公开(公告)号：US4962363A

公开(公告)日：1990-10-09

申请号：US335682

申请日：1989-04-10

Applicant: William F. Sexton, Jr.

Inventor： William F. Sexton, Jr.

IPC: H01H85/041 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01H85/0418 ,  H05K3/3442 ,  H01H2085/0414 ,  H05K2201/10181 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10916 ,  H05K3/303 ,  Y02P70/611 ,  Y02P70/613

Abstract: A surface mountable leadless fuse generally includes a tubular fuse sub-assembly with an insulating body molded thereto in intimate sealing relation. The tubular fuse sub-assembly includes a nonconductive tubular housing, cup-shaped metal end caps enclosing the housing. The insulating body includes an upper and lower portion which are integral as molded. The end caps protrude from a bottom surface of the insulating body so that the fuse can engage the flat conductive areas of a circuit board for soldering thereto without obstructiion of the insulting body. The end caps also protrude from the end surfaces so that visual inspection and solder wetting are unobstructed. The lower portion of the insulating body covers an exposed portion of the tubular housing. A pair of anti-rolling legs depend from opposed margins of the bottom surface to prevent the fuse from rolling off of the circuit board once placed there.

Abstract translation: 可表面安装的无铅保险丝通常包括管状保险丝子组件，其具有以密封密封关系模制到其上的绝缘体。 管状保险丝子组件包括不导电的管状壳体，封闭壳体的杯形金属端盖。 绝缘体包括上模和下模一体的模制件。 端盖从绝缘体的底面突出，使得保险丝可以与电路板的平坦导电区域接合，以焊接到绝缘体上，而不会妨碍绝缘体。 端盖也从端面突出，使得目视检查和焊料润湿不受阻碍。 绝缘体的下部覆盖管状壳体的暴露部分。 一对抗滚动支腿从底面的相对边缘取决于防止保险丝在放置于电路板之后从电路板滚下。

公开(公告)号：US4845452A

公开(公告)日：1989-07-04

申请号：US254324

申请日：1988-10-05

Applicant: Yoshinori Sasaki ,  Toshihiro Kuroshima ,  Sumio Takahashi

Inventor： Yoshinori Sasaki ,  Toshihiro Kuroshima ,  Sumio Takahashi

IPC: H01F17/06 ,  H01G4/40 ,  H03H1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC classification number: H03H1/00 ,  H05K1/0233 ,  H05K3/3442 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/165 ,  H05K1/183 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/10015 ,  H05K2201/1028 ,  H05K2201/10636 ,  H05K2201/10916 ,  H05K3/4015 ,  Y02P70/611 ,  Y02P70/613

Abstract: A composite bead element comprises a chip-like magnetic body in a shape of a nearly rectangular parellelepiped in which a recess is provided, at least one feed-through holes formed in said body and an electronic component inserted in said recess. Bead inductors are formed by conductors provided in said feed-through holes, and said electronic component and said conductors are connected by predetermined conductors on a surface of said body.

公开(公告)号：US3504328A

公开(公告)日：1970-03-31

申请号：US3504328D

申请日：1968-01-03

Applicant: BERG ELECTRONICS INC

Inventor： OLSSON BILLY E

IPC: H05K3/34 ,  H05K3/40 ,  H05K1/10 ,  H01R9/06 ,  H01R9/16

CPC classification number: H05K3/4046 ,  H01R12/58 ,  H05K3/3447 ,  H05K2201/10401 ,  H05K2201/10916

公开(公告)号：US3159906A

公开(公告)日：1964-12-08

申请号：US66171757

申请日：1957-05-27

Applicant: GEN ELECTRIC

Inventor： TELFER THOMAS A

IPC: H05K3/34 ,  H05K3/40

CPC classification number: H05K3/4046 ,  H01R12/58 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/10401 ,  H05K2201/10916 ,  H05K2203/0415 ,  Y10T29/49149 ,  Y10T29/53183

公开(公告)号：US1174378A

公开(公告)日：1916-03-07

申请号：US2041915

申请日：1915-04-10

Applicant: OTTO KESSLER ,  BACON WILLIAM S

Inventor： BACON WILLIAM S

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K1/11 ,  H05K3/3447 ,  H05K2201/1031 ,  H05K2201/10916 ,  H05K2203/176 ,  Y02P70/611

公开(公告)号：US09999123B2

公开(公告)日：2018-06-12

申请号：US15075064

申请日：2016-03-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Arata Kishi ,  Tadashi Maeda ,  Tadahiko Sakai

IPC: H05K1/02 ,  H05K1/11 ,  B23K1/00 ,  B23K35/26 ,  B23K35/36 ,  B23K35/362 ,  H05K1/14 ,  H05K1/09 ,  H05K1/00 ,  H05K7/00 ,  H01R12/71

CPC classification number: H05K1/0274 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/264 ,  B23K35/3613 ,  B23K35/362 ,  H01R12/714 ,  H05K1/09 ,  H05K1/092 ,  H05K1/097 ,  H05K1/11 ,  H05K1/111 ,  H05K1/14 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/0326 ,  H05K2201/10136 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

公开(公告)号：US20150208506A1

公开(公告)日：2015-07-23

申请号：US14420681

申请日：2012-08-10

Applicant: Igor Perez-Uria ,  Per Ferm ,  Benny Gustafson

Inventor： Igor Perez-Uria ,  Per Ferm ,  Benny Gustafson

IPC: H05K1/14 ,  H05K3/10 ,  H05K3/42 ,  H05K1/11

CPC classification number: H05K1/144 ,  H05K1/115 ,  H05K1/141 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3494 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4053 ,  H05K3/42 ,  H05K2201/0248 ,  H05K2201/0305 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10878 ,  H05K2201/10916 ,  H05K2203/0338 ,  H05K2203/0455 ,  H05K2203/1105 ,  Y10T29/49124

Abstract: The present invention relates to a printed circuit board arrangement and a method for forming an electrical connection at a printed circuit board. The printed circuit board arrangement comprises a printed circuit board having an electrical connection electrically connecting a first conductive layer on a first side of the printed circuit board and a second conductive layer on a second side of the printed circuit board. The electrical connection comprises a passage extending from an opening in one of the sides of the printed circuit board through the printed circuit board between the first and second layers. Electrically conducting material is formed on the walls of the passage and forms a first path electrically connecting the first conductive layer with the second conductive layer. At least one first ball is enclosed by the passage and forms part of a second electrical path between the first and second conductive layers of the printed circuit board, said second electrical path having a lower resistance than the first path.

Abstract translation: 本发明涉及印刷电路板装置和在印刷电路板上形成电连接的方法。 印刷电路板布置包括印刷电路板，其具有电连接印刷电路板的第一侧上的第一导电层和印刷电路板的第二侧上的第二导电层的电连接。 电连接包括从印刷电路板的一侧的开口延伸穿过第一和第二层之间的印刷电路板的通道。 导电材料形成在通道的壁上，并形成将第一导电层与第二导电层电连接的第一路径。 至少一个第一球被通道包围，并形成印刷电路板的第一和第二导电层之间的第二电路的一部分，所述第二电路具有比第一路径更低的电阻。

公开(公告)号：US20130135578A1

公开(公告)日：2013-05-30

申请号：US13482094

申请日：2012-05-29

Applicant: Randall Braxton Pugh ,  Adam Toner ,  Praveen Pandojirao-S ,  James Daniel Riall ,  Daniel B. Otts ,  Edward Kernick

Inventor： Randall Braxton Pugh ,  Adam Toner ,  Praveen Pandojirao-S ,  James Daniel Riall ,  Daniel B. Otts ,  Edward Kernick

IPC: G02C7/04

CPC classification number: H05K3/301 ,  G02C7/04 ,  G02C7/083 ,  G02C7/101 ,  H05K1/0274 ,  H05K1/189 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10568 ,  H05K2201/10727 ,  H05K2201/10916 ,  H05K2201/10984

Abstract: Ophthalmic lenses, including contact lenses may be enhanced through the incorporation of both active and passive electrical components. Electrical interconnects and die attachment configurations are required to ensure electrical connectivity between the components and the optic portion of the lens as well as providing a means for mounting planar devices on spherical surfaces. Electrical interconnects and die attachment for powered ophthalmic devices, including contact lenses includes realizing conductive traces on optical plastic, attaching planar dies to spherical surfaces and underfilling, overmolding and light blocking to complete the lens.

Abstract translation: 包括隐形眼镜在内的眼科镜片可以通过并入有源和无源电气元件来增强。 需要电互连和管芯附接配置以确保部件和透镜的光学部分之间的电连接以及提供用于将平面器件安装在球形表面上的装置。 用于动力眼科装置（包括隐形眼镜）的电互连和芯片附件包括在光学塑料上实现导电迹线，将平面裸片附接到球形表面和底部填充，包覆成型和遮光以完成透镜。

公开(公告)号：US20080198619A1

公开(公告)日：2008-08-21

申请号：US11798043

申请日：2007-05-09

Applicant: Ming-Chuan Chen ,  Kuo-Ann Chu

Inventor： Ming-Chuan Chen ,  Kuo-Ann Chu

IPC: F21S4/00

CPC classification number: F21V19/0085 ,  G02F1/133604 ,  H05K3/325 ,  H05K2201/10113 ,  H05K2201/10393 ,  H05K2201/10446 ,  H05K2201/10916

Abstract: A tube installation of a backlight module allowing fast and easy assembly and disassembly of tube without depending on a soldering process is comprised of a substrate, multiple tubes and a locating means; a terminal of each tube being provided with a conductor comprised of a first bending portion and a second bending portion with a terminal of the second bending portion serving as a contact portion; the locating means being placed below the substrate for the contact portion to contact the substrate so to secure the tube to where above the substrate.

Abstract translation: 背光模块的管装置包括：基板，多个管和定位装置，其能够快速且容易地组装和拆卸管而不依赖于焊接工艺。 每个管的端子设置有由第一弯曲部和第二弯曲部构成的导体，第二弯曲部的端子用作接触部; 所述定位装置被放置在所述基板的下方以使所述接触部分接触所述基板，从而将所述管固定到所述基板上方的位置。

公开(公告)号：US07277297B2

公开(公告)日：2007-10-02

申请号：US11066877

申请日：2005-02-25

Applicant: Mudasir Ahmad ,  Mason Hu ,  Robert Pattison ,  David Anthony Popovich

Inventor： Mudasir Ahmad ,  Mason Hu ,  Robert Pattison ,  David Anthony Popovich

IPC: H05K7/00

CPC classification number: H05K3/308 ,  H01R12/523 ,  H01R13/187 ,  H05K2201/1059 ,  H05K2201/10916

Abstract: A device, apparatus and printed circuit board assembly for removably coupling an electrical component with a PCB are described, which provides adequate electromechanical capability, is relatively insensitive to related heating, component removability, replacability and reworkability while minimizing wear and the possibility of resizing and damage. The device includes a sleeve for coupling with a component pin, which encloses the pin and further couples to a conductive barrel interconnecting multiple PCB layers. The sleeve conforms upon insertion within the barrel to its contour. A flange at an end of the sleeve deters over-insertion. The coupling so formed can be gas-tight.

Abstract translation: 描述了一种用于可拆卸地将电气部件与PCB连接的装置，装置和印刷电路板组件，其提供足够的机电能力，对相关加热，部件可移除性，可替换性和可再加工性相对不敏感，同时最小化磨损和调整尺寸和损坏的可能性 。 该装置包括用于与部件销耦合的套筒，其包围销并进一步耦合到互连多个PCB层的导电筒体。 套筒在筒体内插入其轮廓。 套筒末端的凸缘阻止过度插入。 这样形成的联轴器可以是气密的。