Overmolded electronic assembly and overmoldable interface component
    81.
    发明申请
    Overmolded electronic assembly and overmoldable interface component 失效
    包覆成型的电子组件和包覆模制接口部件

    公开(公告)号:US20060141828A1

    公开(公告)日:2006-06-29

    申请号:US11021429

    申请日:2004-12-23

    Abstract: An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.

    Abstract translation: 包覆成型的电子组件(900,1000,1200)由一个或多个包覆模制的接口部件(300,400,500,420,1750)制成,所述接口部件可以是具有诸如扬声器或传感器之类的物理接口的电触点或电子部件。 包覆模制的界面部件具有牺牲端,在电子组件中包覆成型之后,其余的可包覆模制的界面部件被切掉,从而为包覆模制的电子组件提供了一个密封腔。

    Battery with printed circuit
    82.
    发明申请
    Battery with printed circuit 审中-公开
    带印刷电路的电池

    公开(公告)号:US20060127752A1

    公开(公告)日:2006-06-15

    申请号:US11008870

    申请日:2004-12-09

    Abstract: An apparatus (10) includes a battery (12) that has a positive terminal (50) and a negative terminal (52). At least one layer of electrical insulating material (60) is disposed on one of the positive terminal (50) and the negative terminal (52). At least one electrically conductive circuit layer (62) is disposed on the at least one layer of electrical insulating material (60).

    Abstract translation: 装置(10)包括具有正端子(50)和负端子(52)的电池(12)。 至少一层电绝缘材料(60)设置在正极端子(50)和负极端子(52)中的一个上。 在至少一层电绝缘材料(60)上设置至少一个导电电路层(62)。

    System and method for thermal management in a device
    83.
    发明申请
    System and method for thermal management in a device 审中-公开
    设备中热管理的系统和方法

    公开(公告)号:US20060118539A1

    公开(公告)日:2006-06-08

    申请号:US11002499

    申请日:2004-12-02

    Abstract: A system and method for reducing the size of a communication device in which a temperature-sensitive, non-heat generating component (302) is placed in close proximity to a heat generating component (304). The temperature of the non-heat generating component (302) is sensed to provide a sensed temperature. The operation of the heat generating component (304) is altered to avoid an over temperature condition of the non-heat generating component (302) based upon the sensed temperature.

    Abstract translation: 一种用于减小通信设备的尺寸的系统和方法,其中将温度敏感的非发热组件(302)放置在靠近发热组件(304)处。 感测非发热组件(302)的温度以提供感测的温度。 改变发热组件(304)的操作以避免基于感测温度的非发热组件(302)的过热状态。

    Battery powerable apparatus, radio frequency communication device, and electric circuit
    87.
    发明授权
    Battery powerable apparatus, radio frequency communication device, and electric circuit 失效
    电池供电装置,射频通信装置和电路

    公开(公告)号:US06885089B2

    公开(公告)日:2005-04-26

    申请号:US09989960

    申请日:2001-11-21

    Applicant: Rickie C. Lake

    Inventor: Rickie C. Lake

    Abstract: A curable adhesive composition, comprising an epoxy terminated silane is provided. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided. The adhesive composition is interposed between the battery and the substrate, and cured into an electrically conductive bond between the battery and the substrate. In another aspect, a curable epoxy composition is interposed between first and second electrically conductive components. The epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said electrical components of less than or equal to about 0.3 ohm-cm2. In another aspect, a battery powerable apparatus, i.e. an Rf communication device, includes a conductive adhesive mass comprising an epoxy terminated silane. Also, the invention includes an electric circuit comprising first and second electric components electrically connected with one another through a conductive adhesive mass.

    Abstract translation: 提供了包含环氧封端硅烷的可固化粘合剂组合物。 还提供了薄型电池和薄型电池要导电连接的基板。 粘合剂组合物插入在电池和基板之间,并且固化成电池和基板之间的导电接合。 另一方面,可固化的环氧组合物介于第一和第二导电组分之间。 环氧树脂具有有效的金属表面润湿浓度的硅烷以形成具有小于或等于约0.3欧姆 - 厘米2的电阻的固化电互连。 另一方面,一种电池供电装置,即Rf通信装置,包括一种包含环氧封端硅烷的导电粘合剂组合物。 此外,本发明还包括电路,该电路包括通过导电粘合剂块彼此电连接的第一和第二电气部件。

    Built-in circuitry and method to test connector loading
    88.
    发明申请
    Built-in circuitry and method to test connector loading 失效
    内置电路和测试连接器负载的方法

    公开(公告)号:US20040227637A1

    公开(公告)日:2004-11-18

    申请号:US10439553

    申请日:2003-05-16

    Abstract: One embodiment disclosed relates to a printed circuit board (PCB) with built-in circuitry to test connector loading. The PCB includes at least the connector to be tested, an indicator circuit, and a switch. The connector is configured to interconnect to a card. The switch couples the connector to the indicator circuit, and integrity of the interconnection between the card and the connector is indicated by the indicator circuit.

    Abstract translation: 公开的一个实施例涉及具有内置电路以测试连接器负载的印刷电路板(PCB)。 PCB至少包括要测试的连接器,指示器电路和开关。 连接器被配置为与卡互连。 开关将连接器连接到指示器电路,并且指示器电路指示卡和连接器之间的互连的完整性。

    Method of manufacturing and testing an electronic device, and an electronic device
    89.
    发明授权
    Method of manufacturing and testing an electronic device, and an electronic device 有权
    电子设备的制造和测试方法以及电子设备

    公开(公告)号:US06359561B2

    公开(公告)日:2002-03-19

    申请号:US09767593

    申请日:2001-01-22

    Abstract: A method of manufacturing and testing an electronic circuit, the method comprising forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces; attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces; supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and employing a jumper to electrically close the gap, and complete the circuit, after verifying electrical connections. An electronic circuit comprising a substrate; a plurality of conductive traces on the substrate, with a gap in one of the conductive traces; a circuit component attached to the substrate and coupled to at least one of the conductive traces; a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; and a jumper electrically closing the gap and completing the circuit, the jumper comprising conductive epoxy.

    Abstract translation: 一种制造和测试电子电路的方法,所述方法包括在衬底上形成多个导电迹线,并在所述导电迹线之一中提供间隙; 将电路部件附接到所述基板并将所述电路部件耦合到所述导电迹线中的至少一个; 将电池支撑在衬底上,并将电池耦合到至少一个导电迹线,其中将定义完整的电路,包括迹线,电路组件和电池,但是用于间隙; 通过执行电路测试来验证电连接,在电路部件被安装并且电池被支撑之后; 并使用跳线电气闭合间隙,并在验证电气连接后完成电路。 一种包括基板的电子电路; 在衬底上的多个导电迹线,其中一个导电迹线具有间隙; 电路部件,其连接到所述基板并且耦​​合到所述导电迹线中的至少一个; 支撑在基板上并耦合到至少一个导电迹线的电池,其中将定义完整的电路,包括迹线,电路部件和电池,但是用于间隙; 并且跳线电闭合间隙并完成电路,跳线包括导电环氧树脂。

    Method of manufacturing an integrated circuit
    90.
    发明授权
    Method of manufacturing an integrated circuit 有权
    集成电路的制造方法

    公开(公告)号:US06295727B1

    公开(公告)日:2001-10-02

    申请号:US09227373

    申请日:1999-01-08

    Abstract: A device and method for manufacturing an integrated real time clock integrated circuit (RTC IC) package is disclosed, in which the RTC IC and its related components are integrated into a single package. Therefore, the layout area required by the integrated RTC IC package is significantly reduced. Also, only a single manual assembling process is required. Furthermore, various examination steps are built into every process to manufacture the integrated RTC IC package to make sure the completed products are in normal condition. No extra examination and fix-up processes are required for the completed products so that manufacturing cost can be significantly reduced.

    Abstract translation: 公开了用于制造集成实时时钟集成电路(RTC IC)封装的器件和方法,其中将RTC IC及其相关部件集成到单个封装中。 因此,集成RTC IC封装所需的布局面积大大减少。 此外,只需要一个手动组装过程。 此外,在制造集成的RTC IC封装的每个过程中都内置了各种检测步骤,以确保完成的产品处于正常状态。 完成的产品不需要额外的检查和修理流程,从而可以显着降低制造成本。

Patent Agency Ranking