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    Resin molded component fitted with a metal plate and molding method therefor
    82.
    发明授权
    Resin molded component fitted with a metal plate and molding method therefor 有权
    装有金属板的树脂成型部件及其成型方法

    公开(公告)号：US07488904B2

    公开(公告)日：2009-02-10

    申请号：US11820980

    申请日：2007-06-21

    Applicant: Akihito Maegawa ,  Shinyu Nagashima

    Inventor： Akihito Maegawa ,  Shinyu Nagashima

    IPC: H01L23/28

    CPC classification number: H05K3/202 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/0027 ,  H05K1/056 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10651

    Abstract: A sensor unit (1) has a metal plate (10), a resin molded portion (20) and an oil temperature sensor (2). Busbars (4) made of a metal are arranged in the resin molded portion (20). Since the busbars (4) are insert-molded while having the exposed ends (4A) thereof tightly held by a pair of forming dies, a distance between the exposed ends (4A) and the placing surface 10A is held constant. Further, gate marks (5D) of the oil temperature sensor (2) are accommodated in recesses (10B) of the placing surface (10) and engaging grooves (9) and engaging projections (26A) are engaged. Thus, the oil temperature sensor (2) can be held in a proper posture. Additionally, the oil temperature sensor (2) can be held on the placing surface (10A) by riveting the exposed end (4A) and a terminal (8) of the oil temperature sensor (2).

    Abstract translation: 传感器单元（1）具有金属板（10），树脂模制部分（20）和油温传感器（2）。 由树脂成型部（20）配置由金属构成的母线（4）。 由于母线（4）在将其暴露端（4A）紧紧地保持在一对成形模具上时被插入成型，所以露出端（4A）和放置面10A之间的距离保持恒定。 此外，油温传感器（2）的门标（5D）容纳在放置面（10）的凹部（10B）中，并且接合槽（9）和接合突起（26A）接合。 因此，可以将油温传感器（2）保持在适当的姿势。 此外，油温传感器（2）可以通过铆接暴露的端部（4A）和油温传感器（2）的端子（8）而保持在放置表面（10A）上。

    Low cost heating devices manufactured from conductive loaded resin-based materials
    84.
    发明授权
    Low cost heating devices manufactured from conductive loaded resin-based materials 有权
    由导电负载的树脂基材料制造的低成本加热装置

    公开(公告)号：US07372006B2

    公开(公告)日：2008-05-13

    申请号：US10819808

    申请日：2004-04-07

    Applicant: Thomas Aisenbrey

    Inventor： Thomas Aisenbrey

    IPC: H05B3/58

    CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  H05B3/12 ,  H05B3/145 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

    Abstract: Heating devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

    Abstract translation: 加热装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

    Methods for manufacturing lead frame connectors for optical transceiver modules
    85.
    发明授权
    Methods for manufacturing lead frame connectors for optical transceiver modules 有权
    用于制造光收发模块的引线框连接器的方法

    公开(公告)号：US07370414B2

    公开(公告)日：2008-05-13

    申请号：US10810041

    申请日：2004-03-26

    Applicant: Donald A. Ice

    Inventor： Donald A. Ice

    IPC: H01R43/00

    CPC classification number: H05K3/3405 ,  H01R12/7076 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10924 ,  Y10T29/49121 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/4922 ,  Y10T29/49222

    Abstract: Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon. The conductors are bent as necessary and passed in a reel-to-reel manner through an insert injection molding process to form an electrically insulating casing about the conductors. After the molding process, the ribbon is singulated to obtain individual lead frame connectors. The individual conductors encased in the casing can be electrically separated by punching out a connecting conductive structure through a hole formed in the casing. The connecting conductive structure mechanically secures the conductors to each other during the molding process and, when punched out, substantially eliminate stubs that could otherwise degrade the RF performance of the lead frame connectors.

    Abstract translation: 制造用于将光学子组件连接到光收发器模块中的印刷电路板的引线框架连接器的方法。 引线框架连接器通过在导电带中首先冲压导体的选定配置而形成。 导体根据需要弯曲，并通过插入式注射成型工艺以卷到盘的方式通过，以形成围绕导体的电绝缘壳体。 在模制过程之后，将色带切割成单个引线框架连接器。 封装在壳体中的各个导体可以通过形成在壳体中的孔冲出连接的导电结构而被电隔离。 连接导电结构在成型过程中将导体彼此机械地固定，并且当冲压时，基本上消除了否则会降低引线框架连接器的RF性能的短截线。

    Low cost roofing shingles manufactured from conductive loaded resin-based materials
    88.
    发明授权
    Low cost roofing shingles manufactured from conductive loaded resin-based materials 有权
    由导电负载的树脂基材料制成的低成本屋顶瓦

    公开(公告)号：US07198735B2

    公开(公告)日：2007-04-03

    申请号：US11060274

    申请日：2005-02-17

    Applicant: Thomas Aisenbrey

    Inventor： Thomas Aisenbrey

    IPC: H01B1/22 ,  D06N7/04 ,  G21F3/00

    CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/24405

    Abstract: Conductive roofing materials are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

    Abstract translation: 导电屋顶材料由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

    Control circuit device for motor, method for manufacturing the device, and motor having the device
    89.
    发明申请
    Control circuit device for motor, method for manufacturing the device, and motor having the device 失效
    用于电动机的控制电路装置，该装置的制造方法以及具有该装置的电动机

    公开(公告)号：US20070007833A1

    公开(公告)日：2007-01-11

    申请号：US11455927

    申请日：2006-06-20

    Applicant: Takayuki Kitagawa

    Inventor： Takayuki Kitagawa

    IPC: H02K3/24 ,  H02K11/00 ,  H02K5/18

    CPC classification number: H05K3/326 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03 ,  H05K3/202 ,  H05K3/306 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/1059 ,  Y10S310/03

    Abstract: A control circuit device for a motor is provided with a circuit board which has an electrically-conductive terminal for electrically connecting the motor with an exterior connector, a heat radiating unit which is connected with the circuit board to radiate heat generated by the circuit board. The heat radiating unit has a convex member at a surface thereof of the side where the electrically conductive terminal is arranged. The electrically conductive terminal is integrally formed with a concave member for being engaged with the convex member. The convex member is engaged with the concave member. Thus, a heat sink can be readily mounted without increasing the cost.

    Abstract translation: 一种用于电动机的控制电路装置设置有电路板，该电路板具有用于将电动机与外部连接器电连接的导电端子，与电路板连接以辐射由电路板产生的热量的散热单元。 散热单元在布置导电端子的一侧的表面具有凸形构件。 导电端子与凹形构件整体形成，用于与凸形构件接合。 凸形构件与凹形构件接合。 因此，可以容易地安装散热器而不增加成本。

    Method of manufacturing an electronic device
    90.
    发明授权
    Method of manufacturing an electronic device 失效
    制造电子装置的方法

    公开(公告)号：US07160476B2

    公开(公告)日：2007-01-09

    申请号：US10510590

    申请日：2003-04-10

    Applicant: Johannus Wilhelmus Weekamp

    Inventor： Johannus Wilhelmus Weekamp

    IPC: H01B13/00

    CPC classification number: B81C1/00333 ,  H01L23/10 ,  H01L23/3107 ,  H01L23/4985 ,  H01L23/5389 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/1057 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/183 ,  H05K3/20 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2203/302 ,  H01L2924/00

    Abstract: The electronic device (100) comprises an electrical element (30), for instance a MEMS capacitor or a BAW filter in a cavity (37) that is protected from the environment by a cover (38). The cover (38) is a patterned layer which is mechanically embedded in isolating material (7) present beside the cavity (37) and may further include contact pads (41). The device (100) may be suitably manufactured from an accurately folded foil including a patterned layer and a sacrifice layer. After applying the foil to the cavity (37) the isolating material (7) is provided and the sacrifice layer is removed. The patterned layer, or part thereof, stays behind and forms the cover (38).

    Abstract translation: 电子设备（100）包括电气元件（30），例如空腔（37）中的MEMS电容器或BAW滤波器，其通过盖（38）保护免受环境影响。 盖（38）是图案化层，其被机械地嵌入存在于空腔（37）旁边的隔离材料（7）中，并且还可以包括接触垫（41）。 装置（100）可以由包括图案化层和牺牲层的精确折叠的箔适当地制造。 在将箔施加到空腔（37）之后，提供隔离材料（7）并去除牺牲层。 图案层或其一部分保持在后面并形成盖（38）。

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