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公开(公告)号：US10256028B2
公开(公告)日：2019-04-09
申请号：US15086333
申请日：2016-03-31
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first, second and third buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
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82.发明申请公开(公告)号：US20190059154A1
公开(公告)日：2019-02-21
申请号：US15826694
申请日：2017-11-30
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Chin-Kuan Liu , Chao-Lung Wang , Shuo-Hsun Chang , Yu-Te Lu , Chin-Hsi Chang
Abstract: A multi-layer circuit board capable of being applied with electrical testing includes a metallic delivery loading plate, a bottom-layer circuit structure, a conductive corrosion-barrier layer, and a multi-layer circuit structure. The bottom-layer circuit structure is overlapping on the delivery loading plate. The conductive corrosion-barrier layer is disposed on the bottom dielectric layer. The multi-layer circuit structure is overlapping on the bottom-layer circuit structure. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the inner-layer circuit of the multi-layer circuit structure and the bottom-layer circuit of the bottom-layer circuit structure. The delivery loading plate and the bottom dielectric layer of the bottom-layer circuit structure expose the conductive corrosion-barrier layer. Therefore, before the multi-layer circuit board is packaged, an electrical testing can be applied to the multi-layer circuit board to check if it can be operated normally.
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公开(公告)号：US10039185B2
公开(公告)日：2018-07-31
申请号：US15130724
申请日：2016-04-15
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K1/115 , H05K1/113 , H05K3/0047 , H05K3/0079 , H05K3/0094 , H05K3/108 , H05K3/18 , H05K3/429 , H05K3/4644 , H05K3/4647 , H05K2203/054 , Y10T29/49165
Abstract: Provided is a landless multilayer circuit board and a manufacturing method thereof. The manufacturing method includes steps of forming a first circuit on a first substrate, patterning a photoresist layer to form at least one via between the first circuit and a second circuit, forming at least one connecting pillar in the at least one via, removing the photoresist layer, forming a second substrate to cover the at least one connect pillar, and forming the second circuit on the second substrate. The second circuit is connected to the first circuit through the at least one connecting pillar. When the second circuit is formed, the at least one via does not need to be filled, thereby making the second circuit flat.
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公开(公告)号：US20180132351A1
公开(公告)日：2018-05-10
申请号：US15863605
申请日：2018-01-05
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K1/09 , H05K1/0298 , H05K1/144 , H05K3/4614 , H05K2201/0367 , H05K2201/042 , H05K2201/09472
Abstract: A multi-layer circuit board includes a first circuit board, conducting blocks, a second circuit board, and conducting recesses. The first circuit board has a first conductor layer mounted on the first circuit board. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the second circuit board, electrically connected to the second conductor layer, and corresponding to the respective conducting blocks. The insulating layer is mounted between the first conductor layer and the second conductor layer. The second circuit board is on the first circuit board, the conducting blocks are respectively mounted in the conducting recesses to electrically connect the first conductor layer and the second conductor layer.
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公开(公告)号：US09901016B1
公开(公告)日：2018-02-20
申请号：US15488133
申请日：2017-04-14
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yung-Lin Chia
IPC: H05K9/00
CPC classification number: H05K9/0037 , H05K9/003
Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. A protective layer, an antirust layer, and a shielding layer are sequentially mounted on the conductive paste. The EMI shielding device is mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.
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Patent Agency Ranking
公开(公告)号：US20170318671A1
公开(公告)日：2017-11-02
申请号：US15143354
申请日：2016-04-29
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K1/09 , H05K1/0298 , H05K1/144 , H05K3/4614 , H05K2201/0367 , H05K2201/042 , H05K2201/09472
Abstract: A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the surface of the second circuit board. Each conducting recess has a conducting layer electrically connected to the second conductor layer. When the conducting blocks are mounted in the conducting recesses, the first conductor layer and the second conductor layer are electrically connected through the conducting blocks and the conducting recesses. As can be separated from the first circuit board for test of the two conductor layers, the yield of the second circuit board is enhanced.
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公开(公告)号：US20170311443A1
公开(公告)日：2017-10-26
申请号：US15138261
申请日：2016-04-26
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao LIN , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K3/42 , H05K1/0284 , H05K1/0296 , H05K1/112 , H05K3/007 , H05K3/4647 , H05K2201/0376 , H05K2203/0733 , H05K2203/1476 , Y10T29/49165
Abstract: Provided is a double layer circuit board and a manufacturing method thereof. The double layer circuit board comprises a substrate, a first circuit layer formed on a first surface of the substrate, a second circuit layer formed on a second surface of the substrate, and at least one connecting pillar formed in and covered by the substrate. Each one of the at least one connecting pillar includes a first end connected to the first circuit layer and a second end connected to the second circuit layer. A terminal area of the second end is greater than a terminal area of the first end. Therefore, the second circuit layer is firmly connected to the first circuit layer through the at least one connecting pillar. A yield rate of the double layer circuit board may be increased.
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公开(公告)号：US20170287617A1
公开(公告)日：2017-10-05
申请号：US15086333
申请日：2016-03-31
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F2027/2809 , H05K1/0393 , H05K1/113 , H05K1/118 , H05K1/165 , H05K3/4617 , H05K3/4644
Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first, second and third buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
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公开(公告)号：US20170103844A1
公开(公告)日：2017-04-13
申请号：US14877981
申请日：2015-10-08
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F41/041 , H01F2027/2809 , H05K1/00 , H05K1/165 , H05K3/00 , H05K3/4635 , H05K2201/09063
Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.
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公开(公告)号：US20160374206A1
公开(公告)日：2016-12-22
申请号：US14742070
申请日：2015-06-17
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Jaen-Don Lan , PIN-CHUNG LIN , CHEN-RUI TSENG , CHENG-EN HO , YU-AN CHEN
IPC: H05K3/00 , B23K26/402 , H05K3/16 , B23K26/386
CPC classification number: B23K26/402 , B23K26/382 , B23K26/389 , B23K2101/40 , B23K2103/172 , B23K2103/30 , B23K2103/42 , B23K2103/50 , H05K3/426 , H05K3/4644 , H05K2201/0341
Abstract: Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 μm for fine line width/pitch.
Abstract translation: 公开了一种制造电路板的方法，包括制备具有树脂层和停止层的基板，形成穿过树脂层的至少一个导电孔并在停止层处停止，通过溅射工艺形成第一金属层， 通过化学镀工艺在第一金属层上形成第二金属层，形成具有电路图案的第三金属层，暴露第二金属层的一部分并通过电镀工艺填充导电孔，并蚀刻第二金属层 以及第二金属层下面的第一金属层，以暴露第一金属层下的树脂层。 由于第一金属层提供优异的表面性质，所以第二和第三金属层是良好固定和稳定的。 蚀刻电路图案对于细线宽/间距具有小于10μm的线宽/间距。
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