UNIFIED VIRTUALIZED AND CONTAINERIZED CI/CD CHAIN

    公开(公告)号:US20240345823A1

    公开(公告)日:2024-10-17

    申请号:US18345433

    申请日:2023-06-30

    CPC classification number: G06F8/65

    Abstract: Examples of the present technology provide automated CI/CD systems that unify the CI/CD methodology for virtualized and containerized software environments. To realize this unification, CI/CD systems of the present technology are intelligently designed to leverage a common set of inputs (i.e., artifacts and deployment descriptors) that can facilitate automatic deployment of the software system in either a virtualized environment, a containerized environment, or both. Accordingly, CI/CD systems of the present technology provide a flexible software development tool that facilitates efficient, and automated deployment of software systems in both virtualized and containerized environments.

    Fluid memory for high performance computing applications

    公开(公告)号:US12111757B2

    公开(公告)日:2024-10-08

    申请号:US17971834

    申请日:2022-10-24

    CPC classification number: G06F12/023 G06F2212/1041

    Abstract: Examples of the presently disclosed technology provide new memory management systems and methods that improve dynamic memory region utilization by: (1) creating a new class/type of dynamic memory regions—i.e., “fluid” dynamic memory regions—that are automatically relinquished to a free pool of dynamic memory regions upon expiration of a “fluid memory validity time interval;” and (2) responsive to requests for dynamic memory regions, allocating “fluid” dynamic memory regions when levels of importance for data to be stored in the requested dynamic memory regions fall below a “data-oriented priority-fluidity threshold.”

    CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS

    公开(公告)号:US20240329342A1

    公开(公告)日:2024-10-03

    申请号:US18740236

    申请日:2024-06-11

    CPC classification number: G02B6/4269 H05K7/20254 H05K7/2049 H05K7/20409

    Abstract: A first electronic device may comprise a chassis and first fins. The chassis may be configured to removably couple with a second electronic device. The first fins are configured to interleave with second fins of the second electronic device in a coupled state of the first and second electronic devices. A corrugated thermal interface device comprises folded fins. The folded fins are coupled to the first fins and are also removably couplable to the second fins in the coupled state of the first and second electronic devices. Each folded fin comprises one or more lateral walls, and the corrugated thermal interface device further comprises a plurality of spring fingers coupled to and extending at least partially in a lateral direction from the lateral walls. The spring finger contacts may be contacted and displaced by the second fins in the coupled state of the first and second electronic devices.

    Reconfiguration of a computing system using a circuit switch

    公开(公告)号:US12105575B2

    公开(公告)日:2024-10-01

    申请号:US18047731

    申请日:2022-10-19

    Inventor: Terrel Morris

    CPC classification number: G06F1/3287 G06F13/1652 G06F13/4022

    Abstract: Example implementations relate to executing a workload in a computing system including processing devices, memory devices, and a circuit switch. An example includes identifying first and second instruction-level portions to be consecutively executed by the computing system; determining a first subset of processing devices and a first subset of memory devices to be used to execute the first instruction-level portion; controlling the circuit switch to interconnect the first subset of processing devices and the first subset of memory devices during execution of the first instruction-level portion; determining a second subset of the processing devices and a second subset of the memory devices to be used to execute the second instruction-level portion; and controlling the circuit switch to interconnect the second subset of processing devices and the second subset of memory devices during execution of the second instruction-level portion.

    Storage array fleet management
    89.
    发明授权

    公开(公告)号:US12101378B2

    公开(公告)日:2024-09-24

    申请号:US18063110

    申请日:2022-12-08

    Abstract: In some examples, a fleet storage provider performs storage management operations for a fleet of storage arrays, the storage arrays in the fleet of storage arrays being of one or more storage types. In response to an addition, to the fleet of storage arrays, of a new storage array of a first storage type different from each storage type of the one or more storage types, a system identifies the new storage array as being associated with a first storage class of a plurality of different storage classes, and associates the new storage array with a fleet service that abstracts component details of the fleet of storage arrays to the fleet storage provider. In response to a request, the system provisions a storage volume on a selected storage array of the fleet of storage arrays, the provisioning performed by the fleet storage provider in cooperation with the fleet service.

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