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公开(公告)号：US09883619B2
公开(公告)日：2018-01-30
申请号：US14306540
申请日：2014-06-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Souk-Su Jang , Hyun-Suk Choi
CPC classification number: H05K9/0024 , H05K9/0028 , H05K2201/0707
Abstract: A shielding apparatus is provided. The apparatus includes a printed circuit board including a plurality of catching parts, a shield member configured to cover the printed circuit board, and at least one shield fastening part provided in the shield member and configured to be one of fastened to and separated from the plurality of catching parts by a resilient force while not protruding.
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公开(公告)号：US20170111989A1
公开(公告)日：2017-04-20
申请号：US15077868
申请日：2016-03-22
Applicant: Xiaomi Inc.
Inventor： Dongliang Wang , Shaojie Wang , Shasha Shi
IPC: H05K1/02
CPC classification number: H05K1/0212 , H05K7/20 , H05K7/2039 , H05K7/20418 , H05K7/20427 , H05K7/20436 , H05K7/20518 , H05K9/0024 , H05K9/0052 , H05K9/0081 , H05K2201/066 , H05K2201/0707 , H05K2201/10371
Abstract: Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) which are interconnected with each other, wherein the second shielding case body (2) at least partially covers an outside of the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).
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公开(公告)号：US20170042070A1
公开(公告)日：2017-02-09
申请号：US15299975
申请日：2016-10-21
Applicant: Cinch Connectivity Solutions, Inc.
Inventor： Robert Joseph Baumler , Mark Daniel Dvorak , James Richard Kerekes
IPC: H05K9/00 , H05K1/18 , H01R13/6598 , H01R24/50 , H01R13/03 , H01R13/6594
CPC classification number: H05K9/0064 , H01R13/03 , H01R13/6594 , H01R13/6598 , H01R24/50 , H01R2103/00 , H05K1/18 , H05K9/00 , H05K9/0066 , H05K9/0086 , H05K2201/0707
Abstract: The device includes a body and a plurality of contact portions. The body is substantially planar. The plurality of contact portions are associated with the body so as to form ports. The plurality of contact portions are in electrical communication with the body. The port of each contact portion having an inside diameter substantially equal to ID1. The body and the contact portions are constructed of a conductive metallic material.
Abstract translation: 该装置包括主体和多个接触部分。 身体基本上是平面的。 多个接触部分与主体相关联以形成端口。 多个接触部分与身体电连通。 每个接触部分的端口具有基本上等于ID1的内径。 主体和接触部分由导电金属材料构成。
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公开(公告)号：US20170027058A1
公开(公告)日：2017-01-26
申请号：US14804486
申请日：2015-07-21
Applicant: Apple Inc.
Inventor： Ryan C. Perkins , Trevor J. Ness , Tyler S. Bushnell , Steven P. Cardinali
CPC classification number: H05K1/0218 , H01L23/28 , H01L23/564 , H01L23/60 , H01L31/048 , H01L2224/16225 , H01L2924/181 , H05K1/147 , H05K1/167 , H05K1/185 , H05K3/284 , H05K9/0022 , H05K2201/0133 , H05K2201/0707 , H05K2201/10098 , H05K2201/10151 , H05K2201/10371 , H05K2201/10977 , H05K2203/1316 , H01L2924/00012
Abstract: Electrical components such as integrated circuits and other components may be mounted on a substrate such as a printed circuit substrate. A molded plastic cap may cover the components and a portion of the printed circuit substrate to form a packaged electrical device. Metal structures such as springs, posts, and other metal members may be insert molded within the plastic cap. A metal layer on the surface of the cap may be patterned to from electromagnetic shielding, signal paths, contact pads, sensor electrodes, antennas, and other structures. Multiple substrates each with a respective set of mounted electrical components may be joined using a flexible printed circuit. The flexible printed circuit may be covered with a rigid cap portion or an elastomeric material or may be left uncovered.
Abstract translation: 诸如集成电路和其他部件的电气部件可以安装在诸如印刷电路基板的基板上。 模制塑料帽可以覆盖部件和印刷电路基板的一部分以形成封装的电气装置。 诸如弹簧，柱和其它金属构件的金属结构可以嵌入模塑在塑料盖内。 盖的表面上的金属层可以被图案化为电磁屏蔽，信号路径，接触焊盘，传感器电极，天线和其他结构。 可以使用柔性印刷电路连接各自具有相应的一组安装的电气部件的多个基板。 柔性印刷电路可以用刚性盖部分或弹性体材料覆盖，或者可以不被覆盖。
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公开(公告)号：US20170025731A1
公开(公告)日：2017-01-26
申请号：US15285625
申请日：2016-10-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru KATO , Satoshi ISHINO , Jun SASAKI , Kuniaki YOSUI , Takahiro BABA , Nobuo IKEMOTO
CPC classification number: H01P3/02 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/082 , H01P3/085 , H01P5/00 , H01P5/028 , H05K1/0218 , H05K1/0221 , H05K1/0237 , H05K1/0242 , H05K1/025 , H05K1/028 , H05K1/0296 , H05K1/14 , H05K1/148 , H05K1/186 , H05K3/361 , H05K2201/0707 , H05K2201/09218
Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.
Abstract translation: 扁平电缆的传输线部分包括交替连接的第一区域和第二区域。 在第一区域中，传输线部分是包括具有信号导体的介质元件，包括开口部分的第一接地导体和作为固体填充导体的第二接地导体的柔性三板传输线。 在第二区域中，传输线部分是包括具有曲折导体的宽电介质元件和固体填充导体的第一接地导体和第二接地导体的硬三板传输线。 第二区域中的特性阻抗的变化幅度大于第一区域中的特性阻抗的变化宽度。
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Patent Agency Ranking
公开(公告)号：US20160302302A1
公开(公告)日：2016-10-13
申请号：US15091667
申请日：2016-04-06
Applicant: CANON KABUSHIKI KAISHA
Inventor： Katsuya Yachi
CPC classification number: H05K1/0216 , A61B6/4266 , A61B6/5258 , H05K1/141 , H05K2201/0707 , H05K2201/10151 , H05K2201/10606
Abstract: A radiation imaging apparatus, comprising a sensor panel in which a plurality of sensors configured to detect radiation are arrayed, a first circuit board that is arranged on the sensor panel and includes a circuit configured to read out a signal from each sensor, and a second circuit board that is arranged on the first circuit board and includes a circuit configured to read out a signal from each sensor, and whose radiant noise generation amount at a driving time of the circuit is larger than a radiant noise generation amount at a driving time of the circuit of the first circuit board, wherein the first circuit board is arranged between the sensor panel and the second circuit board.
Abstract translation: 一种辐射成像装置，包括：传感器面板，其中配置有检测辐射的多个传感器;第一电路板，布置在所述传感器面板上，并且包括被配置为从每个传感器读出信号的电路;以及第二 电路板，其布置在第一电路板上，并且包括被配置为从每个传感器读出信号的电路，并且其电路的驱动时间的辐射噪声产生量大于驱动时的辐射噪声产生量 第一电路板的电路，其中第一电路板布置在传感器面板和第二电路板之间。
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87.发明申请公开(公告)号：US20160242282A1
公开(公告)日：2016-08-18
申请号：US15060436
申请日：2016-03-03
Applicant: PPG INDUSTRIES OHIO, INC.
Inventor： Krishna K. Uprety , Khushroo H. Lakdawala , Alexander Bimanand
CPC classification number: H05K1/092 , B32B3/08 , B32B3/14 , B32B3/16 , B32B15/08 , B32B15/082 , B32B15/09 , B32B15/095 , B32B15/20 , B32B17/10 , B32B17/10018 , B32B17/10192 , B32B17/1022 , B32B17/10761 , B32B17/1077 , B32B17/10798 , B32B27/08 , B32B27/28 , B32B27/30 , B32B27/36 , B32B27/365 , B32B27/40 , B32B2307/202 , B32B2307/412 , B32B2369/00 , B32B2375/00 , B32B2605/006 , B32B2605/08 , B32B2605/18 , G02F1/155 , H05B3/84 , H05B2203/002 , H05B2203/013 , H05B2203/017 , H05K1/0274 , H05K1/0296 , H05K1/0353 , H05K2201/0707 , Y10T156/10 , B32B2367/00
Abstract: A transparency including a conductive mesh is disclosed. The conductive mesh is formed by a plurality of inkjet printed electrically conductive lines on a polymer film or a glass, polyacrylate, polycarbonate, or polyurethane substrate, wherein at least one inkjet printed electrically conductive line intersects at least one other inkjet printed electrically conductive line. A flying vehicle including a transparency including a conductive mesh is also disclosed. Additionally, a method of preparing a transparency by laminating a polymer film and a substrate together, wherein a conductive mesh is formed on the polymer film by a plurality of inkjet printed electrically conductive lines, is also disclosed.
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公开(公告)号：US20160174363A1
公开(公告)日：2016-06-16
申请号：US14882294
申请日：2015-10-13
Applicant: Apple Inc.
Inventor： Matthew D. Rohrbach
CPC classification number: H05K5/0204 , B60R11/0252 , B60R2011/0028 , F16M11/041 , F16M11/22 , F16M11/242 , F16M13/00 , F16M13/022 , G06F1/1633 , H01F7/0252 , H04B1/3877 , H04M1/04 , H05K1/0216 , H05K1/0298 , H05K9/002 , H05K2201/0707
Abstract: A magnetic stand for a tablet device is disclosed. The magnetic stand is configured to rigidly hold a portion of the tablet device in place and to shield the magnetic field from adversely affecting nearby devices susceptible to strong magnetic fields. The shielding portion of the magnetic stand allows for significant increases in magnetic field strength when compared to similarly configured, unshielded products.
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公开(公告)号：US20160172260A1
公开(公告)日：2016-06-16
申请号：US14904771
申请日：2014-11-18
Applicant: KYOCERA CORPORATION
Inventor： Noritaka NIINO
IPC: H01L23/053 , H01L23/08 , H05K1/18 , H01L41/053
CPC classification number: H01L23/053 , H01L21/50 , H01L23/057 , H01L23/08 , H01L23/10 , H01L41/053 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195 , H03H9/1014 , H03H9/1071 , H05K1/0218 , H05K1/0224 , H05K1/183 , H05K9/0024 , H05K9/0052 , H05K9/0071 , H05K9/0098 , H05K2201/0707 , H05K2201/09036 , H05K2201/10371 , H01L2924/00014
Abstract: An electronic component housing package and the like capable of reducing time of infrared heating operation are provided. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each containing a first metal oxide as a major constituent. The insulating substrate further includes a first metal layer in frame-like form disposed on an upper surface of an uppermost one of the plurality of insulating layers. The first metal layer contains a second metal oxide which is higher in infrared absorptivity than the first metal oxide.
Abstract translation: 提供能够减少红外线加热操作时间的电子部件外壳封装等。 一种电子部件壳体封装，包括：绝缘基板，包括堆叠在彼此顶部的多个绝缘层，所述绝缘基板的上表面设置有电子部件安装部。 多个绝缘层各自含有第一金属氧化物作为主要成分。 绝缘基板还包括设置在多个绝缘层中的最上面的上表面上的框状的第一金属层。 第一金属层含有与第一金属氧化物相比红外吸收率更高的第二金属氧化物。
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公开(公告)号：US09163775B2
公开(公告)日：2015-10-20
申请号：US14460086
申请日：2014-08-14
Applicant: Apple Inc.
Inventor： Matthew D. Rohrbach
IPC: A47G29/00 , F16M11/04 , B60R11/02 , F16M11/22 , F16M11/24 , F16M13/00 , F16M13/02 , H04B1/3877 , H01F7/02 , G06F1/16 , B60R11/00 , H04M1/04
CPC classification number: H05K5/0204 , B60R11/0252 , B60R2011/0028 , F16M11/041 , F16M11/22 , F16M11/242 , F16M13/00 , F16M13/022 , G06F1/1633 , H01F7/0252 , H04B1/3877 , H04M1/04 , H05K1/0216 , H05K1/0298 , H05K9/002 , H05K2201/0707
Abstract: A magnetic stand for a tablet device is disclosed. The magnetic stand is configured to rigidly hold a portion of the tablet device in place and to shield the magnetic field from adversely affecting nearby devices susceptible to strong magnetic fields. The shielding portion of the magnetic stand allows for significant increases in magnetic field strength when compared to similarly configured, unshielded products.
Abstract translation: 公开了一种用于平板电脑的磁性支架。 磁性支架构造成将片剂装置的一部分刚性地保持在适当的位置并且屏蔽磁场不会对附近易受强磁场影响的装置产生不利影响。 与类似配置的非屏蔽产品相比，磁性支架的屏蔽部分允许磁场强度显着增加。
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