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81.发明申请公开(公告)号：US20150115310A1
公开(公告)日：2015-04-30
申请号：US14525478
申请日：2014-10-28
Applicant: Point Engineering Co., Ltd.
Inventor： Ki Myung Nam , Seung Ho Park , Young Chul Jun
IPC: H01L33/48
CPC classification number: H01L33/486 , H01L24/97 , H01L2224/48091 , H01L2924/12041 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
Abstract: Provided is an array substrate for mounting a chip. The array substrate includes a plurality of conductive layers unidirectionally stacked with respect to an original chip substrate; a plurality of insulating layers alternately stacked with the plurality of conductive layers, and electrically separate the plurality of conductive layers; and a cavity having a groove of a predetermined depth with respect to a region including the plurality of insulating layers in an upper surface of the original chip substrate. Accordingly, since the optical device array of a single structure is used as a line source of light, an emission angle emitted from the optical device is great, it is not necessary to form an interval for supplying an amount of light, and a display device can be simply constructed. Further, since it is not necessary to perform soldering a plurality of LED packages on a printed circuit board, a thickness of a back light unit can be reduced.
Abstract translation: 提供了一种用于安装芯片的阵列基板。 阵列基板包括相对于原始芯片基板单向堆叠的多个导电层; 多个绝缘层，与所述多个导电层交替堆叠，并且电分离所述多个导电层; 以及具有相对于在原始芯片衬底的上表面中包括多个绝缘层的区域具有预定深度的凹槽的空腔。 因此，由于将单一结构的光学元件阵列用作线光源，所以从光学器件发射的发射角大，不需要形成用于提供光量的间隔，并且显示装置 可以简单地构建。 此外，由于不需要在印刷电路板上进行多个LED封装的焊接，所以可以减小背光单元的厚度。
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82.发明申请公开(公告)号：US20150049447A1
公开(公告)日：2015-02-19
申请号：US14460587
申请日：2014-08-15
Applicant: Point Engineering Co., Ltd.
Inventor： Bum Mo Ahn , Seung Ho Park , Kyoung Ja Yun
CPC classification number: H05K3/0052 , H01L33/48 , H01L33/62 , H01L2924/0002 , H05K1/183 , H05K2201/09718 , H05K2201/09827 , H05K2201/09845 , H05K2201/09854 , H05K2201/09863 , H05K2201/10 , H05K2201/10106 , H05K2201/10121 , Y10T29/49155 , H01L2924/00
Abstract: A base substrate which prevents burrs generated during the cutting process includes: multiple conductive layers stacked in one direction with respect to the base substrate; at least one insulation layer being alternately stacked with said conductive layers and electrically separating said conductive layers; and a through-hole penetrating said base substrate covering said insulation layer at the contact region where said cut surface and said insulation layer meet during the cutting of said base substrate in accordance with a predetermined region of the chip substrate. A method of manufacturing the base substrate includes alternately stacking conductive layers and insulation layers and forming a through-hole.
Abstract translation: 防止在切割过程中产生的毛刺的基底基板包括：相对于基底基板沿一个方向堆叠的多个导电层; 至少一个绝缘层与所述导电层交替堆叠并电分离所述导电层; 以及根据所述芯片基板的预定区域，在切割所述基底基板期间，在所述切割面和所述绝缘层相接触的接触区域处覆盖所述绝缘层的通孔。 制造基底基板的方法包括交替地堆叠导电层和绝缘层并形成通孔。
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83.发明申请Method for Manufacturing a Can Package-Type Optical Device, and Optical Device Manufactured Thereby 有权制造可封装型光学器件的方法和由此制造的光学器件公开(公告)号：US20150048408A1
公开(公告)日：2015-02-19
申请号：US14349226
申请日：2012-10-04
Applicant: Point Engineering Co., Ltd.
Inventor： Ki Myung Nam , Seung Ho Park , Tae Hwan Song
CPC classification number: H01L33/483 , H01L25/0753 , H01L33/486 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified.According to the present invention, a method for manufacturing a can package-type optical device comprises the steps of: (a) preparing a metal plate and a metal substrate with vertical insulation layers, wherein more than one vertical insulation layer crossing the substrate from the top surface to the bottom surface thereof are formed; (b) bonding the metal plate on the top surface of the metal substrate with vertical insulation layers; (c) forming a cavity on an intermediate product that has undergone step (b) in a form of a cylindrical pit having a predetermined depth reaching the surface of said metal substrate with vertical insulation layers by passing through said metal plate and the adhesive layers formed by said bonding, wherein said cavity contains said vertical insulation layer in the bottom wall thereof; (e) connecting a wire, which electrically connects an optical device and an electrode of the optical device together, to either side of the surface of the bottom wall of the vertical insulation layers of the cavity, respectively; and (g) sealing the cavity by means of a protective plate made from a light-transmitting material; and a can cap, formed as a picture frame whose top central portion and the bottom are open and encompassing the perimeter of the protective plate.
Abstract translation: 本发明涉及一种光学器件的制造方法及其制造的光学器件，其涉及使用基板本身作为散热板，并且采用其上形成有垂直绝缘层的基板，使得电极端子 不必从密封空间挤出，从而能够简化光学装置的整体结构和制造过程。 根据本发明，一种罐封装型光学器件的制造方法包括以下步骤：（a）制备具有垂直绝缘层的金属板和金属基板，其中多于一个的垂直绝缘层与 形成其底面的顶面; （b）用垂直绝缘层将金属板与金属基板的顶面接合; （c）在具有预定深度的圆柱形凹坑形式的步骤（b）中形成空腔，该预定深度通过穿过所述金属板并形成的粘合剂层到达所述金属基板的具有垂直绝缘层的表面 通过所述接合，其中所述空腔在其底壁中包含所述垂直绝缘层; （e）将将光学装置和光学装置的电极电连接在一起的导线分别连接到腔的垂直绝缘层的底壁的表面的任一侧; 和（g）通过由透光材料制成的保护板密封空腔; 以及罐盖，其形成为其顶部中心部分和底部打开并且包围保护板的周边的相框。
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公开(公告)号：US11852655B2
公开(公告)日：2023-12-26
申请号：US17038642
申请日：2020-09-30
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
CPC classification number: G01R1/07342 , H05K1/0298 , H05K3/107 , H05K3/462
Abstract: Proposed is a multilayer wiring substrate having excellent joining strength, a method of manufacturing the multilayer wiring substrate, and a probe card having the multilayer wiring substrate.
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公开(公告)号：US20230090643A1
公开(公告)日：2023-03-23
申请号：US18058177
申请日：2022-11-22
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure. More particularly, proposed are a manufacturing method of an anodic oxide film structure, and an anodic oxide film structure, wherein production yield of the entire product can be improved by repairing a defective region to be made normal.
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Patent Agency Ranking
公开(公告)号：US11610937B2
公开(公告)日：2023-03-21
申请号：US16921564
申请日：2020-07-06
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same. More particularly, disclosed are a micro LED group substrate provided with a plurality of micro LEDs, a method of manufacturing the same, a micro LED display panel, and a method of manufacturing the same, wherein the need for a micro LED replacement process is eliminated.
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公开(公告)号：US11497126B2
公开(公告)日：2022-11-08
申请号：US17087261
申请日：2020-11-02
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
IPC: H05K1/00 , H05K1/02 , H05K1/03 , H05K1/05 , H05K1/11 , H05K1/16 , H05K3/36 , H05K3/40 , H01L21/00 , H01L21/50 , H01L23/14 , H01L23/15 , H01L23/48 , H01L23/58 , H01L23/498 , H05K3/46
Abstract: Proposed are a multilayer wiring board having both durability and chemical resistance, and a probe card including the same.
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公开(公告)号：US11253619B2
公开(公告)日：2022-02-22
申请号：US16890777
申请日：2020-06-02
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
Abstract: Provided is a UV sterilizer including an illumination unit, a cover that has an open hole in an upper surface thereof and supports the illumination unit, and a body that is provided underneath the cover and secures an illumination distance between the illumination unit and an illumination target object. The body is composed of a first body and a second body into which the first body is inserted. The first body and the second body are separably combined with each other.
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公开(公告)号：US11201272B2
公开(公告)日：2021-12-14
申请号：US16383462
申请日：2019-04-12
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Moon Hyun Kim
Abstract: The present invention relates generally to an optical device package on which an optical device is mounted and, more particularly, to an optical device package that is configured such that a unit substrate of the optical device package comes into surface contact with a curved surface of a light transmission member.
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90.发明申请公开(公告)号：US20210331446A1
公开(公告)日：2021-10-28
申请号：US17232029
申请日：2021-04-15
Applicant: POINT ENGINEERING CO., LTD.
Inventor： Bum Mo Ahn , Seung Ho Park , Sung Hyun Byun
Abstract: Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.
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