公开(公告)号：US09324474B2

公开(公告)日：2016-04-26

申请号：US14554971

申请日：2014-11-26

Applicant: Robert Bosch GmbH

Inventor： Heribert Weber ,  Yvonne Bergmann ,  Klaus Krueger ,  Andreas Rathjen

IPC: H01B1/22 ,  C09D11/322 ,  H05K1/09 ,  H05K3/40 ,  C09D11/52 ,  H01L21/283 ,  H05K3/12

CPC classification number: H01B1/22 ,  C09D11/322 ,  C09D11/52 ,  H01L21/283 ,  H01L21/288 ,  H01L21/76898 ,  H01L2224/24145 ,  H01L2224/48091 ,  H01L2924/00014 ,  H05K1/097 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/403 ,  H05K3/4053 ,  H05K2201/0266 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2203/1105 ,  H01L2224/45099

Abstract: A dispersion is provided having a dispersion medium and a plurality of colloid particles finely distributed in the dispersion medium, the colloid particles being electrically conductive, the dispersion being a functional ink for the wetting of an inner wall of a contacting opening of a substrate using a print process.

Abstract translation: 提供了具有分散介质和细分散在分散介质中的多个胶体颗粒的分散体，胶体颗粒是导电的，该分散体是用于润湿基材的接触开口的内壁的功能油墨，其使用 打印过程。

公开(公告)号：US20150314371A1

公开(公告)日：2015-11-05

申请号：US14650348

申请日：2013-10-02

Applicant: SUMITOMO METAL MINING CO., LTD.

Inventor： Toshiaki TERAO ,  Yuji KAWAKAMI

IPC: B22F1/00 ,  C22C5/06 ,  H01B1/02 ,  C09D17/00

CPC classification number: B22F1/0011 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3006 ,  C09D17/006 ,  C22C5/06 ,  H01B1/02 ,  H01B1/22 ,  H05K1/092 ,  H05K2201/0266

Abstract: Provided is a silver powder which has an appropriate viscosity range at the time of paste production, can be easily kneaded, and prevents the occurrence of flakes. The silver powder to be used has a specific surface area ratio SAB/SAS of 0.5 to 0.9, wherein SAB is a specific surface area measured by the BET method, and SAS is a specific surface area calculated from a mean primary-particle diameter DS measured with a scanning electron microscope. Furthermore, the silver powder preferably has a degree of aggregation of 1.5 to 5.0, the degree being obtained in such a manner that a volume median diameter D50 measured by laser diffraction scattering is divided by the foregoing Ds.

Abstract translation: 提供一种在糊料生产时具有适当粘度范围的银粉，可以容易地捏合，并防止出现薄片。 所使用的银粉末的比表面积比SAB / SAS为0.5〜0.9，其中SAB是通过BET法测定的比表面积，SAS是由测定的平均初级粒径DS计算出的比表面积 用扫描电子显微镜。 此外，银粉末的聚集度优选为1.5〜5.0，其程度通过将激光衍射散射测定的体积中值径D50除以上述Ds而得到。

公开(公告)号：US20150151328A1

公开(公告)日：2015-06-04

申请号：US14554971

申请日：2014-11-26

Applicant: Robert Bosch GmbH

Inventor： Heribert WEBER ,  Yvonne BERGMANN ,  Klaus KRUEGER ,  Andreas RATHJEN

IPC: B05D5/00 ,  B41J2/14

CPC classification number: H01B1/22 ,  C09D11/322 ,  C09D11/52 ,  H01L21/283 ,  H01L21/288 ,  H01L21/76898 ,  H01L2224/24145 ,  H01L2224/48091 ,  H01L2924/00014 ,  H05K1/097 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/403 ,  H05K3/4053 ,  H05K2201/0266 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2203/1105 ,  H01L2224/45099

Abstract: A dispersion is provided having a dispersion medium and a plurality of colloid particles finely distributed in the dispersion medium, the colloid particles being electrically conductive, the dispersion being a functional ink for the wetting of an inner wall of a contacting opening of a substrate using a print process.

Abstract translation: 提供了具有分散介质和细分散在分散介质中的多个胶体颗粒的分散体，胶体颗粒是导电的，该分散体是用于润湿基材的接触开口的内壁的功能油墨，其使用 打印过程。

公开(公告)号：US20140353004A1

公开(公告)日：2014-12-04

申请号：US14270131

申请日：2014-05-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyun Chul Jung ,  Joon Seok Kang ,  Jang Bae Son ,  Sang Hyun Shin ,  Kwang Jik Lee ,  Hye Sook Shin

IPC: H05K1/03 ,  B05D3/00 ,  C08K3/22 ,  C08K3/38 ,  C08K3/36

CPC classification number: H05K1/0373 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/14 ,  C08K3/16 ,  C08K3/22 ,  C08K3/28 ,  C08K3/36 ,  C08K3/38 ,  C08K2003/164 ,  C08K2003/221 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/003 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0266 ,  C08L63/00

Abstract: Disclosed herein are an insulation resin composition for a printed circuit board including: an epoxy resin, a first inorganic filler having thermal conductivity of 20 W/mK or more, and a second inorganic filler having relative permittivity less than 10, and an insulating film, a prepreg, and a printed circuit board.

Abstract translation: 本发明公开了一种用于印刷电路板的绝缘树脂组合物，其包括：环氧树脂，导热率为20W / mK以上的第一无机填料和相对介电常数小于10的第二无机填料，以及绝缘膜， 预浸料和印刷电路板。

公开(公告)号：US20140134350A1

公开(公告)日：2014-05-15

申请号：US14157450

申请日：2014-01-16

Applicant: Lockheed Martin Corporation

Inventor： Alfred A. Zinn

IPC: C23C24/08

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract translation: 组合物可以具有直径为20纳米或更小并具有小于约220℃的熔化温度的金属纳米颗粒。制备金属纳米颗粒的方法可包括制备溶剂，向溶剂中加入前体与金属， 加入第一表面活性剂，在还原剂中混合，并加入第二表面活性剂以阻止纳米颗粒的形成。 形成的铜和/或铝纳米颗粒组合物可用于将电子部件无铅焊接到电路板。 组合物可以包括可以具有铜纳米孔，无定形铝壳和有机表面活性剂涂层的纳米颗粒。 组合物可以具有铜或铝纳米颗粒。 大约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

公开(公告)号：US20130043067A1

公开(公告)日：2013-02-21

申请号：US13350487

申请日：2012-01-13

Applicant: Katsura HAYASHI

Inventor： Katsura HAYASHI

IPC: H05K1/00 ,  B32B5/16 ,  B82Y99/00

CPC classification number: B82Y40/00 ,  B32B3/266 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B5/28 ,  B32B7/02 ,  B32B15/043 ,  B32B15/14 ,  B32B15/20 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/101 ,  B32B2262/103 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/3065 ,  B32B2307/536 ,  B32B2307/54 ,  B32B2457/08 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0358 ,  Y10T428/25

Abstract: [PROBLEM] To provide a circuit board improved in electrical reliability.[SOLUTION] A circuit board 3 comprises a plurality of first inorganic insulating particles 13a which are connected to each other via first neck structures 17a and have a particle size of 3 nm or more and 110 nm or less and a resin (third filling portions 19c) arranged in first gaps G1 among the plurality of first inorganic insulating particles 13a.

Abstract translation: [问题]提供改善电气可靠性的电路板。 电路板3包括通过第一颈部结构17a彼此连接并具有3nm以上且110nm以下的粒径的多个第一无机绝缘粒子13a和树脂（第三填充部19c ）布置在多个第一无机绝缘颗粒13a中的第一间隙G1中。

公开(公告)号：US20120315495A1

公开(公告)日：2012-12-13

申请号：US13511369

申请日：2010-11-23

Applicant: Manuel Arturo Lopez Quintela

Inventor： Manuel Arturo Lopez Quintela

IPC: H01B1/02 ,  B32B15/02 ,  B32B15/085 ,  B32B15/12 ,  B05D5/12 ,  B32B15/088 ,  B82Y30/00

CPC classification number: C09D11/52 ,  C08K3/08 ,  C09D5/24 ,  C09D7/67 ,  C09D7/68 ,  C09D11/38 ,  H01B1/02 ,  H05K1/097 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31703

Abstract: The invention relates to conductive inks obtained by combining AQCs and metal nanoparticles. Atomic quantum clusters (AQCs), which melt at temperatures of less than 150° C., are used as low-temperature “flux” for the formulation of conductive inks. The combination of AQCs with bimodal and trimodal mixtures of nanoparticles of various sizes guarantees the elimination of free volumes in the final sintering of the nanoparticles in order to achieve electronic structures with very low resistivity (close to that of the bulk material) with low-temperature thermal treatments (

Abstract translation: 本发明涉及通过组合AQC和金属纳米粒子而获得的导电油墨。 在低于150℃的温度下熔化的原子量子簇（AQC）用作导电油墨配方的低温通量。 AQC与各种尺寸的纳米颗粒的双峰和三峰混合物的组合确保了在纳米颗粒的最终烧结中消除自由体积，以便实现具有低电阻率（接近散装材料的电阻率）的电子结构，其具有低温 热处理（<150°C）

公开(公告)号：US08212151B2

公开(公告)日：2012-07-03

申请号：US12471802

申请日：2009-05-26

Applicant: Takayuki Yamamoto

Inventor： Takayuki Yamamoto

IPC: H05K1/00

CPC classification number: H05K3/3452 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0231 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15174 ,  H05K1/0254 ,  H05K3/285 ,  H05K3/3436 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0769 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A wiring substrate includes: an insulating layer; a wiring formed on the insulating layer; and a solder resist layer formed on the insulating layer so as to cover at least a portion of the wiring, the solder resist layer being constituted by a plurality of layers, wherein the plurality of layers contain fillers of different grain diameters, a layer thickness of an innermost layer for constituting the plurality of layers is thicker than a layer thickness of the wiring, and a grain diameter of the filler contained in the innermost layer is smaller than a shortest interval between adjacent lines of the wiring.

Abstract translation: 布线基板包括：绝缘层; 形成在绝缘层上的布线; 以及形成在所述绝缘层上以便覆盖所述布线的至少一部分的阻焊层，所述阻焊层由多层构成，其中所述多层包含不同晶粒直径的填料，层厚度 用于构成多个层的最内层比布线的层厚度厚，并且包含在最内层中的填料的粒径小于布线的相邻线之间的最短间隔。

公开(公告)号：US20120106111A1

公开(公告)日：2012-05-03

申请号：US12916569

申请日：2010-10-31

Applicant: JOSEPH MAZZOCHETTE ,  Sarwan Kumar Khanna

Inventor： JOSEPH MAZZOCHETTE ,  Sarwan Kumar Khanna

IPC: H05K7/00 ,  H01F1/00 ,  H01F1/26 ,  C09K5/00 ,  H01F1/04 ,  B82Y99/00 ,  B82Y30/00

CPC classification number: H05K3/323 ,  B82Y30/00 ,  H01F1/26 ,  H01F1/37 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/29388 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/83887 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15787 ,  H01L2924/3011 ,  H05K2201/0218 ,  H05K2201/0266 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A composition of matter comprising a plurality of nanoparticles in a non-conductive binder, wherein, the type of nanoparticles form isolated parallel electrically and thermally conductive columns when cured in the presence of the magnetic field. Also wherein the plurality of nanoparticles are Paramagnetic or Ferromagnetic magnetic. Wherein the nano particles are coated, and of a particular shape. Wherein the particles are selected from the group consisting of; Al, Pt, Cr, Mn, crown glass, Fe, Ni, and Co, Ni—Fe/SiO2, Co/SiO2, Fe—Co/SiO2, Fe/nickel-ferrite, Ni—Zn-ferrite/SiO2, Fe—Ni/polymer, Co/polymer, ferrites, iron oxide and any combination and alloy thereof, and the Binder selected from the group consisting of; epoxies, polyurethanes, polyimides, polymeric materials, silicones, adhesives, acrylates, the UV curable modifier and any combination thereof.

Abstract translation: 一种在非导电粘合剂中包含多个纳米颗粒的物质组合物，其中当在磁场存在下固化时，纳米颗粒的类型形成隔离的平行的导电和导热柱。 而且其中多个纳米颗粒是顺磁性或铁磁性的。 其中纳米颗粒被涂覆并且具有特定形状。 其中颗粒选自： Al，Pt，Cr，Mn，冠状玻璃，Fe，Ni和Co，Ni-Fe / SiO2，Co / SiO2，Fe-Co / SiO2，Fe /镍铁氧体，Ni-Zn-铁素体/ Ni /聚合物，Co /聚合物，铁氧体，氧化铁及其任何组合和合金，以及选自以下的粘合剂： 环氧树脂，聚氨酯，聚酰亚胺，聚合物材料，硅酮，粘合剂，丙烯酸酯，UV可固化改性剂及其任何组合。

公开(公告)号：US08017044B2

公开(公告)日：2011-09-13

申请号：US12169090

申请日：2008-07-08

Applicant: Naveen Chopra ,  Yuning Li ,  Peter M. Kazmaier

Inventor： Naveen Chopra ,  Yuning Li ,  Peter M. Kazmaier

IPC: H01B1/02 ,  H01B1/04 ,  C09D11/00 ,  B05D5/12

CPC classification number: H05K1/097 ,  B22F1/0014 ,  B22F2001/0092 ,  B22F2999/00 ,  C09D11/037 ,  C09D11/36 ,  C09D11/52 ,  H05K2201/0224 ,  H05K2201/0266 ,  B22F1/0018

Abstract: A bimodal metal nanoparticle composition includes first metal nanoparticles having an average diameter of from about 50 nm to about 1000 nm, and second stabilized metal nanoparticles having an average diameter of from about 0.5 nm to about 20 nm, the second stabilized metal nanoparticles including metal cores having a stabilizer attached to the surfaces thereof, wherein the stabilizer is a substituted dithiocarbonate.

Abstract translation: 双峰金属纳米颗粒组合物包含平均直径为约50nm至约1000nm的第一金属纳米颗粒和平均直径为约0.5nm至约20nm的第二稳定金属纳米颗粒，第二稳定化金属纳米颗粒包括金属芯 具有附着在其表面上的稳定剂，其中稳定剂是取代的二硫代碳酸酯。