公开(公告)号：US07796392B2

公开(公告)日：2010-09-14

申请号：US12072757

申请日：2008-02-27

Applicant: Ralph Peter Bertram ,  Harald Stoyan

Inventor： Ralph Peter Bertram ,  Harald Stoyan

IPC: H05K7/20

CPC classification number: H05K3/0061 ,  H05K1/0204 ,  H05K3/4046 ,  H05K2201/0382 ,  H05K2201/09554 ,  H05K2201/10598

Abstract: An electronic device having an electrical circuit carrier and a body is specified, in which at least one riveted connection is formed between the electrical circuit carrier and the body. In the case of such a device, the electrical circuit carrier can be mechanically incorporated in a stable manner and with little technical complexity. An electrical circuit carrier having at least one rivet is also specified.

Abstract translation: 规定了具有电路载体和主体的电子装置，其中在电路载体和主体之间形成至少一个铆接连接。 在这种装置的情况下，可以以稳定的方式机械地并入电路载体，而且技术复杂性很小。 还规定了具有至少一个铆钉的电路载体。

公开(公告)号：US20100044094A1

公开(公告)日：2010-02-25

申请号：US12518398

申请日：2008-01-16

Applicant: Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

Inventor： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K3/44 ,  H01B1/22 ,  H05K1/056 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/09554 ,  H05K2203/0315 ,  H05K2203/105 ,  H05K2203/1136 ,  Y10T29/49128 ,  Y10T29/49165

Abstract: The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.

Abstract translation: 印刷电路板1包括金属基板2，设置在金属基板2的表面上的绝缘层3和形成在绝缘层3的表面上的导电层4.导电层4电连接到金属 基板2.在绝缘层3和导电层4中形成有底的通孔或通孔6.通孔在金属基板2中具有底部，并且在绝缘层3中具有壁表面 通孔6延伸穿过绝缘层3，导电层4和金属基底2.导电浆料7填充有底的通孔或通孔6，以将金属基底2和导电层 4与彼此。 对印刷布线板1进行电流施加到金属基板2和导电浆料7之间的界面的处理。

公开(公告)号：US20090310260A1

公开(公告)日：2009-12-17

申请号：US12307298

申请日：2006-07-14

Applicant: Hiroaki Miyazawa ,  Terutoshi Momose ,  Yoichi Hitomi ,  Tsuyoshi Yamazaki

Inventor： Hiroaki Miyazawa ,  Terutoshi Momose ,  Yoichi Hitomi ,  Tsuyoshi Yamazaki

IPC: G11B21/16 ,  C23F1/00 ,  C25D5/34

CPC classification number: H05K1/0219 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/0215 ,  H05K1/056 ,  H05K3/421 ,  H05K3/44 ,  H05K2201/09509 ,  H05K2201/09554

Abstract: A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other. Thereby, the desired portions of the suspension can be grounded through this simple structure without adopting a complicated structure wherein additional special lines for grounding are not separately laid besides the lines, which are lines for connecting a magnetic head and a control circuit board to each other.

Abstract translation: 具有作为基板的薄金属板的磁头悬架，除了作为弹簧的功能之外还具有新的功能。 用于将磁头和控制电路板彼此连接的多个磁头悬挂在通过绝缘层具有弹性的薄金属板上形成，并且与金属板一体形成由其制成的金属垫 作为多条线的金属层独立于线形成，在金属垫的一部分上形成开口以穿透绝缘层，然后到达薄金属板，并且通过金属电镀形成导电区域到开口中 从而将金属垫和薄金属板彼此电连接。 因此，通过这种简单的结构，悬架的期望部分可以通过这种简单的结构接地，而不采用复杂的结构，其中除了用于将磁头和控制电路板彼此连接的线之外的线之外，不需要分开布置附加的接地专用线 。

公开(公告)号：US20090255717A1

公开(公告)日：2009-10-15

申请号：US12385626

申请日：2009-04-14

Applicant: Aya Mizushima ,  Toshiki Naito

Inventor： Aya Mizushima ,  Toshiki Naito

IPC: H05K1/03 ,  C25D5/02

CPC classification number: H05K3/44 ,  H01L2924/0002 ,  H05K1/056 ,  H05K3/108 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09718 ,  H01L2924/00

Abstract: A suspension board with circuit includes an insulating layer formed with a first opening, a conductive layer formed on the insulating layer so as to fill the first opening, a metal thin film formed so as to cover a surface of the conductive layer exposed from the first opening, and be interposed between the conductive layer and the insulating layer, and a metal supporting layer formed with a second opening surrounding the first opening so as to underlie the insulating layer. The metal supporting layer includes a covering portion provided in the second opening so as to cover the first opening.

Abstract translation: 具有电路的悬挂板包括形成有第一开口的绝缘层，形成在绝缘层上以便填充第一开口的导电层，形成为覆盖从第一开口露出的导电层的表面的金属薄膜 开口并插入在导电层和绝缘层之间，金属支撑层形成有围绕第一开口的第二开口，以便在绝缘层的下面。 金属支撑层包括设置在第二开口中以覆盖第一开口的覆盖部分。

公开(公告)号：US07571540B2

公开(公告)日：2009-08-11

申请号：US11505995

申请日：2006-08-18

Applicant: Hidenori Aonuma ,  Yasuhito Ohwaki

Inventor： Hidenori Aonuma ,  Yasuhito Ohwaki

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H05K3/44 ,  H05K1/056 ,  H05K3/108 ,  H05K3/243 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/0969 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion to electrically connect the ground connecting portion and the metal supporting board.

Abstract translation: 一种制造具有电路的悬挂板的方法，其中在金属支撑板上形成绝缘基底层之后，在绝缘基底层上形成包括接地布线图案和信号布线图案的导电图案。 然后，在绝缘基底层上形成覆盖导电图案的绝缘覆盖层，使得在绝缘覆盖层中形成第一盖开口部和第二盖开口部。 然后，在从第一盖开口部露出的接地端子的表面和从第二盖开口部露出的接地连接部的表面上形成电解镀层，从地线供电。 此后，在基座开口部分形成金属填充层，以电连接接地连接部分和金属支撑板。

公开(公告)号：US20090183907A1

公开(公告)日：2009-07-23

申请号：US12382266

申请日：2009-03-12

Applicant: Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

Inventor： Jun Ishii ,  Yasunari Ooyabu ,  Visit Thaveeprungsriporn

IPC: H05K1/16

CPC classification number: H05K1/0259 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K2201/09554 ,  Y10T428/1328 ,  Y10T428/1393 ,  Y10T428/256 ,  Y10T428/257

Abstract: A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.

Abstract translation: 布线电路板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上并具有间隔布置的一对电线的导电图案，以及形成在绝缘层上的半导体层 并且电连接到金属支撑板和导电图案。 导电图案具有第一区域，其中一对导线之间的距离小，并且一对导线之间的距离大于第一区域中的距离的第二区域。 半导体层设置在第二区域中。

公开(公告)号：US07539022B2

公开(公告)日：2009-05-26

申请号：US11163058

申请日：2005-10-04

Applicant: Shih-Ping Hsu

Inventor： Shih-Ping Hsu

IPC: H05K1/18

CPC classification number: H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/162 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/09554 ,  H05K2201/09745 ,  H01L2224/16225 ,  H01L2924/00

Abstract: A chip embedded packaging structure includes a first metal board, a second metal board having at least a through cavity, in which the second metal board is disposed on the upper surface of the first metal board to form a heat dissipating substrate, at least a semiconductor chip and a capacitor chip embedded in the first metal board and embraced in the through cavity of the second metal board, a passive component layer disposed on part of the upper surface of the second metal board, and at least a build-up circuit layer covering the semiconductor chip, the capacitor chip, and the passive component layer and electrically connecting them through a plurality of conductive vias.

Abstract translation: 芯片嵌入式封装结构包括第一金属板，具有至少一个通孔的第二金属板，其中第二金属板设置在第一金属板的上表面上以形成散热基板，至少半导体 芯片和嵌入在第一金属板中并且包围在第二金属板的通孔中的电容器芯片，设置在第二金属板的上表面的一部分上的无源元件层，以及至少覆盖 半导体芯片，电容器芯片和无源元件层，并通过多个导电通孔将它们电连接。

公开(公告)号：US07425762B2

公开(公告)日：2008-09-16

申请号：US11607910

申请日：2006-12-04

Applicant: Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

Inventor： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC: H01L23/34

CPC classification number: H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

Abstract translation: 本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子 电子部件连接。 在电子设备中，具有高导热性的部件被布置成与金属板和电子部件都接触。 因此，电子设备的散热性提高。

公开(公告)号：US20080217050A1

公开(公告)日：2008-09-11

申请号：US11873435

申请日：2007-10-17

Applicant: Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

Inventor： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

IPC: H01R12/04 ,  B29C65/48

CPC classification number: H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1092

Abstract: A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.

Abstract translation: 多层互连结构和形成方法。 在第一实施例中，第一和第二液晶聚合物（LCP）电介质层分别直接接合到导热层的第一和第二相对表面，没有外在粘合材料将导热层与第一或第二液晶聚合物 LCP电介质层。 在第二实施例中，第一和第二2S1P子结构分别直接接合到LCP电介质接合层的第一和第二相对表面，没有外部粘合材料将LCP电介质接合层与第一或第二2S1P子结构结合。

公开(公告)号：US20080212284A1

公开(公告)日：2008-09-04

申请号：US12072757

申请日：2008-02-27

Applicant: Ralph Peter Bertram ,  Harald Stoyan

Inventor： Ralph Peter Bertram ,  Harald Stoyan

IPC: H05K7/02 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K3/0061 ,  H05K1/0204 ,  H05K3/4046 ,  H05K2201/0382 ,  H05K2201/09554 ,  H05K2201/10598

Abstract: An electronic device having an electrical circuit carrier and a body is specified, in which at least one riveted connection is formed between the electrical circuit carrier and the body. In the case of such a device, the electrical circuit carrier can be mechanically incorporated in a stable manner and with little technical complexity. An electrical circuit carrier having at least one rivet is also specified.

Abstract translation: 规定具有电路载体和主体的电子装置，其中在电路载体和主体之间形成至少一个铆接连接。 在这种装置的情况下，可以以稳定的方式机械地并入电路载体，而且技术复杂性很小。 还规定了具有至少一个铆钉的电路载体。