公开(公告)号：US6068174A

公开(公告)日：2000-05-30

申请号：US763366

申请日：1996-12-13

Applicant: Michael B. Ball ,  Rich Fogal

Inventor： Michael B. Ball ,  Rich Fogal

IPC: B23K3/06 ,  B23K20/00 ,  H01L21/607 ,  H01L21/60 ,  B23K37/04

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K3/0623 ,  B23K2201/40 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

公开(公告)号：US6049976A

公开(公告)日：2000-04-18

申请号：US457479

申请日：1995-06-01

Applicant: Igor Y. Khandros

Inventor： Igor Y. Khandros

IPC: B23K1/00 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R9/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  C23C18/161 ,  C25D7/12 ,  G01R1/0466 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00 ,  G01R31/2886 ,  H01L21/76897 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45117 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/4554 ,  H01L2224/4556 ,  H01L2224/456 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/49609

Abstract: A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensionally). A coating, having one or more layers, is deposited on the wire stem to (i) impart resilient mechanical characteristics to the shaped wire stem and (ii) more securely attach ("anchor") the wire stem to the terminal. Gold is one of several materials described that may be selected for the wire stem. A variety of materials for the coating, and their mechanical properties, are described. The wire stems may be shaped as loops, for example originating and terminating on the same terminal of the electronic component, and overcoated with solder. The use of a barrier layer to prevent unwanted reactions between the wire stem and its environment (e.g., with a solder overcoat) is described. Bonding a second end of the wire to a sacrificial member, then removing the sacrificial member, is described. A plurality of wire stems may be formed on the surface of the electronic component, from different levels thereon, and may be severed so that their tips are coplanar with one another. Many wire stems can be mounted, for example in an array pattern, to one or to both sides of electronic components including semiconductor dies and wafers, plastic and ceramic semiconductor packages, and the like.

Abstract translation: 一种用于在电子部件的表面上制造凸起接触的方法包括将电线的一端接合到电子部件的诸如端子的区域，并将线成形为线杆构造（包括直的， 尺寸，三维弯曲）。 具有一个或多个层的涂层沉积在线杆上，以（i）赋予成形线杆弹性机械特性，和（ii）将线杆更牢固地附接（“锚定”）到终端。 金是描述的几种材料之一，可以选择线棒。 描述了用于涂层的各种材料及其机械性能。 线杆可以形成为环，例如起始和终止在电子部件的相同端子上，并用焊料覆盖。 描述了使用阻挡层来防止线杆与其环境之间的不期望的反应（例如，使用焊料外涂层）。 将导线的第二端接合到牺牲部件上，然后移除牺牲部件。 多个线杆可以从电子部件的表面上形成在其上的不同层面上，并且可以被切断，使得它们的尖端彼此共面。 许多线杆可以例如以阵列图形安装到包括半导体管芯和晶片的电子部件的一侧或两侧，塑料和陶瓷半导体封装等。

公开(公告)号：US6047877A

公开(公告)日：2000-04-11

申请号：US909230

申请日：1997-08-11

Applicant: Michael B. Ball

Inventor： Michael B. Ball

IPC: B23K20/00 ,  H01L21/48 ,  H01L21/603 ,  B23K5/22 ,  B23K31/02

CPC classification number: H01L24/85 ,  B23K20/004 ,  H01L21/4825 ,  H01L24/78 ,  B23K2201/40 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L24/45 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  Y10S269/903

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The apparatus and method contemplates the replacement of the penetrating fixed clamp with another, or second, penetrating independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.

Abstract translation: 一种在半导体器件上的接触焊盘和引线框架的单个引线框架指状物之间形成改进的引线接合的装置和方法。 该装置和方法包括在引线接合过程期间使用贯穿的独立的独立引线夹，以提供单独引线指的增加的稳定性，以通过夹具穿过被接合的引线的一部分来改善接合。 如果需要，该装置和方法还提供了在引线接合过程期间使用穿透或非穿透性固定夹子用于引线接合工艺，以及在引线接合过程期间穿透的独立引导夹具，以提供增加的稳定性 的单个引线用于改善接合。 该设备和方法考虑在引线接合过程中除了第一独立引导夹具之外，还使用另一个或第二穿透独立夹具来替换穿透固定夹具。

公开(公告)号：US6036084A

公开(公告)日：2000-03-14

申请号：US856906

申请日：1997-05-15

Applicant: Hiroshi Yagi ,  Hiroyuki Ohira

Inventor： Hiroshi Yagi ,  Hiroyuki Ohira

IPC: B23K1/008 ,  H05K3/12 ,  H05K3/22 ,  H05K3/34 ,  B23K35/12 ,  B23K1/00 ,  B23K31/02 ,  B05D5/12

CPC classification number: B23K1/008 ,  H05K3/1233 ,  H05K3/3494 ,  B23K2201/40 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K3/227 ,  H05K3/3484

Abstract: Screen printing and chip mounting are executed in a dry air atmosphere to prevent generation of solder balls due to absorption of moisture by a flux ingredient of paste solder. Screen printing of the solder on a board takes place in a space which has the board, a printing screen and a squeegee arranged therein and is formed therein with a dry air atmosphere having a pressure slightly higher than that of an atmosphere outside the space. Likewise, mounting of a chip on the board is carried out in a like space. Also, a reflow step is executed in a reflow oven kept at a dry air atmosphere.

Abstract translation: 丝网印刷和芯片安装在干燥空气气氛中进行，以防止由焊膏的焊剂成分吸收水分而产生焊球。 板上的焊料的丝网印刷发生在具有布置在其中的板，印刷丝网和刮板的空间中，其中形成有比空间外部的气氛略高的干燥空气气氛。 同样地，在相同的空间中进行芯片的安装。 此外，在保持在干燥空气气氛的回流炉中进行回流工序。

公开(公告)号：US6029882A

公开(公告)日：2000-02-29

申请号：US67904

申请日：1998-04-27

Applicant: Lannie R. Bolde ,  Peter Alfred Gruber ,  Chon Cheong Lei

Inventor： Lannie R. Bolde ,  Peter Alfred Gruber ,  Chon Cheong Lei

IPC: B23K3/06 ,  H01L21/48 ,  H05K3/34

CPC classification number: B23K3/0638 ,  H01L21/4853 ,  H05K3/3468 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01322 ,  H01L2924/10253 ,  H05K2201/10424 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

Abstract: Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit ends to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which the substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutually compatible with respect to CTE when exposed to temperatures of molten solder.

Abstract translation: 公开了一种使用塑料球栅阵列（PBGA）中的焊料注射模具装置向印刷电路板基板提供焊球的焊料注射模具装置和方法。 焊接模具通孔在入口处和出口端被倒角，以帮助接收熔融焊料，并且将焊球形成和转移到衬底上的焊盘上。 在模具的第二主表面，即面向衬底的一侧设置盲孔，以容纳安装在其上的电子部件。 焊球在仅需要一个回流的过程中输送和冶金地附着在焊盘上，留下通孔清洁焊料并且模具准备好重新使用。 选择基材，模具和基板的材料，当暴露于熔融焊料的温度时，被选择为不被焊料润湿并且相对于CTE相互兼容。

公开(公告)号：US6005224A

公开(公告)日：1999-12-21

申请号：US102478

申请日：1998-06-22

Applicant: Wessel J. Wesseling ,  Otto Nienhuis

Inventor： Wessel J. Wesseling ,  Otto Nienhuis

IPC: B23K1/00 ,  B23K1/008 ,  B23K3/04 ,  H05K1/18 ,  H05K3/34 ,  H05K13/04 ,  B23K1/012 ,  B23K31/02

CPC classification number: B23K1/008 ,  H05K3/3494 ,  B23K2201/40 ,  H05K1/189 ,  H05K2203/087 ,  H05K2203/1545

Abstract: The invention relates to a method of connecting components (12) to at least one carrier (11), for example by soldering or gluing. Such a method is carried out in an oven (1) through which carriers are moved. Preferably, the carrier is a flexible foil. The carrier separates the oven into an upper part (2) and a lower part (3). In both parts a hot air stream (14) is created and directed toward the carrier. Owing to the separation by the foil the hot air stream in the upper part cannot reach the lower part and vice versa. The temperature of the hot air stream in the upper part differs from that (is, for example, higher than) in the lower part. The heating elements in the upper part of the oven may all have the same high temperature (for example, 240.degree. C.) and the heating elements in the lower part may all have the same low temperature (for example, 60.degree. C.). By adjusting at least one air stream the desired temperature at the location of the carriers (for example, at solder lands 17) can be obtained very rapidly (comparable with a hot/cold water mixing tap).

Abstract translation: 本发明涉及一种将部件（12）连接至至少一个载体（11）的方法，例如通过焊接或胶合。 这种方法在通过其移动载体的烘箱（1）中进行。 优选地，载体是柔性箔。 载体将烤箱分离成上部（2）和下部（3）。 在两部分中，产生热空气流（14）并将其指向载体。 由于箔的分离，上部的热空气流不能到达下部，反之亦然。 上部热空气流的温度与下部不同（例如高于）。 烘箱上部的加热元件全部可以具有相同的高温（例如240℃），下部的加热元件也可以具有相同的低温（例如60℃） 。 通过调节至少一个空气流，可以非常快速地获得载体（例如，在焊接区域17）位置处的期望温度（与热/冷水混合水龙头相当）。

公开(公告)号：US5998864A

公开(公告)日：1999-12-07

申请号：US863511

申请日：1997-05-27

Applicant: Igor Y. Khandros ,  David V. Pedersen

Inventor： Igor Y. Khandros ,  David V. Pedersen

IPC: B23K20/00 ,  C25D7/12 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01L23/02 ,  H05K7/00

CPC classification number: B23K20/004 ,  C25D7/12 ,  G01R1/07378 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H05K3/326 ,  H05K3/4015 ,  B23K2201/40 ,  G01R31/2886 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13616 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/141 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  Y02P70/611

Abstract: High density packaging of semiconductor devices on an interconnection substrate is achieved by stacking bare semiconductor devices atop one another so that an edge portion of a semiconductor device extends beyond the semiconductor device that it is stacked atop. Elongate interconnection elements extend from the bottommost one of the semiconductor devices, and from the exposed edge portions of the semiconductor devices stacked atop the bottommost semiconductor device. Free-ends of the elongate interconnection elements make electrical contact with terminals of an interconnection substrate, such as a PCB. The elongate interconnection elements extending from each of the semiconductor devices are sized so as to reach the terminals of the PCB, which may be plated through holes. The elongate interconnection elements are suitably resilient contact structures, and may be composite interconnection elements comprising a relatively soft core (e.g., a gold wire) and a relatively hard overcoat (e.g., a nickel plating).

Abstract translation: 半导体器件在互连衬底上的高密度封装通过将裸半导体器件堆叠在一起而实现，使得半导体器件的边缘部分延伸超过其顶部堆叠的半导体器件。 细长的互连元件从最底层的半导体器件中延伸出来，并从半导体器件的暴露的边缘部分堆叠在最底部的半导体器件的顶部。 细长互连元件的自由端与诸如PCB的互连衬底的端子电接触。 从每个半导体器件延伸的细长互连元件的尺寸被设计成到达可以通过孔电镀的PCB的端子。 细长互连元件是合适的弹性接触结构，并且可以是包括相对软的芯（例如，金线）和相对硬的外涂层（例如镀镍）的复合互连元件。

公开(公告)号：US5998228A

公开(公告)日：1999-12-07

申请号：US839759

申请日：1997-04-15

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K1/00 ,  B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R12/00 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  G01R31/26

CPC classification number: H05K7/1069 ,  B23K1/0008 ,  B23K20/004 ,  C23C18/1605 ,  C23C18/165 ,  C25D7/12 ,  G01R1/07342 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/72 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  G01R31/2856 ,  G01R31/2863 ,  G01R31/2886 ,  H01L2223/54453 ,  H01L2224/02311 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0558 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13022 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45572 ,  H01L2224/45599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L23/544 ,  H01L24/45 ,  H01L24/49 ,  H01L24/83 ,  H01L24/90 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613 ,  Y10S977/712 ,  Y10S977/723 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4922 ,  Y10T29/49812 ,  Y10T428/12396 ,  Y10T428/12528

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

公开(公告)号：US5992725A

公开(公告)日：1999-11-30

申请号：US815844

申请日：1997-03-12

Applicant: Hidemitsu Egawa ,  Hirokazu Ezawa

Inventor： Hidemitsu Egawa ,  Hirokazu Ezawa

IPC: H01L21/60 ,  B23K20/00 ,  H01L21/607 ,  H05K13/06

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K20/007 ,  H01L24/48 ,  H01L24/78 ,  H05K13/06 ,  B23K2201/40 ,  H01L2224/02126 ,  H01L2224/02166 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85009 ,  H01L2224/8502 ,  H01L2224/85045 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L24/45 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/12044 ,  H01L2924/20753

Abstract: An electronic element producing apparatus comprises a bonding tool 1 which has a first supply hole 2 for passing a bonding wire 3 used to bond a bonding pad 6 of a semiconductor device 5 and an external conductor which is to be connected electrically with the bonding pad 6, and contacts a leading end 3b of the bonding wire 3 protruded outside from the first supply hole 2 to the bonding pad 6, and which also has a second supply hole 12 to supply a bonding material to bond the bonding pad 6 and the leading end 3b of the bonding wire 3, the second supply hole 12 being formed to supply the conductive material to a contact point between the bonding wire 3 and the bonding pad 6. Therefore, the bonding pad 6 and the bonding wire 3 can be bonded without applying a dynamic or thermal load to the semiconductor device 5.

Abstract translation: 电子元件制造装置包括接合工具1，该接合工具1具有用于使用于接合半导体器件5的接合焊盘6的接合线3和与接合焊盘6电连接的外部导体的第一供给孔2 并且接触从第一供给孔2向外侧突出的接合线3的前端3b到接合焊盘6，并且还具有第二供给孔12，用于提供接合材料以将接合焊盘6和前端 3b形成，第二供应孔12形成为将导电材料供应到接合线3和接合焊盘6之间的接触点。因此，接合焊盘6和接合线3可以粘合而不施加 对半导体器件5的动态或热负载。

公开(公告)号：US5971257A

公开(公告)日：1999-10-26

申请号：US257787

申请日：1999-02-25

Applicant: Renyi Yang

Inventor： Renyi Yang

IPC: B23K3/08 ,  B23K37/04 ,  H01L21/00 ,  H05K13/04 ,  B23K5/22 ,  B23K37/00 ,  B23P19/00 ,  B25B11/00

CPC classification number: H01L21/67132 ,  B23K3/087 ,  B23K37/0426 ,  H05K13/046 ,  B23K2201/40 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53961

Abstract: A fixture for use in the bonding of a plurality of chips each to a respective one of a plurality of substrates includes a lower vacuum chuck and a frame member supported on the chuck for reciprocatory motion toward and away from the chuck surface. The chuck surface is arranged to hold substrates with predeposited solder in pockets at predetermined locations thereon. The frame member has openings aligned with those pockets and weights which extend through the openings. After substrates are placed on the chuck surface, the substrates are heated so that the predeposited solder reaches eutectic status, and then chips are placed on the substrates. The frame member is then mounted on the chuck and gradually lowered until the weights press against respective chips, thereby holding the chips in position on the substrates. The entire assembly is then transported to a solder reflow bonding station.

Abstract translation: 用于将多个芯片各自连接到多个基板中的相应一个的多个芯片的固定装置包括下部真空卡盘和支撑在卡盘上以朝向和远离卡盘表面往复运动的框架构件。 卡盘表面被布置成在其上的预定位置处将预沉积的焊料保持在凹穴中。 框架构件具有与延伸穿过开口的那些口袋和重物对齐的开口。 将基板放置在卡盘表面之后，加热基板，使预沉积的焊料达到共晶状态，然后将芯片放置在基板上。 然后将框架构件安装在卡盘上并逐渐降低，直到重物压在相应的芯片上，从而将芯片保持在基板上的适当位置。 然后将整个组件运输到焊料回流焊接站。