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    Substrate treatment method and substrate treatment apparatus
    82.
    发明授权
    Substrate treatment method and substrate treatment apparatus 有权
    基板处理方法和基板处理装置

    公开(公告)号：US08883653B2

    公开(公告)日：2014-11-11

    申请号：US13353962

    申请日：2012-01-19

    Applicant: Akio Hashizume

    Inventor： Akio Hashizume

    IPC: H01L21/302 ,  H01L21/461 ,  H01L21/311 ,  H01L21/3105 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02

    CPC classification number: B05C9/06 ,  B05C11/00 ,  B05C13/00 ,  B05C15/00 ,  C01B21/0687 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/3105 ,  H01L21/31111 ,  H01L21/31116 ,  H01L21/67028 ,  H01L21/67063 ,  H01L21/67115 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/68742

    Abstract: An inventive substrate treatment method includes a silylation step of supplying a silylation agent to a substrate, and an etching step of supplying an etching agent to the substrate after the silylation step. The method may further include a repeating step of repeating a sequence cycle including the silylation step and the etching step a plurality of times. The cycle may further include a rinsing step of supplying a rinse liquid to the substrate after the etching step. The cycle may further include a UV irradiation step of irradiating the substrate with ultraviolet radiation after the etching step. The method may further include a pre-silylation or post-silylation UV irradiation step of irradiating the substrate with the ultraviolet radiation before or after the silylation step.

    Abstract translation: 本发明的基板处理方法包括向基板供给甲硅烷化剂的甲硅烷化步骤，以及在甲硅烷化步骤之后向基板供给蚀刻剂的蚀刻步骤。 该方法可以进一步包括多次重复包括甲硅烷化步骤和蚀刻步骤的序列循环的重复步骤。 该循环可以进一步包括在蚀刻步骤之后将漂洗液体供应到基底的冲洗步骤。 该循环可以进一步包括在蚀刻步骤之后用紫外线照射衬底的UV照射步骤。 该方法可进一步包括在甲硅烷化步骤之前或之后用紫外线照射基质的预甲硅烷基化或甲硅烷基化后UV照射步骤。

    PAINTING DEVICE
    83.
    发明申请
    PAINTING DEVICE 有权
    绘画设备

    公开(公告)号：US20140238294A1

    公开(公告)日：2014-08-28

    申请号：US14240096

    申请日：2012-08-09

    Applicant: Carlos Ribeiro

    Inventor： Carlos Ribeiro

    IPC: B05B15/12

    CPC classification number: B05B15/1214 ,  B05B12/16 ,  B05B14/40 ,  B05B16/40 ,  B05C11/00 ,  B05C15/00 ,  Y02P70/36 ,  Y10S901/43

    Abstract: The invention relates to a painting system which comprises a painting device (121) in the painting chamber (103), said painting device comprising a casing (113) that surrounds the workpiece support (107) such that paint droplets that are not deposited onto the workpieces are dripped onto the casing to a large extent and can thus be reused.

    Abstract translation: 本发明涉及一种涂装系统，其包括在涂装室（103）中的涂装装置（121），所述涂装装置包括围绕工件支架（107）的外壳（113），使得未沉积在 工件在很大程度上滴到外壳上，因此可以重复使用。

    AUTOMATED POSITION LOCATOR FOR A HEIGHT SENSOR IN A DISPENSING SYSTEM
    84.
    发明申请
    AUTOMATED POSITION LOCATOR FOR A HEIGHT SENSOR IN A DISPENSING SYSTEM 有权
    自动定位器，用于配电系统中的高度传感器

    公开(公告)号：US20140230727A1

    公开(公告)日：2014-08-21

    申请号：US13769605

    申请日：2013-02-18

    Applicant: NORDSON CORPORATION

    Inventor： Floriana Suriawidjaja ,  Todd S. Weston

    IPC: B05C11/00

    CPC classification number: G01B11/026 ,  B05B12/124 ,  B05C5/0225 ,  B05C11/00 ,  B05C11/1002 ,  B05C11/1015 ,  G01B11/0608 ,  G01B11/14 ,  G01C15/004 ,  Y10T29/49

    Abstract: Apparatus and methods of determining a position of a height sensor in a dispensing system. The dispensing system includes a dispenser, height sensor, camera, and a calibration device configured to receive a signal from the height sensor. The calibration device may include an optical sensor that generates an alignment signal in response to receiving light from the height sensor and/or a fiducial that causes the height sensor to generate the alignment signal in response to a detected height change. The alignment signal is used to automatically determine the position at which the height sensor is aligned with the calibration device. The position of the height sensor relative to a camera is determined by aligning the camera with the calibration device and recording its position. The recorded coordinates of the camera are compared to the coordinates of the height sensor when the height sensor is automatically aligned with the calibration device.

    Abstract translation: 确定分配系统中高度传感器位置的装置和方法。 分配系统包括分配器，高度传感器，相机和被配置为从高度传感器接收信号的校准装置。 校准装置可以包括光学传感器，其响应于接收来自高度传感器的光和/或基准而产生对准信号，该基准使得高度传感器响应于检测到的高度变化而产生对准信号。 对准信号用于自动确定高度传感器与校准装置对准的位置。 高度传感器相对于相机的位置通过将相机与校准装置对准并记录其位置来确定。 当高度传感器与校准装置自动对准时，相机的记录坐标与高度传感器的坐标进行比较。

    Microelectronic workpiece processing systems and associated methods of color correction
    86.
    发明授权
    Microelectronic workpiece processing systems and associated methods of color correction 有权
    微电子工件加工系统及相关方法的颜色校正

    公开(公告)号：US08716038B2

    公开(公告)日：2014-05-06

    申请号：US12715820

    申请日：2010-03-02

    Applicant: Kevin Tetz ,  Charles M. Watkins

    Inventor： Kevin Tetz ,  Charles M. Watkins

    IPC: H01L21/66

    CPC classification number: H01L33/005 ,  B05C11/00

    Abstract: Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.

    Abstract translation: 本文公开了半导体系统的几个实施例和颜色校正的相关联的方法。 在一个实施例中，一种制造发光二极管（LED）的方法包括在衬底上形成（LED），测量所形成的LED的基极发射特性，并且基于所形成的LED的测量的基极发射特性来选择荧光体 使得来自LED和磷光体的组合发射至少近似于白光。 该方法还包括通过例如喷墨印刷将所选择的荧光体引入到LED上。

    METHOD FOR COATING A STENT
    87.
    发明申请
    METHOD FOR COATING A STENT 审中-公开
    涂层手段的方法

    公开(公告)号：US20140037833A1

    公开(公告)日：2014-02-06

    申请号：US14052986

    申请日：2013-10-14

    Applicant: ABBOTT CARDIOVASCULAR SYSTEMS INC.

    Inventor： Stephen D. Pacetti ,  Laura Melton Kalvass

    IPC: A61F2/82

    CPC classification number: B05C11/00 ,  A61F2/82 ,  A61L2420/02 ,  B05B13/0442 ,  B05D1/002

    Abstract: A systems and method for reducing coating defects on a stent may involve a support apparatus comprising wire cage for carrying a stent. The support apparatus may have no structure that extends inside the stent. A support apparatus may include a plurality of wires that pass through the stent but do not pass through the midplane of the stent. A support apparatus may contact only the proximal ends of the stent. The method may involve keeping the stent in motion during a spray coating process to prevent the stent from having a point remain in continuous contact with a support apparatus.

    Abstract translation: 用于减少支架上的涂层缺陷的系统和方法可以涉及包括用于承载支架的线架的支撑装置。 支撑装置可以没有在支架内延伸的结构。 支撑装置可以包括穿过支架但不穿过支架的中平面的多根线。 支撑装置可以仅接触支架的近端。 该方法可以包括在喷雾涂覆过程期间保持支架运动，以防止支架保持与支撑装置的连续接触。

    System for coating a stent
    89.
    发明授权
    System for coating a stent 有权
    支架涂层系统

    公开(公告)号：US08573148B2

    公开(公告)日：2013-11-05

    申请号：US12554671

    申请日：2009-09-04

    Applicant: Stephen D. Pacetti ,  Laura Melton Kalvass

    Inventor： Stephen D. Pacetti ,  Laura Melton Kalvass

    IPC: B05C13/00 ,  B05D3/00

    CPC classification number: B05C11/00 ,  A61F2/82 ,  A61L2420/02 ,  B05B13/0442 ,  B05D1/002

    Abstract: A systems and method for reducing coating defects on a stent may involve a support apparatus comprising wire cage for carrying a stent. The support apparatus may have no structure that extends inside the stent. A support apparatus may include a plurality of wires that pass through the stent but do not pass through the midplane of the stent. A support apparatus may contact only the proximal ends of the stent. The method may involve keeping the stent in motion during a spray coating process to prevent the stent from having a point remain in continuous contact with a support apparatus.

    Abstract translation: 用于减少支架上的涂层缺陷的系统和方法可以涉及包括用于承载支架的线架的支撑装置。 支撑装置可以没有在支架内部延伸的结构。 支撑装置可以包括穿过支架但不穿过支架的中平面的多根线。 支撑装置可以仅接触支架的近端。 该方法可以包括在喷雾涂覆过程期间保持支架运动，以防止支架保持与支撑装置的连续接触。

    WET PROCESSING APPARATUS, WET PROCESSING METHOD AND STORAGE MEDIUM
    90.
    发明申请
    WET PROCESSING APPARATUS, WET PROCESSING METHOD AND STORAGE MEDIUM 有权
    湿处理设备，湿处理方法和储存介质

    公开(公告)号：US20130273256A1

    公开(公告)日：2013-10-17

    申请号：US13914742

    申请日：2013-06-11

    Applicant: Tokyo Electron Limited

    Inventor： Naofumi KISHITA ,  Kouji FUJIMURA ,  Yoshitaka HARA

    IPC: B05D1/02

    CPC classification number: B05D1/02 ,  B05C11/00 ,  B05D1/00 ,  B05D1/30

    Abstract: A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).

    Abstract translation: 用于湿处理基板的湿式处理装置可以抑制当其一部分成为不可用时的吞吐量的降低。 湿式处理装置包括第一喷嘴单元和第二喷嘴单元。 当湿法处理装置以正常模式操作时，控制基板承载机构以将基板交替地传送到第一组和第二组的处理单元，使得依次顺序地处理基板。 当第一组（第二组）的处理单元由于衬底保持器的不操作而不能使用时，处理液体供应系统或喷嘴支撑机构，用于第二组（第一组）的处理单元的喷嘴单元 ）被移动到由第一组（第二组）中可用的基板处理衬底。

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