公开(公告)号：US12101875B2

公开(公告)日：2024-09-24

申请号：US17362734

申请日：2021-06-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： David P. Kopp ,  Karl J. Bois ,  Steven J. Martin

IPC: H03H7/38 ,  G11C5/04 ,  H01P1/203 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0233 ,  G11C5/04 ,  H01P1/203 ,  H03H7/38 ,  H05K3/0005 ,  H05K2201/10159

Abstract: One aspect provides a printed circuit board (PCB). The PCB includes a transmission line to transmit signals of a desired frequency, a first stub coupled to the transmission line at a first location, and a second stub coupled to the transmission line at a second location. The first stub is to filter out signals of a first frequency, the second stub is to filter out signals of a second frequency, and the first and second stubs are positioned such that an insertion loss of the transmitted signals of the desired frequency is substantially minimized.

公开(公告)号：US20220418093A1

公开(公告)日：2022-12-29

申请号：US17362734

申请日：2021-06-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： David P. Kopp ,  Karl J. Bois ,  Steven J. Martin

IPC: H05K1/02 ,  G11C5/04 ,  H05K3/00

Abstract: One aspect provides a printed circuit board (PCB). The PCB includes a transmission line to transmit signals of a desired frequency, a first stub coupled to the transmission line at a first location, and a second stub coupled to the transmission line at a second location. The first stub is to filter out signals of a first frequency, the second stub is to filter out signals of a second frequency, and the first and second stubs are positioned such that an insertion loss of the transmitted signals of the desired frequency is substantially minimized.

公开(公告)号：US20240306352A1

公开(公告)日：2024-09-12

申请号：US18180390

申请日：2023-03-08

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Torsten Wilde ,  Rob J. Rongstad ,  Peter A. Hansen ,  Robert E. Mascia ,  Steven J. Martin ,  Steven J. Dean ,  Harvey E. White, JR. ,  Brian T. Purcell

IPC: H05K7/20

CPC classification number: H05K7/20945 ,  H05K7/20281

Abstract: A process includes communicating a coolant flow between an inlet and an outlet of a coolant subsystem that is associated with a cooling domain to remove thermal energy from a plurality of processor-based nodes of the cooling domain. The communication of the coolant flow has associated predefined parameters. The process includes regulating a temperature of the coolant flow at the outlet. In accordance with example implementations, the regulation includes determining, based on the predefined parameters, a minimum collective power consumption by the processor-based nodes to maintain a temperature of the coolant flow at the outlet at or above a minimum threshold temperature, and based on the minimum power consumption, scheduling jobs to be executed by the nodes.