公开(公告)号：US20220336718A1

公开(公告)日：2022-10-20

申请号：US17856465

申请日：2022-07-01

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO

IPC: H01L33/60 ,  H01L33/54 ,  H01L25/075 ,  H01L33/10 ,  H01L33/38 ,  H01L33/50 ,  H01L33/62

Abstract: A light-emitting device includes a carrier, a light-emitting unit disposed on the carrier, a reflective element arranged on the light-emitting unit, and an optical element arranged on the carrier and surrounding the light-emitting unit.

公开(公告)号：US20220310555A1

公开(公告)日：2022-09-29

申请号：US17838307

申请日：2022-06-13

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Ying-Yang SU ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L23/498 ,  B23K26/22

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

公开(公告)号：US20210381659A1

公开(公告)日：2021-12-09

申请号：US17367820

申请日：2021-07-06

Applicant: EPISTAR CORPORATION

Inventor： Chiu-Lin YAO ,  Min-Hsun HSIEH ,  Been-Yu LIAW ,  Wei-Chiang HU ,  Po-Hung LAI ,  Chun-Hung LIU ,  Shih-An LIAO ,  Yu-His SUNG ,  Ming-Chi HSU

IPC: F21K9/235 ,  H01L25/075 ,  F21K9/232

Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

公开(公告)号：US20210335641A1

公开(公告)日：2021-10-28

申请号：US17367067

申请日：2021-07-02

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  De-Shan KUO ,  Chang-Lin LEE ,  Jhih-Yong YANG

IPC: H01L21/677 ,  H01L33/00 ,  H01L21/683 ,  H01L21/67

Abstract: A chip transferring method includes providing a plurality of chips on a first load-bearing structure; measuring a photoelectric characteristic value of each of the plurality of chips; categorizing the plurality of chips into a first portion chips and a second portion chips according to the photoelectric characteristic value of each of the plurality of chips; providing a second load-bearing structure; weakening a first adhesion between the first portion chips and the first load-bearing structure or between the second portion chips and the first load-bearing structure; and transferring the first portion chips or the second portion chips to the second load-bearing structure.

公开(公告)号：US20210288232A1

公开(公告)日：2021-09-16

申请号：US17332378

申请日：2021-05-27

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Hsin-Mao LIU ,  Ying-Yang SU

IPC: H01L33/58 ,  H01L25/075 ,  H01L23/00 ,  H01L33/50 ,  H01L27/15 ,  H01L33/60

Abstract: A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2˜150.

公开(公告)号：US20210273138A1

公开(公告)日：2021-09-02

申请号：US17322459

申请日：2021-05-17

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang LIU ,  Ming-Chi HSU ,  Shih-An LIAO ,  Jen-Chieh YU ,  Min-Hsun HSIEH ,  Jia-Tay KUO ,  Yu-His SUNG ,  Po-Chang CHEN

IPC: H01L33/38 ,  H01L33/10 ,  H01L33/00 ,  H01L33/32 ,  H01L33/46 ,  H01L33/24

Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.

公开(公告)号：US20210226101A1

公开(公告)日：2021-07-22

申请号：US17220343

申请日：2021-04-01

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Cheng-Nan HAN ,  Steve Meng-Yuan HONG ,  Hsin-Mao LIU ,  Tsung-Xian LEE

IPC: H01L33/50 ,  H01L21/683 ,  H01L23/00 ,  H01L33/38 ,  H01L33/48 ,  H01L33/56

Abstract: An embodiment of the invention discloses an optoelectronic system comprising a plurality of optoelectronic elements, wherein each of the plurality of optoelectronic elements comprises a semiconductor epitaxial layer, a first electrode, a second electrode, a top surface, a bottom surface, and a plurality of lateral surfaces arranged between the top surface and the bottom surface; a layer covering the plurality of lateral surfaces and comprising a side surface; and a reflecting structure having a shape of pyramid, formed between two adjacent optoelectronic elements of the plurality of optoelectronic elements and electrically separated from the plurality of optoelectronic elements, wherein the reflecting structure is configured to reflect light from the two adjacent optoelectronic elements upwards to leave the optoelectronic system.

公开(公告)号：US20210222861A1

公开(公告)日：2021-07-22

申请号：US17153050

申请日：2021-01-20

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Ying-Yang SU ,  Shih-An LIAO ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

IPC: F21V23/00 ,  H01L25/075 ,  H01L25/16 ,  H01L33/62

Abstract: A light-emitting device includes a first light-emitting module, a second light-emitting module, a conductive layer and an insulation layer. The first light-emitting module includes a first substrate having a first cavity, a first sidewall, and a light-emitting component disposed on the first substrate. The second module includes a second substrate having a second cavity corresponding to the first cavity and a second sidewall corresponding to the first sidewall. The conductive layer is directly connected to the first cavity and the second cavity and electrically connect the first light-emitting module and the second light-emitting module. The insulation layer is directly connected to the first sidewall and the second sidewall.

公开(公告)号：US20210217926A1

公开(公告)日：2021-07-15

申请号：US17219455

申请日：2021-03-31

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Tzer-Perng CHEN ,  Jen-Chau WU ,  Yuh-Ren SHIEH ,  Chuan-Cheng TU

IPC: H01L33/22 ,  H01L23/00 ,  H01L33/00

Abstract: A light-emitting apparatus comprises a board having a plurality of conductive channels penetrating thereof; a plurality of light emitting units for emitting different color lights, disposed on the board and electrically connected to the plurality of conductive channels; and an opaque layer arranged on the board for preventing the plurality of light emitting units from crosstalk, and comprising a plurality of holes for exposing and separating the plurality of light emitting units in a top view.

公开(公告)号：US20210151405A1

公开(公告)日：2021-05-20

申请号：US17163746

申请日：2021-02-01

Applicant: EPISTAR CORPORATION

Inventor： Shih-An LIAO ,  Shau-Yi CHEN ,  Ming-Chi HSU ,  Chun-Hung LIU ,  Min-Hsun HSIEH

IPC: H01L23/00 ,  H01L33/62

Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.