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    METHOD OF DOPING AND APPARATUS FOR DOPING
    81.
    发明申请
    METHOD OF DOPING AND APPARATUS FOR DOPING 审中-公开
    剔除方法和装置

    公开(公告)号：US20100266768A1

    公开(公告)日：2010-10-21

    申请号：US12734996

    申请日：2008-08-27

    Applicant: Abu Samah Zuruzi

    Inventor： Abu Samah Zuruzi

    IPC: B05D5/00 ,  B05D1/32 ,  B05C3/20 ,  B05C11/00

    CPC classification number: B81C1/00698 ,  B81B2201/0214 ,  B81B2201/058 ,  B81C1/00206 ,  B81C2201/0171 ,  G01N33/0024

    Abstract: A method of doping at least one element in an array of elements on a substrate is disclosed. The method comprises providing at least one microfluidic channel passing from a first location external of the at least one element to a second location in fluidic communication with the at least one element. A dopant fluid is passed through the at least one microfluidic channel to the at least one element for doping the at least one element. A corresponding apparatus is also disclosed.

    Abstract translation: 公开了一种在衬底上的元件阵列中掺杂至少一种元素的方法。 该方法包括提供至少一个从至少一个元件外部的第一位置通过至少与一个元件流体连通的第二位置的微流体通道。 掺杂剂流体通过至少一个微流体通道至至少一个元件以掺杂至少一个元件。 还公开了相应的装置。

    Integrated capacitive microfluidic sensors method and apparatus
    83.
    发明授权
    Integrated capacitive microfluidic sensors method and apparatus 有权
    集成电容微流体传感器的方法和装置

    公开(公告)号：US07796371B2

    公开(公告)日：2010-09-14

    申请号：US11830581

    申请日：2007-07-30

    Applicant: Jun Xie ,  Jason Shih ,  Yu-Chong Tai

    Inventor： Jun Xie ,  Jason Shih ,  Yu-Chong Tai

    IPC: H01G7/00

    CPC classification number: G01N27/226 ,  B81B7/02 ,  B81B2201/0292 ,  B81B2201/058 ,  G01L9/0042 ,  G01L9/0072

    Abstract: A micro fluidic device and method for capacitive sensing. The device includes a fluid channel including an inlet at a first end and an outlet at a second end, a cavity region coupled to the fluid channel, and a polymer based membrane coupled between the fluid channel and the cavity region. Additionally, the device includes a first capacitor electrode coupled to the membrane, a second capacitor electrode coupled to the cavity region and physically separated from the first capacitor electrode by at least the cavity region, and an electrical power source coupled between the first capacitor electrode and the second capacitor electrode and causing an electric field at least within the cavity region. The polymer based membrane includes a polymer.

    Abstract translation: 一种用于电容式感测的微流体装置和方法。 该装置包括流体通道，其包括在第一端处的入口和在第二端处的出口，耦合到流体通道的空腔区域以及耦合在流体通道和腔区域之间的基于聚合物的膜。 另外，该器件包括耦合到膜的第一电容器电极，耦合到空腔区域的第二电容器电极，并且至少通过腔区域与第一电容器电极物理分离;以及电源，耦合在第一电容器电极和 所述第二电容器电极至少在所述腔区域内引起电场。 基于聚合物的膜包括聚合物。

    Method of forming a sintered microfluidic device
    84.
    发明授权
    Method of forming a sintered microfluidic device 失效
    形成烧结微流体装置的方法

    公开(公告)号：US07767135B2

    公开(公告)日：2010-08-03

    申请号：US11975414

    申请日：2007-10-19

    Applicant: Diane Kimberlie Guilfoyle ,  Paul John Shustack ,  Lung-Ming Wu

    Inventor： Diane Kimberlie Guilfoyle ,  Paul John Shustack ,  Lung-Ming Wu

    IPC: C04B33/34 ,  B28B1/00 ,  C04B33/32 ,  C04B33/36 ,  B28B3/00 ,  B28B5/00

    CPC classification number: C03C17/28 ,  B81B2201/058 ,  B81C1/00071 ,  B81C2201/034 ,  C03B19/06 ,  C03C11/00 ,  C03C17/04 ,  C03C17/324 ,  C03C23/0005

    Abstract: Disclosed is a method of forming a structured sintered article including providing a mixture comprising a sinterable particulate material and a binder, the binder comprising, as a function of total resin content of the binder, at least 50% by weight of a thermoplastic binder material and at least 5% by weight of a radiation-curable binder material; shaping the mixture with a mold to form a structure; setting the structure by cooling the structure or by allowing the structure to cool; separating the structure from the mold; irradiating the structure so as to at least partially cure the radiation-curable binder material, and debinding and sintering the structure so as to form a structured sintered article. Shaping may include forming a structure having one or more open channels, and sintering may include sintering in together in contact with at least one additional structure so as to cover or enclose the channels.

    Abstract translation: 公开了一种形成结构化烧结制品的方法，包括提供包含可烧结颗粒材料和粘合剂的混合物，所述粘合剂包含作为粘合剂的总树脂含量的函数，至少50重量％的热塑性粘合剂材料和 至少5重量％的可辐射固化粘合剂材料; 用模具成型混合物以形成结构; 通过冷却结构或通过使结构冷却来设定结构; 将结构与模具分离; 照射该结构以至少部分地固化可辐射固化的粘合剂材料，以及脱结和烧结该结构以便形成结构化的烧结制品。 成形可以包括形成具有一个或多个开放通道的结构，并且烧结可以包括与至少一个附加结构接触在一起的烧结以覆盖或封闭通道。

    Method and apparatus for wafer-level micro-glass-blowing
    87.
    发明授权
    Method and apparatus for wafer-level micro-glass-blowing 有权
    用于晶圆级微玻璃吹制的方法和装置

    公开(公告)号：US07694531B2

    公开(公告)日：2010-04-13

    申请号：US11526436

    申请日：2006-09-25

    Applicant: E. Jesper Eklund ,  Andrei M. Shkel

    Inventor： E. Jesper Eklund ,  Andrei M. Shkel

    IPC: C03B19/10 ,  B29D22/00 ,  B29D22/04

    CPC classification number: C03B23/02 ,  B81B2201/058 ,  B81C1/00103 ,  G01C19/60 ,  Y10T428/1317

    Abstract: A method for forming microspheres on a microscopic level comprises the steps of defining holes through a substrate, disposing a sheet of thermally formable material onto the substrate covering the holes, heating the sheet of thermally formable material until a predetermined degree of plasticity is achieved, applying fluidic pressure through the holes to the sheet of thermally formable material, while the sheet of glass is still plastic, and forming microspheres on the substrate in the sheet of thermally formable material by means of continued application of pressure for a predetermined time. The invention also includes a substrate having a plurality of holes defined therethrough, a layer of thermally formable material disposed onto the substrate covering the plurality of holes, and a plurality of microspheres thermally formed in the layer by means of applied pressure through the holes when it has been heated to a predetermined degree of plasticity.

    Abstract translation: 在微观层面上形成微球的方法包括以下步骤：通过基底定义孔，将一片可热成形的材料放置在覆盖孔的基材上，加热可热成型的材料直到实现预定的可塑性，施加 通过孔到达可成形材料片的流体压力，同时玻璃片仍然是塑料，并且通过持续施加压力预定时间，在可热成型的片材中的基底上形成微球。 本发明还包括具有限定穿过其中的多个孔的衬底，设置在覆盖多个孔的衬底上的可热成型材料层，以及当通过所述孔施加的压力通过施加的压力在该层中热形成的多个微球体 已被加热到预定的塑性程度。

    SYSTEM-IN-PACKAGE PLATFORM FOR ELECTRONIC-MICROFLUIDIC DEVICES
    89.
    发明申请
    SYSTEM-IN-PACKAGE PLATFORM FOR ELECTRONIC-MICROFLUIDIC DEVICES 有权
    用于电子微流体装置的系统级封装平台

    公开(公告)号：US20090072332A1

    公开(公告)日：2009-03-19

    申请号：US12293284

    申请日：2007-03-07

    Applicant: Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

    Inventor： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

    IPC: H01L29/00 ,  H01L21/00

    CPC classification number: H01L37/00 ,  B01J2219/00783 ,  B01J2219/0095 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2200/14 ,  B01L2300/0645 ,  B01L2300/1827 ,  B01L2300/1883 ,  B01L2400/0415 ,  B81B2201/058 ,  B81C1/0023 ,  H01L2224/11 ,  Y10T436/11

    Abstract: The present invention relates to an integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate (106) on a first (122) support, an electronic circuit (102, 104) on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. The signal interface structure is arranged on the first semiconductor-substrate side and configured to receive electrical signals from the electronic circuit. A micro fluidic structure (126) is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away form the first support. The electronic-micro fluidic device forms a flexible platform for the formation of various System-in-Package applications. It achieves a clear separation between electrical and wet-chemical interfaces. The claimed method for fabricating the device of the invention also allows a simple formation of thermally isolated microfluidic structures.

    Abstract translation: 本发明涉及集成电子微流体装置，其集成电子微流体装置包括在第一（122）支撑件上的半导体衬底（106），在第一半导体衬底侧上的电子电路（102,104） 的半导体衬底，以及到外部设备的信号接口结构。 信号接口结构布置在第一半导体衬底侧并被配置为从电子电路接收电信号。 微流体结构（126）形成在半导体衬底中，并且被配置为限制流体并且允许仅在与第一半导体相反的第二半导体衬底侧上流体流过微流体结构 底部侧面和背面形成第一支撑。 电子 - 微流体装置形成用于形成各种系统级封装应用的灵活平台。 它实现了电气和湿化学界面之间的清晰分离。 所要求的制造本发明装置的方法还允许简单地形成热分离的微流体结构。

    SELF-INFLATED MICRO-GLASS BLOWING
    90.
    发明申请
    SELF-INFLATED MICRO-GLASS BLOWING 有权
    自曝玻璃玻璃吹制

    公开(公告)号：US20080280124A1

    公开(公告)日：2008-11-13

    申请号：US12113927

    申请日：2008-05-01

    Applicant: Erik Jesper Eklund ,  Andrei M. Shkel

    Inventor： Erik Jesper Eklund ,  Andrei M. Shkel

    IPC: B32B3/26 ,  B29C51/02 ,  C03C15/00

    CPC classification number: C03C11/007 ,  B01L3/502707 ,  B29C49/0042 ,  B29C51/008 ,  B29D11/00365 ,  B81B2201/0242 ,  B81B2201/058 ,  B81B2203/0315 ,  B81C1/00119 ,  B82Y40/00 ,  C03B23/02 ,  G01C19/60 ,  Y10T428/24998

    Abstract: A method for glass-blowing on a microscopic level includes the steps of defining a plurality of microholes in a wafer, disposing a sheet of thermally formable material onto the wafer covering the microholes, heating the sheet of thermally formable material until a predetermined degree of plasticity is achieved, applying self-induced fluidic pressure by expansion of the heated trapped gas in the microholes to the sheet of thermally formable material, while the sheet is still plastic, and simultaneously forming a plurality of blown micro-objects in the sheet on the wafer by means of continued application of pressure for a predetermined time.

    Abstract translation: 在微观水平上进行玻璃吹制的方法包括在晶片中限定多个微孔的步骤，将可热成型的材料片放置在覆盖微孔的晶片上，将可热成型的材料片加热至预定的塑性程度 通过将微孔中的被加热的捕获气体膨胀到片状的可热成形材料上而施加自身的流体压力，同时片材仍然是塑料，并且同时在晶片上的片材中形成多个吹出的微物体 通过持续施加压力达预定时间。

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