Abstract:
An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.
Abstract:
An apparatus (10) includes a battery (12) that has a positive terminal (50) and a negative terminal (52). At least one layer of electrical insulating material (60) is disposed on one of the positive terminal (50) and the negative terminal (52). At least one electrically conductive circuit layer (62) is disposed on the at least one layer of electrical insulating material (60).
Abstract:
A system and method for reducing the size of a communication device in which a temperature-sensitive, non-heat generating component (302) is placed in close proximity to a heat generating component (304). The temperature of the non-heat generating component (302) is sensed to provide a sensed temperature. The operation of the heat generating component (304) is altered to avoid an over temperature condition of the non-heat generating component (302) based upon the sensed temperature.
Abstract:
One or more thin film battery cells are embedded in a multilayer thin film flexible circuit board supporting electronic devices, such as power regulators, for forming an integrated battery and circuit module. The module can be made using conventional thin film processes. The module is well suited for applications where size and space limitations, such as on spacecraft or credit cards, require the use of ultra thin power sources integrated with respective electronic devices and printed circuits.
Abstract:
A method and apparatus of forming a battery enabled flexible circuit. The invention includes forming a first insulating layer and positioning a battery on the first insulating layer, the battery having at least a first and a second terminal. A second insulating layer is then formed on the first insulating layer and the battery. The second insulating layer has vias that are in electrical contact with at least one of the first and the second terminals.
Abstract:
A wireless transceiver for a keyless entry system of an automotive vehicle includes: a circuit board having a circuit part disposed thereon; and a resin mold for molding the circuit board. The resin mold molds both of the circuit board and the circuit part, and the resin mold has a card shape. The resin mold has no connection portion of a casing so that the transceiver has high water resistance and high impact resistance.
Abstract:
A curable adhesive composition, comprising an epoxy terminated silane is provided. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided. The adhesive composition is interposed between the battery and the substrate, and cured into an electrically conductive bond between the battery and the substrate. In another aspect, a curable epoxy composition is interposed between first and second electrically conductive components. The epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said electrical components of less than or equal to about 0.3 ohm-cm2. In another aspect, a battery powerable apparatus, i.e. an Rf communication device, includes a conductive adhesive mass comprising an epoxy terminated silane. Also, the invention includes an electric circuit comprising first and second electric components electrically connected with one another through a conductive adhesive mass.
Abstract:
One embodiment disclosed relates to a printed circuit board (PCB) with built-in circuitry to test connector loading. The PCB includes at least the connector to be tested, an indicator circuit, and a switch. The connector is configured to interconnect to a card. The switch couples the connector to the indicator circuit, and integrity of the interconnection between the card and the connector is indicated by the indicator circuit.
Abstract:
A method of manufacturing and testing an electronic circuit, the method comprising forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces; attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces; supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and employing a jumper to electrically close the gap, and complete the circuit, after verifying electrical connections. An electronic circuit comprising a substrate; a plurality of conductive traces on the substrate, with a gap in one of the conductive traces; a circuit component attached to the substrate and coupled to at least one of the conductive traces; a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; and a jumper electrically closing the gap and completing the circuit, the jumper comprising conductive epoxy.
Abstract:
A device and method for manufacturing an integrated real time clock integrated circuit (RTC IC) package is disclosed, in which the RTC IC and its related components are integrated into a single package. Therefore, the layout area required by the integrated RTC IC package is significantly reduced. Also, only a single manual assembling process is required. Furthermore, various examination steps are built into every process to manufacture the integrated RTC IC package to make sure the completed products are in normal condition. No extra examination and fix-up processes are required for the completed products so that manufacturing cost can be significantly reduced.