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公开(公告)号：US09952110B2
公开(公告)日：2018-04-24
申请号：US15084232
申请日：2016-03-29
Applicant: Infineon Technologies AG
Inventor： Sebastian Beer , Horst Theuss
IPC: G01F1/68 , G01L9/00 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/495 , H01L23/498 , G01F15/14
CPC classification number: G01L9/0041 , G01F15/14 , G01L19/14 , H01L21/4853 , H01L21/565 , H01L23/3157 , H01L23/4952 , H01L23/49811 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2924/15151 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A pressure sensor package includes a pressure sensor having a first side attached to a substrate and a second side opposite the first side, the first side having a pressure inlet aligned with an opening in the substrate, the second side having one or more electrical contacts. A logic die attached to an opposite side of the substrate as the pressure sensor is operable to process signals from the pressure sensor. First electrical conductors connect to the one or more electrical contacts of the pressure sensor. Second electrical conductors connect to one or more electrical contacts of the logic die. A mold compound completely encapsulates the second electrical conductors and at least partly encapsulates the logic die and the first electrical conductors. An open passage in the mold compound is aligned with the opening in the substrate so as to define a pressure port of the pressure sensor package.
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公开(公告)号：US09790086B2
公开(公告)日：2017-10-17
申请号：US15268244
申请日：2016-09-16
Applicant: Infineon Technologies AG
Inventor： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
CPC classification number: B81B7/02 , B81B3/0021 , B81B3/0072 , B81B2201/0235 , B81B2201/0264 , B81C2203/0154 , G01L1/18 , G01L9/0072 , G01L19/0092 , G01L19/02
Abstract: A micromechanical semiconductor sensing device is disclosed. In an embodiment the sensing device includes a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, the piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
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公开(公告)号：US09691687B2
公开(公告)日：2017-06-27
申请号：US14266348
申请日：2014-04-30
Applicant: Infineon Technologies AG
Inventor： Daniel Kehrer , Ulrich Krumbein , Beng-Keh See , Horst Theuss , Helmut Wietschorke , Tze Yang Hin , Stefan Martens
CPC classification number: H01L23/495 , H01L23/3107 , H01L23/315 , H01L23/49548 , H01L23/49575 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/83 , H01L25/16 , H01L2223/6611 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01047 , H01L2924/01322 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
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公开(公告)号：US20170074834A1
公开(公告)日：2017-03-16
申请号：US15341567
申请日：2016-11-02
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Stefan Kolb , Horst Theuss
Abstract: A photoacoustic gas sensor device for analyzing gas includes an emitter module and a pressure-sensitive module. The emitter module is arranged on a carrier substrate and emits light pulses. The pressure-sensitive module is arranged on the carrier substrate within a reference gas volume. The reference gas volume is separated from a volume intended to be filled with a gas to be analyzed. Further, the pressure-sensitive module generates a sensor signal indicating information on an acoustic wave caused by light pulses emitted by the emitter module interacting with a reference gas within the reference gas volume. Additionally, the emitter module is arranged so that light pulses emitted by the emitter module reach the reference gas volume after crossing the volume intended to be filled with the gas to be analyzed.
Abstract translation: 用于分析气体的光声气体传感器装置包括发射器模块和压敏模块。 发射器模块布置在载体衬底上并发射光脉冲。 压敏模块布置在载体基板上的参考气体体积内。 将参考气体体积与要被分析的气体填充的体积分离。 此外，压敏模块产生传感器信号，该传感器信号指示由与参考气体体积内的参考气体相互作用的发射器模块发射的光脉冲引起的声波信息。 此外，发射器模块被布置成使得发射器模块发射的光脉冲在穿过要被分析的气体填充的体积之后达到参考气体体积。
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85.发明申请Photo-Acoustic Gas Sensor Module Having Light Emitter and Detector Units 审中-公开具有光发射器和检测器单元的光声气体传感器模块公开(公告)号：US20160313288A1
公开(公告)日：2016-10-27
申请号：US15136469
申请日：2016-04-22
Applicant: Infineon Technologies AG
Inventor： Horst Theuss , Gottfried Beer , Sebastian Beer , Alfons Dehe , Franz Jost , Stefan Kolb , Guenther Ruhl , Rainer Markus Schaller
CPC classification number: G01N29/2425 , G01N29/032 , G01N2291/021
Abstract: A photo-acoustic gas sensor includes a light emitter unit having a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and a wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit having a microphone. The light emitter unit is arranged so that the beam of light pulses traverses an area configured to accommodate the gas. The detector unit is arranged so that the microphone can receive a signal oscillating with the repetition frequency.
Abstract translation: 光声气体传感器包括光发射器单元，其具有光发射器，其被配置为发射具有预定重复频率和对应于待感测气体的吸收带的波长的光脉冲束，以及具有麦克风的检测器单元 。 光发射器单元布置成使得光束脉冲穿过配置成容纳气体的区域。 检测器单元布置成使得麦克风可以接收以重复频率振荡的信号。
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Patent Agency Ranking
公开(公告)号：US09448130B2
公开(公告)日：2016-09-20
申请号：US14016046
申请日：2013-08-31
Applicant: Infineon Technologies AG
Inventor： Mathias Vaupel , Horst Theuss , Thomas Lehmann
CPC classification number: G01M1/122 , G01L19/0084 , G01L19/0092 , G01L19/141 , G01L19/143 , H01L23/00 , H01L23/3185 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2924/1815 , Y10T29/49117 , H01L2924/00014
Abstract: A sensor arrangement for sensing an environmental property of an environment of the sensor arrangement, the sensor arrangement comprising: a carrier; an active sensor component arranged at the carrier and configured for providing a sensor signal being indicative of the environmental property; a molding structure encapsulating at least a part of an exterior surface of the carrier and comprising an access recess exposing the active sensor component with regard to the environment; wherein the access recess is arranged asymmetrically with regard to the carrier.
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公开(公告)号：US20160220125A1
公开(公告)日：2016-08-04
申请号：US15011165
申请日：2016-01-29
Applicant: Infineon Technologies AG
Inventor： Kamil Karlovsky , Bernhard Goller , Dirk Hammerschmidt , Horst Theuss , Carsten von Koblinski
IPC: A61B5/0215 , A61B5/00
CPC classification number: A61B5/0215 , A61B5/022 , A61B5/6852
Abstract: An implantable vessel fluid sensor is configured to sense at least one vessel fluid parameter of a vessel. The implantable vessel fluid sensor includes a tubular body having a first end portion. The first end portion is configured to be inserted into and to form a sealed junction with an open vessel end of the vessel. The implantable vessel fluid sensor further includes a sensor unit connected to the tubular body. The sensor unit includes a sensor region configured to be in direct contact with the vessel fluid in a sealed junction state. A minimum distance between the sensor region and the first end portion is at most 10 times an outer diameter of the first end portion of the tubular body.
Abstract translation: 可植入血管流体传感器构造成感测血管的至少一个血管流体参数。 可植入容器流体传感器包括具有第一端部的管状体。 第一端部构造成插入并与之形成与容器的开放容器端部的密封结。 可植入容器流体传感器还包括连接到管状体的传感器单元。 传感器单元包括传感器区域，其被配置为在密封连接状态下与容器流体直接接触。 传感器区域和第一端部之间的最小距离为管状体的第一端部的外径的至多10倍。
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公开(公告)号：US20160167947A1
公开(公告)日：2016-06-16
申请号：US14970046
申请日：2015-12-15
Applicant: Infineon Technologies AG
Inventor： Juergen Hoegerl , Horst Theuss
CPC classification number: B81B7/007 , B81B7/0077 , B81B2201/0257 , B81B2207/012 , B81B2207/07 , B81B2207/097 , B81C1/00238 , B81C1/00333 , B81C2203/0118 , B81C2203/0785 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2924/181 , H01L2924/18165 , H04R19/005 , H04R19/04 , H04R2201/003 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A microphone module includes a package including a semiconductor chip and having a recess on an upper surface and a micro-electro-mechanical microphone being electrically connected to the package. Further, the micro-electro-mechanical microphone is arranged on the upper surface of the package. The recess forms an acoustic back volume of the micro-electro-mechanical microphone.
Abstract translation: 麦克风模块包括包括半导体芯片并且在上表面上具有凹部的封装以及电连接到封装的微电机麦克风。 此外，微机电麦克风布置在包装的上表面上。 凹部形成微机电麦克风的声背体积。
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公开(公告)号：US20160103219A1
公开(公告)日：2016-04-14
申请号：US14969848
申请日：2015-12-15
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss
CPC classification number: G01S7/521 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , G01S15/08 , G01S15/10 , G10K11/004 , H01L41/053 , H01L41/0973 , H04R2201/003
Abstract: Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.
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公开(公告)号：US09209497B2
公开(公告)日：2015-12-08
申请号：US13717417
申请日：2012-12-17
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss , Guenther Ruhl
CPC classification number: H01M10/48 , G01M3/227 , G01M3/3272 , G01M3/36 , H01M2/345 , H01M10/052 , H01M2200/20
Abstract: A sensor module includes an enclosure adapted to hermetically seal an opening or a hole on the outer surface of a casing or packaging, a sensor element and a membrane. The membrane is arranged between the enclosure and the opening or hole of the casing or packaging.
Abstract translation: 传感器模块包括适于气密地密封壳体或包装，传感器元件和膜的外表面上的开口或孔的外壳。 隔膜布置在外壳和外壳或包装的开口或孔之间。
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