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81.发明申请LOW COST ELECTRICAL TERMINALS MANUFACTURED FROM CONDUCTIVE LOADED RESIN-BASED MATERIALS 审中-公开从导电负载树脂材料制造的低成本电气端子公开(公告)号：US20130130089A1
公开(公告)日：2013-05-23
申请号：US13743244
申请日：2013-01-16
Applicant: Thomas Aisenbrey
Inventor： Thomas Aisenbrey
CPC classification number: H01M2/30 , B29C45/0001 , B29C45/0013 , B29C48/022 , B29K2995/0005 , B29K2995/0013 , B29L2031/3456 , B29L2031/3468 , B29L2031/36 , G06K19/07749 , H01B3/30 , H01B3/308 , H01B7/02 , H01B13/0036 , H01M2/00 , H01M10/6551 , H01Q1/1271 , H01Q1/38 , H01Q1/40 , H01Q9/0407 , H01Q9/16 , H01Q9/30 , H05K1/095 , H05K3/101 , H05K3/107 , H05K2201/0281 , H05K2201/09118 , H05K2203/0113 , Y10T29/49108
Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.
Abstract translation: 电端子由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。
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82.发明授权Low cost electrical terminals manufactured from conductive loaded resin-based materials 有权由导电负载的树脂基材料制造的低成本电气端子公开(公告)号：US08377585B2
公开(公告)日：2013-02-19
申请号：US12798898
申请日：2010-04-13
Applicant: Thomas Aisenbrey
Inventor： Thomas Aisenbrey
IPC: H01M2/02
CPC classification number: H01M2/30 , B29C45/0001 , B29C45/0013 , B29C47/0004 , B29K2995/0005 , B29K2995/0013 , B29L2031/3456 , B29L2031/3468 , B29L2031/36 , G06K19/07749 , H01B3/30 , H01B3/308 , H01B7/02 , H01B13/0036 , H01M2/00 , H01M10/6551 , H01Q1/1271 , H01Q1/38 , H01Q1/40 , H01Q9/0407 , H01Q9/16 , H01Q9/30 , H05K1/095 , H05K3/101 , H05K3/107 , H05K2201/0281 , H05K2201/09118 , H05K2203/0113 , Y10T29/49108
Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.
Abstract translation: 电端子由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。
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83.发明授权Methods of making electrical motor components from conductive loaded resin-based materials 有权由导电负载的树脂基材料制造电动机部件的方法公开(公告)号：US08268222B2
公开(公告)日：2012-09-18
申请号：US11127578
申请日：2005-05-12
Applicant: Thomas Aisenbrey
Inventor： Thomas Aisenbrey
CPC classification number: H01R39/20 , B29C45/0001 , B29C45/0013 , B29K2995/0005 , B29L2031/3456 , G06K19/07749 , H01F5/06 , H01F27/22 , H01Q1/1271 , H01Q1/36 , H01Q1/38 , H01Q1/40 , H01Q9/0407 , H01Q9/16 , H01Q9/30 , H01R13/6599 , H02K1/02 , H02K1/04 , H02K5/02 , H05K1/095 , H05K3/101 , H05K3/107 , H05K2201/0281 , H05K2201/09118 , H05K2203/0113 , Y10T29/49009 , Y10T29/49119
Abstract: Electric motor components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
Abstract translation: 电动机部件由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。
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公开(公告)号：US08186053B2
公开(公告)日：2012-05-29
申请号：US12271519
申请日：2008-11-14
Applicant: Kishio Yokouchi , Hideaki Yoshimura , Katsuya Fukase
Inventor： Kishio Yokouchi , Hideaki Yoshimura , Katsuya Fukase
CPC classification number: H01L23/49822 , H01L23/145 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K1/056 , H05K3/426 , H05K3/445 , H05K3/4608 , H05K2201/0281 , H05K2201/0323 , H05K2201/0347 , H05K2201/0959 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/12035 , H01L2224/0401
Abstract: A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as strength and thermal expansion coefficient. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs formed by disposing carbon fibers so as to produce openings at positions where plated through holes will pass through and impregnating the carbon fibers with resin; a step of forming through holes that pass inside the openings at positions of the openings in the core portion; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the carbon fibers and thereby produce a core substrate.
Abstract translation: 电路板具有以细间距布置的电镀通孔，并且满足与强度和热膨胀系数等特性有关的要求。 一种电路板的制造方法，其特征在于，包括：通过热压缩形成芯部的步骤，通过设置碳纤维形成的预浸料，以在电镀通孔穿过的位置处产生开口，并用树脂浸渍碳纤维; 在芯部的开口部的位置形成贯通孔内的通孔的工序; 以及在通孔的内表面上形成导电层的步骤，在不干扰碳纤维的位置处形成电镀通孔，从而制造芯基板。
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公开(公告)号：US20120118427A1
公开(公告)日：2012-05-17
申请号：US13153609
申请日：2011-06-06
Applicant: David Stuart Brookstein , Muthu Govindaraj
Inventor： David Stuart Brookstein , Muthu Govindaraj
CPC classification number: D03D11/00 , D03D1/0088 , D03D13/006 , D10B2401/16 , H01H2203/0085 , H05K1/038 , H05K1/141 , H05K1/189 , H05K2201/0278 , H05K2201/0281 , H05K2201/029 , H05K2201/10106 , Y10T442/2475 , Y10T442/30 , Y10T442/3195 , Y10T442/3203 , Y10T442/3211 , Y10T442/3472 , Y10T442/3976
Abstract: A woven article having plural weave layers comprises a plurality of electrically insulating and/or electrically conductive yarn in the warp and a plurality of electrically insulating and/or electrically conductive yarn in the weft interwoven with the yarn in the warp. An electrical function is provided by one or more circuit carriers disposed in cavities in the plural layer woven article and/or one or more functional yarn in the warp and/or the weft, wherein the circuit carrier and/or functional yarn include an electrical contact for connecting to the electrically conductive yarn in the warp and/or weft.
Abstract translation: 具有多个编织层的编织物包括经纱中的多个电绝缘和/或导电纱线以及纬纱中的多个电绝缘和/或导电纱线与经纱中的纱线交织。 电气功能由设置在多层编织物中的空腔中的一个或多个电路载体和/或经纱和/或纬纱中的一个或多个功能性纱线提供，其中电路载体和/或功能性纱线包括电接触 用于连接到经纱和/或纬纱中的导电纱线。
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Patent Agency Ranking
公开(公告)号：US08035037B2
公开(公告)日：2011-10-11
申请号：US12170963
申请日：2008-07-10
Applicant: Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
Inventor： Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
IPC: H05K1/11
CPC classification number: H05K3/4608 , H05K1/056 , H05K3/427 , H05K3/429 , H05K3/4611 , H05K3/4691 , H05K2201/0281 , H05K2201/0323 , H05K2201/09309 , H05K2201/0959 , H05K2201/0969 , H05K2201/09809 , H05K2203/1178 , Y10S428/901 , Y10T29/49155
Abstract: The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated through-hole section is formed; electrically conductive layers coating the inner face of the pilot hole and a surface of the core section; a gas purging hole being formed in the conductive layer coating the surface of the core section; an insulating material filling a space between the inner face of the pilot hole and an outer circumferential face of the plated through-hole section; and cable layers being laminated on both side faces of the core section.
Abstract translation: 芯基板能够可靠地防止导电芯部与电镀通孔部之间的短路。 芯基板包括：具有引导孔的导电芯部分，形成电镀通孔部分; 涂覆导向孔的内表面和芯部表面的导电层; 形成在所述芯部的表面上的导电层中形成的气体净化孔; 绝缘材料，其填充所述导向孔的内表面与所述电镀通孔部的外周面之间的空间; 并且层叠在芯部的两个侧面上的电缆层。
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87.发明申请Low cost housings for vehicle mechanical devices and systems manufactured from conductive loaded resin-based materials 审中-公开汽车机械装置和系统的低成本外壳由导电负载的树脂基材料制成公开(公告)号：US20100326236A1
公开(公告)日：2010-12-30
申请号：US12807447
申请日：2010-09-07
Applicant: Thomas Aisenbrey
Inventor： Thomas Aisenbrey
CPC classification number: F16H57/032 , B29C45/0001 , B29C45/0013 , B29C48/00 , B29C48/06 , B29C48/08 , B29C67/24 , B29K2995/0005 , B29K2995/0013 , B29L2031/3055 , B29L2031/3456 , F16H57/031 , F16H2057/02017 , G06K19/07749 , H01Q1/1271 , H01Q1/36 , H01Q1/38 , H01Q1/40 , H01Q9/0407 , H01Q9/16 , H01Q9/30 , H05K1/095 , H05K3/101 , H05K3/107 , H05K2201/0281 , H05K2201/09118 , H05K2203/0113 , Y10T74/2186 , Y10T74/2188
Abstract: Automotive housings are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
Abstract translation: 汽车外壳由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。
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公开(公告)号：US20100325770A1
公开(公告)日：2010-12-30
申请号：US12531944
申请日：2008-08-14
Applicant: Gi Soo Chung , Dae Hoon Lee , Jae Sang An
Inventor： Gi Soo Chung , Dae Hoon Lee , Jae Sang An
CPC classification number: D03D15/00 , A41D1/00 , D02G3/12 , D02G3/36 , D02G3/441 , D03D1/0088 , D03D3/005 , D03D15/0027 , D03D15/0066 , D10B2101/20 , D10B2401/16 , D10B2501/06 , H05K1/038 , H05K2201/0281 , H05K2201/029 , H05K2201/09809 , H05K2201/10098 , H05K2201/10128 , H05K2201/10151 , Y10S2/901 , Y10S2/902 , Y10T29/49826
Abstract: Disclosed is a digital garment that can provide a high-speed communication path by using a digital band that is quickly and easily attachable to a conventional garment (clothes), and a fabricating method thereof. The digital garment includes: a garment formed of textile; a digital band provided along the outside or inside of the garment so as to provide a communication path; a sensor, attached to the garment, being electrically coupled to the digital band, converting a physical signal into an electrical signal; an operation device, attached to the garment, being electrically coupled to the digital band, receiving the electrical signal from the sensor and processing the signal; and a communication module, attached to the garment, being electrically coupled to the digital band so as to perform wireless communication.
Abstract translation: 公开了一种数字服装，其可以通过使用快速且容易地附接到常规服装（衣服）的数字频带来提供高速通信路径及其制造方法。 数码服装包括：纺织服装; 沿着衣服的外侧或内侧设置的数字带，以提供通信路径; 附接到衣服的传感器电耦合到数字频带，将物理信号转换成电信号; 附接到衣服的操作装置电耦合到数字频带，从传感器接收电信号并处理信号; 以及连接到服装的通信模块，电连接到数字频带，以进行无线通信。
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公开(公告)号：US20100316558A1
公开(公告)日：2010-12-16
申请号：US12814308
申请日：2010-06-11
Applicant: Akio KAWABATA , Shintaro Sato
Inventor： Akio KAWABATA , Shintaro Sato
IPC: D01F9/12
CPC classification number: D01F9/127 , B82Y10/00 , B82Y30/00 , H01L21/76885 , H01L23/373 , H01L23/485 , H01L23/5226 , H01L23/53276 , H01L24/13 , H01L2221/1094 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2924/14 , H05K3/4007 , H05K2201/026 , H05K2201/0281 , H05K2201/0323 , Y10S977/742 , H01L2924/00014 , H01L2924/00
Abstract: An aggregate structure of carbon fibers, organized by a plurality of carbon fibers, includes, an aggregate of the carbon fibers aligned in a lengthwise direction, in which a density of the carbon fibers at one side end is different from a density of the carbon fibers at the other side end.
Abstract translation: 通过多个碳纤维组织的碳纤维的聚集体结构包括沿长度方向排列的碳纤维的聚集体，其中一侧的碳纤维的密度与碳纤维的密度不同 在另一端。
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公开(公告)号：US20100192361A1
公开(公告)日：2010-08-05
申请号：US12798898
申请日：2010-04-13
Applicant: Thomas Aisenbrey
Inventor： Thomas Aisenbrey
IPC: H01M6/00
CPC classification number: H01M2/30 , B29C45/0001 , B29C45/0013 , B29C47/0004 , B29K2995/0005 , B29K2995/0013 , B29L2031/3456 , B29L2031/3468 , B29L2031/36 , G06K19/07749 , H01B3/30 , H01B3/308 , H01B7/02 , H01B13/0036 , H01M2/00 , H01M10/6551 , H01Q1/1271 , H01Q1/38 , H01Q1/40 , H01Q9/0407 , H01Q9/16 , H01Q9/30 , H05K1/095 , H05K3/101 , H05K3/107 , H05K2201/0281 , H05K2201/09118 , H05K2203/0113 , Y10T29/49108
Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.
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