公开(公告)号：US08146438B2

公开(公告)日：2012-04-03

申请号：US12513230

申请日：2008-10-09

Applicant: Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

Inventor： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC: G01L9/00

CPC classification number: G01R1/0735 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/205 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/516 ,  B32B2307/518 ,  C09J7/38 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  G01R31/2853 ,  H01L21/67132 ,  H01L21/67253

Abstract: Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

Abstract translation: 公开了一种用于检查的粘合片，其通过在基膜上布置粘合剂层而获得。 基膜和粘合剂层是导电的，并且在基膜和粘合剂层之间形成导电路径。 因此，可以在将半导体晶片或半导体芯片粘合到粘合片上的同时，进行通过切割半导体晶片获得的半导体晶片或半导体芯片的导电性的检查。 此外，该检查用粘合片能够防止半导体晶片的变形（翘曲）或断裂，或者在检查时在半导体晶片的背面产生裂纹或划痕。

公开(公告)号：US20110206886A1

公开(公告)日：2011-08-25

申请号：US12839153

申请日：2010-07-19

Applicant: Sun-Ki KIM

Inventor： Sun-Ki KIM

IPC: B32B33/00 ,  B32B3/00

CPC classification number: H01B1/22 ,  C08K3/017 ,  C08K3/08 ,  C09J7/29 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/602 ,  C09J2205/102 ,  C09J2400/163 ,  Y10T428/12 ,  Y10T428/14 ,  Y10T428/1438 ,  Y10T428/1476 ,  Y10T428/24612 ,  Y10T428/28 ,  Y10T428/2804

Abstract: A multipurpose adhesive tape with minimized curling is provided. The adhesive tape includes a base formed as a thin sheet, an adhesive attached to the reverse surface of the base, and a projection projecting along the length of the outer surface of the base within a portion of the width thereof.

Abstract translation: 提供最小化卷曲的多功能胶带。 胶带包括形成为薄片的基部，附着到基部的反面的粘合剂，以及在其宽度的一部分内沿着基部的外表面的长度突出的突起。

公开(公告)号：US20110105875A1

公开(公告)日：2011-05-05

申请号：US12967388

申请日：2010-12-14

Applicant: Daniel P. Segall ,  Iris E. Hilton ,  Melissa E. Szymanski ,  John R. Pennace

Inventor： Daniel P. Segall ,  Iris E. Hilton ,  Melissa E. Szymanski ,  John R. Pennace

IPC: A61B5/04

CPC classification number: C08K5/19 ,  C08K5/42 ,  C08L33/00 ,  C09J7/10 ,  C09J9/00 ,  C09J9/02 ,  C09J11/06 ,  C09J2201/602 ,  C09J2433/00 ,  Y10T428/24008 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2891

Abstract: A method is disclosed of detecting a bioelectrical signal from a subject. The method includes the steps of applying a composite material to a subject wherein the composite material includes a polymeric material and a polar material that is substantially dispersed within the polymeric material; coupling monitoring equipment to the second side of the composite material; permitting the polar material within the polymeric material to respond to the bioelectrical signal within the subject; and detecting a responsive electrical signal from the composite material that is representative of the bioelectrical signal. The polar material exhibits molecular compatibility with the polymeric material such that the polar material neither blooms to a surface of the polymeric material nor crystallizes within the polymeric material, and the composite material has a first side for contacting the subject and a second side.

Abstract translation: 公开了一种从受试者检测生物电信号的方法。 该方法包括将复合材料施加到受试者的步骤，其中复合材料包括聚合材料和基本上分散在聚合材料内的极性材料; 耦合监测设备到复合材料的第二面; 允许聚合物材料内的极性材料响应受试者内的生物电信号; 以及从代表生物电信号的复合材料中检测响应电信号。 极性材料表现出与聚合物材料的分子相容性，使得极性材料既不向聚合物材料的表面膨胀也不在聚合物材料内结晶，并且复合材料具有用于接触受试者的第一侧和第二侧。

公开(公告)号：US20110094771A1

公开(公告)日：2011-04-28

申请号：US12923963

申请日：2010-10-18

Applicant: Noritsugu Daigaku ,  Hironori Tamai ,  Yasushi Buzoujima

Inventor： Noritsugu Daigaku ,  Hironori Tamai ,  Yasushi Buzoujima

IPC: H01B5/00

CPC classification number: C09J7/28 ,  C09J2201/32 ,  C09J2201/602 ,  C09J2201/606

Abstract: The present invention has an object to provide an electroconductive pressure-sensitive adhesive tape that does not cause separator lifting. In particular, it is an object of the present invention to provide an electroconductive pressure-sensitive adhesive tape that does not cause separator lifting even when the tape is wound into a roll shape or has a long length and that has excellent protective properties for the pressure-sensitive adhesive layer and excellent handling properties. The electroconductive pressure-sensitive adhesive tape of the present invention includes an electroconductive pressure-sensitive adhesive tape main body having a pressure-sensitive adhesive layer on one side of a metal foil and a terminal formed on the metal foil and penetrating the pressure-sensitive adhesive layer, and includes a separator provided on a surface of the pressure-sensitive adhesive layer and having an elongation of 600% or more in the longitudinal direction.

Abstract translation: 本发明的目的是提供一种不引起分离器提升的导电粘合带。 特别地，本发明的目的是提供一种导电粘合带，其即使当带卷绕成卷状或具有长的长度并且对于压力具有优异的保护性能时也不会引起分离器的升高 敏感性粘合剂层和优异的操作性能。 本发明的导电性粘合带包括在金属箔的一面上具有粘合剂层的导电性粘合带主体和形成在金属箔上的端子，并且贯通该压敏粘合剂 并且包括设置在压敏粘合剂层的表面上并且在纵向上具有600％以上的伸长率的隔膜。

公开(公告)号：US20100320620A1

公开(公告)日：2010-12-23

申请号：US12526265

申请日：2008-02-26

Applicant: Hiroyuki Yasuda

Inventor： Hiroyuki Yasuda

IPC: H01L23/00 ,  C08L33/10

CPC classification number: H01L21/6836 ,  C08L33/06 ,  C08L2666/02 ,  C09J7/10 ,  C09J133/06 ,  C09J133/08 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  H01L23/293 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83385 ,  H01L2224/8388 ,  H01L2224/85 ,  H01L2225/06562 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/05341 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An adhesive film for a semiconductor containing an (A) ester (meth)acrylate copolymer and a (B) thermoplastic resin other than the ester (meth)acrylate copolymer, and composed so as to satisfy the following formula (1) for two hours from 10 minutes after starting measurement, in which γ represents an amount of shearing strain produced upon undergoing a shearing stress of 3000 Pa at a frequency of 1 Hz and a temperature of 175° C. on parallel plates of 20 mm in diameter, exhibits superior filling performance in surface unevenness of a substrate through an encapsulating material sealing process, despite that semiconductor chips are stacked in multiple layers in the semiconductor device and hence a wire bonding process imposes a longer thermal history. 0.10≦γ≦0.30  (1)

Abstract translation: 一种含有（A）（甲基）丙烯酸酯共聚物和（B）热塑性树脂的除了（甲基）丙烯酸酯共聚物之外的半导体的粘合剂薄膜，由下式（1）组成，满足下式（1） 开始测量后10分钟，其中γ表示在直径为20mm的平行板上以1Hz的频率和175℃的剪切应力在3000Pa下产生的剪切应变的量，表现出优异的填充 尽管半导体芯片在半导体器件中堆叠成多层，因此引线接合工艺施加了更长的热历史，但是通过封装材料密封工艺在基板的表面不均匀性方面。 0.10＆nlE;γ＆nlE; 0.30（1）

公开(公告)号：US20100108141A1

公开(公告)日：2010-05-06

申请号：US12615244

申请日：2009-11-09

Applicant: Naoki FUKUSHIMA ,  Isao TSUKAGOSHI ,  Takehiro SHIMIZU

Inventor： Naoki FUKUSHIMA ,  Isao TSUKAGOSHI ,  Takehiro SHIMIZU

IPC: H01L31/00 ,  H01B5/00 ,  H01R43/00

CPC classification number: H01L31/186 ,  C09J5/06 ,  C09J7/22 ,  C09J7/35 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2203/322 ,  C09J2400/163 ,  H01L31/0512 ,  Y02E10/50 ,  Y10T29/49194

Abstract: The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor.

Abstract translation: 本发明的电导体连接方法是在相互分离的第一导电体和第二导体之间进行电连接的方法，其特征在于，包括热压金属箔的步骤，形成在所述金属箔一侧的第一粘接层和 第一导电体，按顺序排列，将金属箔和第一导体电连接并结合，热压金属箔，形成在金属箔的另一侧的第一粘合层或第二粘合层，第二导电体 电导体，以该顺序布置，以电连接和接合金属箔和第二导电体。

公开(公告)号：US20090090545A1

公开(公告)日：2009-04-09

申请号：US12226670

申请日：2007-04-26

Applicant: Taketoshi Usui ,  Hitoshi Shimada

Inventor： Taketoshi Usui ,  Hitoshi Shimada

IPC: H05K1/16 ,  B32B5/16 ,  B05D5/12 ,  B29C65/00

CPC classification number: H05K3/323 ,  C08K7/18 ,  C09J7/22 ,  C09J7/30 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/106 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K2201/10234 ,  H05K2201/10378 ,  Y10T156/10 ,  Y10T428/2495 ,  H01L2924/00

Abstract: This invention provides an electroconductive particle placement sheet comprising electroconductive particles and an insulating resin sheet. The thickness of the insulating resin sheet is smaller than the average particle diameter of the electroconductive particles. Electroconductive particles are protruded from the reference plane (P1) on at least one side of the insulating resin sheet. The electroconductive particle in is part protruded from the reference plane (P1) is covered with a layer formed of the same resin as in the insulating resin sheet. The electroconductive particle placement sheet is characterized by satisfying a relationship of h1>h2 wherein h1 represents an average protrusion height, which is the average of distance between the reference plane (P1) and a tangential line (L1), which is a tangential line parallel to the reference plane (P1) of the electroconductive particle and is in contact with the part protruded from the reference plane (P1), and h2 represents an average protrusion height which is the average of distance between the reference plane (P2) and a tangential line (L2), which is a tangential line parallel to the reference plane (P2) of the electroconductive particle and is on the side opposite to the tangential line (L1), provided that, when the tangential line (L2) is within the insulating resin sheet, h2 0.

Abstract translation: 本发明提供一种包含导电颗粒和绝缘树脂片的导电颗粒放置片。 绝缘树脂片的厚度小于导电颗粒的平均粒径。 导电颗粒在绝缘树脂片的至少一侧上从参考平面（P1）突出。 导电颗粒从参考平面（P1）突出的部分被由与绝缘树脂片中相同的树脂形成的层覆盖。 导电粒子放置片的特征在于满足h1> h2的关系，其中h1表示作为平行突起高度的平均突起高度，该平均突起高度是参考平面（P1）和切线（L1）之间的距离的平均值，切线线是平行线 到导电颗粒的参考平面（P1）并且与从参考平面（P1）突出的部分接触，并且h2表示作为参考平面（P2）和切线之间的距离的平均值的平均突出高度 线（L2），其是与导电粒子的参考平面（P2）平行的切线，并且在与切线（L1）相反的一侧上，条件是当切线（L2）在绝缘线 树脂片，h2 <0; 当切线（L2）在参考平面（P2）上时，h2 = 0; 当切线（L2）在绝缘树脂片外时，h2> 0。

公开(公告)号：US20080164612A1

公开(公告)日：2008-07-10

申请号：US11651719

申请日：2007-01-10

Applicant: Qizhuo Zhuo

Inventor： Qizhuo Zhuo

IPC: H01L23/48 ,  H01L21/44

CPC classification number: C09J5/06 ,  C09J9/02 ,  C09J2201/602 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  Y10T428/25 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512

Abstract: A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.

公开(公告)号：US20070166549A1

公开(公告)日：2007-07-19

申请号：US11723644

申请日：2007-03-21

Applicant: Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

Inventor： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

IPC: B32B27/00 ,  B32B9/04

CPC classification number: C09J7/10 ,  C08L61/00 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/323 ,  H05K3/361 ,  Y10T428/12014 ,  Y10T428/2817 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31609 ,  Y10T428/31855 ,  Y10T428/31909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

Abstract: There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

Abstract translation: 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。

公开(公告)号：US07208105B2

公开(公告)日：2007-04-24

申请号：US10258548

申请日：2001-04-25

Applicant: Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

Inventor： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

IPC: H01B1/12 ,  H01B1/22 ,  H01L23/14

CPC classification number: C09J7/10 ,  C08L61/00 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/323 ,  H05K3/361 ,  Y10T428/12014 ,  Y10T428/2817 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31609 ,  Y10T428/31855 ,  Y10T428/31909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

Abstract: There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

Abstract translation: 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。