Abstract:
There is described a fuser member comprising a substrate layer and a surface layer disposed on the substrate. The surface layer comprises a non-woven polymer fiber matrix having dispersed throughout a cross-linked fluoropolymer and a release agent. The release agent is a liquid at a temperature about 100° C.
Abstract:
A fuser member including a substrate and a release layer disposed on the substrate is described. The release layer includes a metal coated non-woven polymer fiber mesh wherein the metal coated non-woven polymer fiber mesh has pores of a size of from about 1 microns to about 50 microns and a fluoropolymer dispersed on and throughout the polymer matrix. A method of manufacturing the fuser member is also provided.
Abstract:
Described is a fuser member including a substrate and a release layer disposed on the substrate. The release layer includes a fluoropolymer having a plurality of metal fibers having a diameter of from about 5 nanometers to about 20 microns dispersed throughout the fluoropolymer. A method of manufacturing the fuser member is also provided.
Abstract:
A fuser member including a substrate and a release layer disposed on the substrate is provided. The fuser member includes a substrate and a release layer disposed on the substrate. The release layer includes non-woven polymer fibers having graphene particles dispersed along the fibers. A method of manufacturing the release layer is provided.
Abstract:
A composition comprises a liquid continuous phase and a plurality of composite particles dispersed therein. The composite particles each comprise a fluorosilane-treated graphene-comprising particle and a fluoropolymer particle.
Abstract:
A method for forming a surface topcoat can include mixing a plurality of carbon nanotubes (CNT) with a thermally decomposable polymer binder to form a thermally decomposable polymer composite. The thermally decomposable polymer composite is mixed with a plurality of fluoroplastic particles, a fluorinated surfactant, and a solvent media to form a coating dispersion. Next, the coating dispersion is applied to a substrate such as a printer fuser member substrate to form a coated substrate. The coated substrate is heated to cure the coating dispersion to form a final coating film on the substrate.
Abstract:
A fuser member having a substrate and a surface layer disposed on the substrate is described. The surface layer includes a polyimide aerogel having dispersed throughout a cross-linked fluoropolymer and a release agent wherein the release agent is a liquid at a temperature above about 100° C.
Abstract:
Processes for preparing stabilized metal-containing nanoparticles comprising silver and/or a silver alloy composite by reacting a silver compound with a reducing agent comprising a hydrazine compound at a temperature between about 20° C. and about 60° C. The reaction being carried out by incrementally adding the silver compound or a mixture of the silver compound and a stabilizer to a solution comprising the reducing agent, a stabilizer, and a solvent. Conductive ink compositions containing stabilized metal-containing nanoparticles prepared by such processes.
Abstract:
Described is a fuser member having a substrate and a release layer disposed on the substrate. The release layer includes a non-woven matrix of a plurality of polymer fibers. Each of the plurality of polymer fibers has a diameter of from about 5 nm to about 50 microns. A siloxyfluorocarbon networked polymer dispersed throughout the plurality of polymer fibers. The plurality of polymer fibers are from about 5 weight percent to about 50 weight percent of the release layer. In embodiments the polymer fibers are encased in a fluoropolymer sheath.
Abstract:
An electronic device, such as a thin-film transistor, includes a substrate and a dielectric layer formed from a dielectric composition. The dielectric composition includes a dielectric material, a crosslinking agent, and a thermal acid generator. In particular embodiments, the dielectric material comprises a lower-k dielectric material and a higher-k dielectric material. When deposited, the lower-k dielectric material and the higher-k dielectric material form separate phases. The thermal acid generator allows the dielectric layer to be cured at relatively lower temperatures and/or shorter time periods, permitting the selection of lower-cost substrate materials that would otherwise be deformed by the curing of the dielectric layer.