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    MICROELECTRONIC ASSEMBLY WITH REDISTRIBUTION STRUCTURE FORMED ON CARRIER
    85.
    发明申请
    MICROELECTRONIC ASSEMBLY WITH REDISTRIBUTION STRUCTURE FORMED ON CARRIER 审中-公开
    具有重新分配结构的微电子组件在载体上形成

    公开(公告)号：US20170069575A1

    公开(公告)日：2017-03-09

    申请号：US15257152

    申请日：2016-09-06

    Applicant: Invensas Corporation

    Inventor： Belgacem Haba ,  Wael Zohni ,  Cyprian Emeka Uzoh

    IPC: H01L23/538 ,  H01L25/00 ,  H01L21/56 ,  H01L25/10 ,  H01L23/31 ,  H01L21/48

    CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311

    Abstract: A microelectronic assembly can be made by forming a redistribution structure supported on a carrier, the structure including two or more layers of deposited dielectric material and two or more electrically conductive layers and including conductive features such as pads and traces electrically interconnected by vias. Electrical connectors may project above a second surface of the structure opposite an interconnection surface of the redistribution structure adjacent to the carrier. A microelectronic element may be attached and electrically connected with conductive features at the second surface, and a dielectric encapsulation can be formed contacting the second surface and surfaces of the microelectronic element. Electrically conductive features at the interconnection surface can be configured for connection with corresponding features of a first external component, and the electrical connectors can be configured for connection with corresponding features of a second external component.

    Abstract translation: 微电子组件可以通过形成负载在载体上的再分布结构来制造，该结构包括两层或更多层沉积的电介质材料和两个或更多个导电层，并且包括导电特征，例如通过通孔电连接的焊盘和迹线。 电连接器可以突出在结构的第二表面之上，与邻近载体的再分布结构的互连表面相对。 微电子元件可以在第二表面处附接并与导电特征电连接，并且可以形成接触微电子元件的第二表面和表面的电介质封装。 互连表面处的导电特征可以被配置为与第一外部部件的对应特征相连接，并且电连接器可被配置为与第二外部部件的对应特征相连接。

    LOW CTE INTERPOSER
    86.
    发明申请
    LOW CTE INTERPOSER 有权

    公开(公告)号：US20170053857A1

    公开(公告)日：2017-02-23

    申请号：US15218617

    申请日：2016-07-25

    Applicant: Invensas Corporation

    Inventor： Belgacem Haba ,  Kishor Desai

    IPC: H01L23/498 ,  H01L23/00

    CPC classification number: H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/17104 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/19107 ,  Y10T29/49128 ,  Y10T428/24521 ,  Y10T428/24802 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).

    Abstract translation: 互连部件包括第一支撑部分，其具有大致垂直于其表面延伸的多个第一导电通孔，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 第二支撑部分具有大致垂直于其表面延伸穿过的多个第二导电通路，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 再分配层设置在第一和第二支撑部分的第二表面之间，将至少一些第一通孔与至少一些第二通孔电连接。 第一和第二支撑部分的热膨胀系数（“CTE”）可以低于每摄氏度12ppm（“ppm /℃”）。

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