US18538822

申请日：2023-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehoon Kim ,  Hyun-Ji Song

IPC: H01B7/04 ,  H01B7/02 ,  H01G4/08 ,  H01G4/14 ,  H01L23/498 ,  H05K1/18

CPC classification number: H01B7/04 ,  H01B7/0216 ,  H01G4/085 ,  H01G4/14 ,  H01L23/49822 ,  H05K1/183 ,  H01G4/01 ,  H01G4/012 ,  H05K2201/10015 ,  H05K2201/10583

Abstract: A wire structure includes a metal layer, a dielectric layer covering at least a portion of an outer surface of the metal layer, and a filling material provided in the dielectric layer, wherein a flexibility of the filling material is higher than a flexibility of the dielectric layer.