公开(公告)号：US09066376B2

公开(公告)日：2015-06-23

申请号：US13799861

申请日：2013-03-13

Applicant: Microwave Materials Technologies, Inc.

Inventor： Harold Dail Kimrey, Jr. ,  Gregory Eugene Cunningham

IPC: H05B6/68 ,  H05B6/80 ,  H05B6/78 ,  H01L21/67 ,  H05B6/70

CPC classification number: H05B6/78 ,  A23L3/01 ,  A23L3/02 ,  A23V2002/00 ,  A61B90/70 ,  A61L2/04 ,  A61L2/12 ,  A61L2202/21 ,  A61L2202/24 ,  A61L2202/26 ,  B65B55/06 ,  H01L21/67201 ,  H05B6/68 ,  H05B6/70 ,  H05B6/782 ,  H05B6/80

Abstract: A locking gate device suitable for selectively blocking the flow of fluid and/or articles through a pair of openings defined by two spaced-apart members is provided. The spaced-apart members may be opposing walls or flanges of two adjacent processing chambers or vessels in a pressurized heating system. The locking gate device includes a gate assembly that is movable within a gate-receiving space defined between opposed sealing surfaces of the spaced-apart members. The gate assembly comprises a pair of sealing plates and a drive member shiftable relative to the sealing plates. As the drive member is shifted between a retracted position and an extended position, a pair of bearings disposed between the sealing plates and the drive member forces the sealing plates outwardly to contact the sealing surfaces of the spaced-apart members. This substantially blocks the flow-through openings defined by one or both sealing surfaces and restricts flow therethrough.

Abstract translation: 提供一种适于通过由两个间隔开的构件限定的一对开口选择性地阻塞流体和/或制品流动的锁定门装置。 间隔开的构件可以是加压加热系统中两个相邻处理室或容器的相对壁或凸缘。 锁定门装置包括门组件，该门组件可在限定在间隔开的构件的相对的密封表面之间的门容纳空间内移动。 门组件包括一对密封板和可相对于密封板移动的驱动构件。 当驱动构件在缩回位置和延伸位置之间移动时，设置在密封板和驱动构件之间的一对轴承迫使密封板向外以与间隔开的构件的密封表面接触。 这基本上阻挡由一个或两个密封表面限定的流通开口并限制流过其中的流动。

公开(公告)号：US20150163860A1

公开(公告)日：2015-06-11

申请号：US14098860

申请日：2013-12-06

Applicant: Lam Research Corporation

Inventor： Vincent E. Burkhart ,  Yorkman Ma ,  Martin E. Freeborn ,  Ishtak Karim

IPC: H05B3/00 ,  H01L21/324 ,  G02B19/00 ,  H01L21/683

CPC classification number: H05B3/0047 ,  G02B19/0023 ,  G02B19/009 ,  H01L21/67115 ,  H01L21/67201

Abstract: A technique and apparatus are provided for supplying substantially uniform radiant heat energy to a semiconductor wafer in a load lock or process chamber using a light source and a set of radially-symmetric reflectors.

Abstract translation: 提供了一种技术和装置，用于使用光源和一组径向对称反射器，在负载锁或处理室中的半导体晶片上提供基本均匀的辐射热能。

公开(公告)号：US20150132946A1

公开(公告)日：2015-05-14

申请号：US14558548

申请日：2014-12-02

Applicant: Lam Research Corporation

Inventor： Hyungsuk Alexander Yoon ,  John Boyd ,  Yezdi Dordi ,  Fritz C. Redeker

IPC: H01L21/768 ,  H01L21/02

CPC classification number: H01L21/67196 ,  C23C14/22 ,  C23C16/06 ,  C23C16/44 ,  C23C16/45544 ,  C23C16/52 ,  C23C18/1619 ,  C23C18/1632 ,  C23C18/1653 ,  C23C18/38 ,  H01L21/0206 ,  H01L21/02063 ,  H01L21/02068 ,  H01L21/02074 ,  H01L21/288 ,  H01L21/321 ,  H01L21/32115 ,  H01L21/32135 ,  H01L21/32136 ,  H01L21/67028 ,  H01L21/67161 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/6723 ,  H01L21/76807 ,  H01L21/76814 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76861 ,  H01L21/76862 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76876 ,  H01L21/76879

Abstract: A method is provided, including the following method operations: depositing a metallic barrier layer to line a copper interconnect structure by a dry process in an integrated system configured to operate a mixture of dry and wet processes; depositing the functionalization layer over the metallic barrier layer by a wet process in the integrated system; and, depositing the copper layer over the functionalization layer in the copper interconnect structure by a wet process in the integrated system after the functionalization layer is deposited over the metallic barrier layer, wherein the material used for the functionalization layer comprises a complexing group with at least two ends, one end of the complexing group forming a bond with the metallic barrier layer and another end of the complexing group forming a bond with the copper layer.

Abstract translation: 提供了一种方法，包括以下方法操作：在被配置为操作干法和湿法工艺的混合物的集成系统中，通过干法沉积金属阻挡层以使铜互连结构排列; 在集成系统中通过湿法在金属阻挡层上沉积官能化层; 并且在所述功能化层沉积在所述金属阻挡层上之后，通过所述集成系统中的湿法在所述铜互连结构中的所述官能化层上沉积所述铜层，其中用于所述官能化层的所述材料包括至少具有络合基团 两端，络合基团的一端与金属阻挡层形成键合，而络合基团的另一端与铜层形成键合。

公开(公告)号：US08992689B2

公开(公告)日：2015-03-31

申请号：US13408703

申请日：2012-02-29

Applicant: Adauto Diaz ,  Andrew Nguyen ,  Benjamin Schwarz ,  Eu Jin Lim ,  Jared Ahmad Lee ,  James P. Cruse ,  Li Zhang ,  Scott M. Williams ,  Xiaoliang Zhuang ,  Zhuang Li

Inventor： Adauto Diaz ,  Andrew Nguyen ,  Benjamin Schwarz ,  Eu Jin Lim ,  Jared Ahmad Lee ,  James P. Cruse ,  Li Zhang ,  Scott M. Williams ,  Xiaoliang Zhuang ,  Zhuang Li

IPC: B08B5/00 ,  H01J37/32 ,  H01L21/67

CPC classification number: H01J37/32357 ,  H01L21/67201

Abstract: Methods for removing halogen-containing residues from a substrate are provided. By combining the heat-up and plasma abatement steps, the manufacturing throughput can be improved. Further, by appropriately controlling the pressure in the abatement chamber, the removal efficiency can be improved as well.

Abstract translation: 提供从底物中除去含卤素残基的方法。 通过结合加热和等离子体消除步骤，可以提高制造产量。 此外，通过适当地控制减压室中的压力，也可以提高除去效率。

公开(公告)号：US08985935B2

公开(公告)日：2015-03-24

申请号：US13757489

申请日：2013-02-01

Applicant: Novellus Systems, Inc.

Inventor： Mark K. Tan ,  Nicholas M. Kopec ,  Richard M. Blank

IPC: B25J19/00 ,  F16F7/10 ,  B25J18/00 ,  B25J15/00 ,  F16F15/10 ,  B25J11/00 ,  H01L21/67 ,  H01L21/687

CPC classification number: F16F7/10 ,  B25J11/0095 ,  B25J15/00 ,  B25J18/00 ,  F16F15/10 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/68707 ,  Y10S901/30 ,  Y10T74/20305

Abstract: A calibrated mass damper for use with end effectors for semiconductor wafer handling robots is described. The calibrated mass damper reduces vibrational response in an end effector carrying a semiconductor wafer without requiring modification of the end effector structure.

Abstract translation: 描述了用于半导体晶片处理机器人的末端执行器的校准质量阻尼器。 校准的质量阻尼器减少了携带半导体晶片的末端执行器中的振动响应，而不需要修改端部执行器结构。

公开(公告)号：US20150056043A1

公开(公告)日：2015-02-26

申请号：US14050795

申请日：2013-10-10

Applicant: APPLIED MATERIALS, INC.

Inventor： Michael Carl Hankes

IPC: H01L21/68 ,  H01L21/677

CPC classification number: H01L21/67201 ,  H01L21/67748 ,  H01L21/681

Abstract: A workpiece orientation is determined by camera during transfer to a load lock, and the orientation is corrected during load lock pump down.

Abstract translation: 工件方向由传送到装载锁定期间的照相机确定，并且在装载锁定泵下降期间校正取向。

公开(公告)号：US20150044001A1

公开(公告)日：2015-02-12

申请号：US14454926

申请日：2014-08-08

Applicant: Persimmon Technologies, Corp.

Inventor： Christopher Hofmeister ,  Martin Hosek

IPC: H01L21/677 ,  B25J15/06 ,  B25J11/00

CPC classification number: B25J11/0095 ,  H01L21/67196 ,  H01L21/67201

Abstract: An apparatus has a vacuum transport chamber having first and second isolation valves coupled to first and second substrate processing locations, and third and fourth isolation valves coupled to a load lock. First and substrate transport vacuum robots are provided. The load lock is between the first and second substrate transport vacuum robots, and has an atmospheric isolation valve. The atmospheric isolation valve, the third and the fourth isolation valves are arranged in a spaced triangular relationship. The first substrate transport vacuum robot transports a processed substrate from the first processing location to the load lock and transports an unprocessed substrate from the load lock to the first processing location substantially simultaneously as the second substrate transport vacuum robot transports a different processed substrate from the second processing location to the load lock and transports a different unprocessed substrate from the load lock to the second processing location.

Abstract translation: 一种装置具有真空输送室，其具有联接到第一和第二基板处理位置的第一隔离阀和第二隔离阀，以及联接到加载锁的第三和第四隔离阀。 首先提供基板输送真空机器人。 负载锁定在第一和第二基板输送真空机器人之间，并具有大气隔离阀。 大气隔离阀，第三和第四隔离阀以间隔三角关系布置。 第一衬底输送真空机器人将经处理的衬底从第一处理位置传送到负载锁定，并且基本上同时将未处理的衬底从负载锁传送到第一处理位置，因为第二衬底输送真空机器人将不同的处理衬底从第二处理衬底 将加工位置加载到加载锁定，并将不同的未处理基板从加载锁传送到第二处理位置。

公开(公告)号：US20140349011A1

公开(公告)日：2014-11-27

申请号：US14458756

申请日：2014-08-13

Applicant: Oerlikon Advanced Technologies AG

Inventor： Jurgen Weichart

IPC: C23C16/458

CPC classification number: C23C16/458 ,  H01L21/67201 ,  H01L21/67748 ,  H01L21/67751

Abstract: A process apparatus for treatment of a substrate comprising a load chamber for loading the substrate, a process chamber for processing the substrate, a sealing plane separating the process chamber from the load chamber and means for vertically moving the substrate from the load chamber to the process chamber, and a method for treating the substrate are provided. The load chamber is located in one of the lower and upper portions of the process apparatus, and the process chamber is located in the other of the lower and upper portions of the process apparatus. The process apparatus and method of the present invention will provide easy maintenance and reduced costs by reducing the number of movements for loading the substrate.

Abstract translation: 一种用于处理基板的处理装置，包括用于装载基板的装载室，用于处理基板的处理室，将处理室与装载室分离的密封平面以及用于将基板从装载室垂直移动到处理装置 室，以及处理基板的方法。 装载室位于处理装置的下部和上部之一中，并且处理室位于处理装置的下部和上部的另一个中。 本发明的处理装置和方法将通过减少用于装载基板的移动次数来提供容易的维护和降低的成本。

公开(公告)号：US20140294546A1

公开(公告)日：2014-10-02

申请号：US14305003

申请日：2014-06-16

Applicant: Dynamic Micro Systems, Semiconductor Equipment GmbH

Inventor： Lutz Rebstock

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67201 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67778

Abstract: The present invention discloses apparatuses and method for configuring a compartmentable equipment to accommodate emergency responses. An exemplary equipment comprises a plurality of removable compartments for storing workpieces so that in emergency events, such as power failure or equipment failure, the workpieces can be removed from the equipment for continuing processing without disrupting the flow of the fabrication facility. The compartmentable equipment can comprise emergency access ports, including mating interface to a portable workpiece removal equipment to allow accessing the individual compartments without compromising the quality, defects and yield of the workpieces stored in the stocker.

公开(公告)号：US20140271054A1

公开(公告)日：2014-09-18

申请号：US14211123

申请日：2014-03-14

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Joseph Yudovsky ,  Jason M. Schaller ,  Jeffrey C. Blahnik ,  Robert B. Vopat ,  Malcolm N. Daniel, JR. ,  Robert Mitchell

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67201 ,  H01L21/67754 ,  H01L21/68707

Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

Abstract translation: 公开了批量装载锁定装置的各种实施例。 批量装载锁定装置包括装载锁定体，其包括第一和第二装载锁定开口，在装载锁定体内的升降组件，升降组件包括多个晶圆台，多个晶片台中的每一个适于提供通过第一 和第二负载锁定开口，其中批量装载锁定装置包括温度控制能力（例如，加热或冷却）。 批量装载锁定装置能够将批次的晶片转入和移出各种处理室。 还提供了包括批量加载锁定装置和操作批量加载锁定装置的方法的系统，以及许多其它方面。