公开(公告)号：US20090078675A1

公开(公告)日：2009-03-26

申请号：US11861284

申请日：2007-09-26

Applicant: Darrell LaRue McReynolds ,  Lakshmi C.S. ,  Yao Fu ,  Kia Silverbrook

Inventor： Darrell LaRue McReynolds ,  Lakshmi C.S. ,  Yao Fu ,  Kia Silverbrook

IPC: G11B5/127

CPC classification number: G03F7/427 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2002/14475 ,  B41J2202/11 ,  B81B2201/052 ,  B81C1/00476 ,  B81C2201/0108 ,  H01L21/31138

Abstract: A method of photoresist removal is provided. The method employs a plasma formed from a gas chemistry comprising NH3. The method is particularly suitable for use in MEMS fabrication processes, such as inkjet printhead fabrication.

Abstract translation: 提供了光刻胶去除方法。 该方法采用由包含NH 3的气体化学物质形成的等离子体。 该方法特别适用于MEMS制造工艺，例如喷墨打印头制造。

公开(公告)号：US20090069458A1

公开(公告)日：2009-03-12

申请号：US12140539

申请日：2008-06-17

Applicant: Paul A. Kohl ,  Sue Ann Bidstrup Allen ,  Xiaoqun Wu ,  Clifford Lee Henderson

Inventor： Paul A. Kohl ,  Sue Ann Bidstrup Allen ,  Xiaoqun Wu ,  Clifford Lee Henderson

IPC: C08J3/28

CPC classification number: G03F7/004 ,  B81B2201/058 ,  B81B2203/0338 ,  B81B2203/0384 ,  B81C1/00103 ,  B81C2201/0108 ,  C08J3/28 ,  C08K5/0041 ,  G03F7/40 ,  Y10T428/24479

Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a photodefinable polymer having a sacrificial polymer and a photoinitiator.

Abstract translation: 提供聚合物，其使用方法及其分解方法。 一个示例性聚合物，其中包括具有牺牲聚合物和光引发剂的光可定义聚合物。

公开(公告)号：US07459267B2

公开(公告)日：2008-12-02

申请号：US11398183

申请日：2006-04-05

Applicant: Paul A. Kohl ,  Paul Jayachandran Joseph ,  Hollie Reed ,  Sue Bidstrup-Allen ,  Celesta E. White ,  Clifford Henderson

Inventor： Paul A. Kohl ,  Paul Jayachandran Joseph ,  Hollie Reed ,  Sue Bidstrup-Allen ,  Celesta E. White ,  Clifford Henderson

IPC: G03F7/36

CPC classification number: B81C1/00476 ,  B81C2201/0108 ,  H01L21/7682 ,  Y10S430/114

Abstract: Compositions, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary composition, among others, includes a polymer and a catalytic amount of a negative tone photoinitiator.

Abstract translation: 提供了组合物，其使用方法及其分解方法。 一个示例性组合物，其中包括聚合物和催化量的负色调光引发剂。

公开(公告)号：US07160815B2

公开(公告)日：2007-01-09

申请号：US10782355

申请日：2004-02-19

Applicant: Michael B. Korzenski ,  Thomas H. Baum ,  Chongying Xu ,  Eliodor G. Ghenciu

Inventor： Michael B. Korzenski ,  Thomas H. Baum ,  Chongying Xu ,  Eliodor G. Ghenciu

IPC: H01L21/461

CPC classification number: B81C1/00936 ,  B08B7/0021 ,  B81C2201/0108 ,  B81C2201/117 ,  H01L21/02063

Abstract: A method and composition for removing silicon-containing sacrificial layers from Micro Electro Mechanical System (MEMS) and other semiconductor substrates having such sacrificial layers is described. The etching compositions include a supercritical fluid (SCF), an etchant species, a co-solvent, and optionally a surfactant. Such etching compositions overcome the intrinsic deficiency of SCFs as cleaning reagents, viz., the non-polar character of SCFs and their associated inability to solubilize polar species that must be removed from the semiconductor substrate. The resultant etched substrates experience lower incidents of stiction relative to substrates etched using conventional wet etching techniques.

Abstract translation: 描述了用于从微机电系统（MEMS）和其它具有这种牺牲层的半导体衬底去除含硅牺牲层的方法和组合物。 蚀刻组合物包括超临界流体（SCF），蚀刻剂物质，共溶剂和任选的表面活性剂。 这样的蚀刻组合物克服了作为清洗剂的SCF的固有缺陷，即SCF的非极性特征以及它们不溶于必须从半导体衬底去除的极性物质。 所得到的蚀刻的衬底相对于使用常规湿蚀刻技术蚀刻的衬底的沉降事件较少。

公开(公告)号：US20060138076A1

公开(公告)日：2006-06-29

申请号：US10536890

申请日：2003-12-18

Applicant: Philippe Robert ,  France Michel ,  Catherine Maeder-Pachurka ,  Nicolas Sillon

Inventor： Philippe Robert ,  France Michel ,  Catherine Maeder-Pachurka ,  Nicolas Sillon

IPC: B44C1/22

CPC classification number: G01R3/00 ,  B33Y80/00 ,  B81B2203/0118 ,  B81C1/00611 ,  B81C2201/0108 ,  B81C2201/0125 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/24 ,  H01R13/2407 ,  H05K3/4092 ,  H05K7/1069 ,  H01L2924/00

Abstract: Production process of a flat suspended micro-structure using a sacrificial layer of polymer material and component obtained thereby The process successively comprises deposition of a sacrificial layer (2) of polymer material, deposition, on at least a part of the substrate (1) and of the front face of the sacrificial layer (2), of an embedding layer (6), the thickness whereof is larger than that of the sacrificial layer (2), and planarization so that the front faces of the sacrificial layer (2) and of the embedding layer (6) form a common flat surface. A formation layer (3) of a suspended structure (5) is deposited on the front face of the common flat surface. Planarization can comprise chemical mechanical polishing and etching of the embedding layer (6). Etching of the sacrificial layer (2) can be performed by means of a mask formed on the front face of a layer of polymer material eliminated during the planarization step.

Abstract translation: 使用聚合物材料的牺牲层和由此获得的部件的扁平悬浮微结构的制造方法该方法依次包括在基底（1）的至少一部分上沉积聚合物材料的牺牲层（2），沉积 （2）的牺牲层（2）的前表面，其厚度大于牺牲层（2）的厚度，并且平坦化，使得牺牲层（2）的前表面和 的嵌入层（6）形成共同的平坦表面。 悬挂结构（5）的形成层（3）沉积在公共平坦表面的前表面上。 平面化可以包括化学机械抛光和蚀刻嵌入层（6）。 牺牲层（2）的蚀刻可以通过形成在平坦化步骤期间消除的聚合物材料层的正面上的掩模进行。

公开(公告)号：US06958123B2

公开(公告)日：2005-10-25

申请号：US10167272

申请日：2002-06-10

Applicant: Jason S. Reid ,  Nungavaram S. Viswanathan

Inventor： Jason S. Reid ,  Nungavaram S. Viswanathan

IPC: B81B3/00 ,  C23F1/00 ,  H01L21/00

CPC classification number: B81C1/00476 ,  B81B2201/045 ,  B81C2201/0108 ,  B81C2201/112 ,  B81C2201/117 ,  B82Y30/00

Abstract: A method comprises depositing an organic material on a substrate; depositing additional material different from the organic material after depositing the organic material; and removing the organic material with a compressed fluid. Also disclosed is a method comprising: providing an organic layer on a substrate; after providing the organic layer, providing one or more layers of a material different than the organic material of the organic layer; removing the organic layer with a compressed fluid; and providing an anti-stiction agent with a compressed fluid to material remaining after removal of the organic layer.

Abstract translation: 一种方法包括在衬底上沉积有机材料; 在沉积有机材料之后沉积与有机材料不同的附加材料; 并用压缩流体除去有机材料。 还公开了一种方法，包括：在衬底上提供有机层; 在提供有机层之后，提供与有机层的有机材料不同的一层或多层材料; 用压缩流体去除有机层; 并且在去除有机层之后向剩余的材料提供具有压缩流体的抗静电剂。

公开(公告)号：US20050164127A1

公开(公告)日：2005-07-28

申请号：US11041834

申请日：2005-01-24

Applicant: Jason Reid ,  Nungavaram Viswanathan

Inventor： Jason Reid ,  Nungavaram Viswanathan

IPC: B81B3/00 ,  G03C5/00

CPC classification number: B81C1/00476 ,  B81B2201/045 ,  B81C2201/0108 ,  B81C2201/112 ,  B81C2201/117 ,  B82Y30/00

Abstract: A method comprises depositing an organic material on a substrate; depositing additional material different from the organic material after depositing the organic material; and removing the organic material with a compressed fluid. Also disclosed is a method comprising: providing an organic layer on a substrate; after providing the organic layer, providing one or more layers of a material different than the organic material of the organic layer; removing the organic layer with a compressed fluid; and providing an anti-stiction agent with a compressed fluid to material remaining after removal of the organic layer.

公开(公告)号：US20050118832A1

公开(公告)日：2005-06-02

申请号：US10724791

申请日：2003-12-01

Applicant: Michael Korzenski ,  Thomas Baum ,  Eliodor Ghenciu

Inventor： Michael Korzenski ,  Thomas Baum ,  Eliodor Ghenciu

IPC: B08B7/00 ,  B81B3/00 ,  H01L21/306 ,  H01L21/302 ,  H01L21/461

CPC classification number: B81C1/00936 ,  B08B7/0021 ,  B81C2201/0108 ,  B81C2201/117 ,  H01L21/02063

Abstract: A method and composition for removing silicon-containing sacrificial layers from Micro Electro Mechanical System (MEMS) substrates having such sacrificial layers is described. The etching compositions include a supercritical fluid, an etchant species, a co-solvent, and optionally a surfactant. Such etching compositions overcome the intrinsic deficiency of SCFs as cleaning reagents, viz., the non-polar character of SCFs and their associated inability to solubilize polar species that must be removed from the semiconductor substrate. The resultant etched MEMS substrates experience lower incidents of stiction relative to MEMS substrates etched using conventional wet etching techniques.

Abstract translation: 描述了从具有这种牺牲层的微机电系统（MEMS）衬底去除含硅牺牲层的方法和组合物。 蚀刻组合物包括超临界流体，蚀刻剂物质，共溶剂和任选的表面活性剂。 这样的蚀刻组合物克服了作为清洗剂的SCF的固有缺陷，即SCF的非极性特征以及它们不溶于必须从半导体衬底去除的极性物质。 所得蚀刻的MEMS衬底相对于使用常规湿蚀刻技术蚀刻的MEMS衬底的静态故障事件。

公开(公告)号：US20050016251A1

公开(公告)日：2005-01-27

申请号：US10919151

申请日：2004-08-16

Applicant: Benjamin Eldridge ,  Stuart Wenzel

Inventor： Benjamin Eldridge ,  Stuart Wenzel

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L21/768 ,  H01L23/48 ,  H01L23/482 ,  H01R13/24 ,  H05K3/40 ,  H05K7/10 ,  B21D31/00

CPC classification number: G01R3/00 ,  B33Y80/00 ,  B81B2203/0118 ,  B81C1/00611 ,  B81C2201/0108 ,  B81C2201/0125 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/24 ,  H01R13/2407 ,  H05K3/4092 ,  H05K7/1069 ,  H01L2924/00

Abstract: A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.

Abstract translation: 公开了一种具有一个或多个压花齿的成形工具，优选地，布置在基本平坦的基底上的多个这样的压花齿。 每个压花齿构造成用于形成牺牲层以提供用于形成微电子弹簧结构的轮廓表面。 每个压花齿具有对应于微电子弹簧的基部的突出区域和对应于微电子弹簧的光束轮廓的倾斜部分。 还公开了用于制造成形工具的许多方法。 这些方法包括材料去除方法，成型方法，重复冲压方法，弯曲方法和段组装方法。

公开(公告)号：US20040146803A1

公开(公告)日：2004-07-29

申请号：US10699330

申请日：2003-10-31

Inventor： Paul A. Kohl ,  Paul Jayachandran Joseph ,  Hollie Reed ,  Sue Bidstrup-Allen ,  Celesta E. White ,  Clifford Henderson

IPC: G03F007/004

CPC classification number: B81C1/00476 ,  B81C2201/0108 ,  H01L21/7682 ,  Y10S430/114

Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymer, among others, includes, a composition having a sacrificial polymer and a photoacid generator.

Abstract translation: 提供聚合物，其使用方法及其分解方法。 一个示例性聚合物，其中包括具有牺牲聚合物和光致酸产生剂的组合物。