Abstract:
The present disclosure describes cameras having an optical channel that includes spatially separated sensors for sensing different parts of the optical spectrum. For example, in one aspect, an apparatus includes an image sensor module having an optical channel and including a multitude of spatially separated sensors to receive optical signals in the optical channel. The multitude of spatially separated sensors includes a first sensor operable to sense optical signals in a first spectral range, and a second sensor spatially separated from the first sensor and operable to sense optical signals in a second spectral range different from the first spectral range.
Abstract:
The present disclosure describes structured light projection in which a structured light projector includes a light emitter and a compound patterned mask. The mask includes a spacer substrate that is transparent to a wavelength of light emitted by the light emitter. On a first side of the spacer substrate is a first reflective surface having apertures therein to allow light to pass through. Lenses are arranged to focus light, produced by the light emitter, toward the apertures in the first reflective surface. A second reflective surface on a second side of the spacer substrate opposite the first side has apertures therein to allow light passing through the spacer substrate to exit the compound patterned mask.
Abstract:
A lens module includes a substrate, a first array of passive optical elements on the substrate, and a second array of passive optical elements separate from the first array. The optical elements of the first array and the optical elements of the second array form multiple optical channels, in which at least one optical channel is a catadioptric optical channel including a reflective optical element and a refractive optical element. The reflective optical element is arranged to reflect light toward the refractive optical element, each optical channel has a corresponding field-of-view, and the lens module has an overall field of view defined by the range of angles subtended by the field-of-view of the plurality of optical channels.
Abstract:
An optoelectronic module includes a cover substrate including a passive optical element, a base substrate including an optoelectronic device, and a spacer layer joining the cover substrate to the base substrate. The spacer layer includes multiple first spacer elements fixed to a surface of the cover substrate and multiple second spacer elements fixed to a surface of the base substrate, in which each first spacer element is joined to a corresponding second spacer element through an adhesive layer, and in which the cover substrate, base substrate, and spacer layer define an interior region of the module in which the optical element is aligned with the optoelectronic device.
Abstract:
Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.
Abstract:
Improved field-of-illumination (FOI) and field-of-view (FOV) matching for 3D time-of-flight cameras is provided using light emitters with rectangular reflectors. A better adjustment of the FOI with the camera's FOV has the following advantages: optimal use of emitted light and reduced multi-path problems. Furthermore, embodiments bring the benefit for rather low-cost customization of the illumination to match the FOI to the specified FOV.
Abstract:
Compact thermal sensor modules, which in some implementations can be manufactured in wafer-level fabrication processes, include features composed of or coated with a low-emissivity material to reduce or prevent detection by a sensor of radiation emitted by other parts of the module. For example, spacers that separate an optics substrate and a sensor package from one another can be composed of or coated with such a low emissivity material. In some cases, the low emissivity material has an emissivity of no more than 0.1.
Abstract:
Disclosed is an arrangement for detecting first light (L1) and second light (L2), with the first light (L1) and second light (L2) having no wavelength in common. The arrangement includes a first effective detector area (D1) and a second effective detector area (D2). The first effective detector area (D1) is exposed to the first light (L1) and/or second light (L2) different from the first light (L1) and/or second light (L2) to which the second effective detector area (D2) is exposed when the arrangement is exposed to spatially uniformly distributed first light (L1) and second light (L2). The difference between the first light (L1) and/or second light (L2) to which said first detector area (D1) and second detector area (D2) are exposed to can be a difference in intensity and/or difference in an angle of incidence relative to the arrangement.
Abstract:
The invention relates to wafer-level manufacturing of optical devices such as modules comprising micro-lenses. In one aspect, passive optical components such as truncated lenses are manufactured by providing a substrate on which a multitude of precursor optical structures is present; and removing material from each of said multitude of precursor optical structures. Another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, said method comprising the steps of using a tool obtained by carrying out the steps of manufacturing a precursor tool having a replication surface; and modifying said replication surface by removing material from said precursor tool. An yet another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, wherein the method comprises the step of using a master comprising a replication surface comprising, for each of said passive optical components, a first portion describing a shape corresponding to the shape of at least a portion of the respective passive optical component, wherein the master comprises, in addition, at least one protruding portion protruding from at least one of said first portions of said replication surfaces.
Abstract:
Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.