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    Circuit assemblies including thermoelectric modules
    82.
    发明授权
    Circuit assemblies including thermoelectric modules 有权
    电路组件包括热电模块

    公开(公告)号：US08649179B2

    公开(公告)日：2014-02-11

    申请号：US13021735

    申请日：2011-02-05

    Applicant: Jeffrey Gerard Hershberger ,  Richard F. Hill ,  Robert Michael Smythe ,  Michael G. Sutsko

    Inventor： Jeffrey Gerard Hershberger ,  Richard F. Hill ,  Robert Michael Smythe ,  Michael G. Sutsko

    IPC: H05K7/20

    CPC classification number: F25B21/02 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/205 ,  H05K2201/10219 ,  Y10T29/4913 ,  H01L2924/00014

    Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.

    Abstract translation: 电路组件通常包括电路板和至少一个电气路径，其被配置为将热电模块耦合到电路板以用作电路组件中的热泵。 当热电模块经由至少一个电路径耦合到电路板时，电路板和至少一个电路径形成热电模块的一部分。 包括构成热电模块的一部分的电路板的部分的热电模块限定了小于电路板的覆盖区的覆盖区。 因此，电路板能够在由热电模块限定的覆盖区以外的位置支撑电路板上的电气部件。

    Flexible circuit for establishing electrical connectivity with optical subassembly
    83.
    发明授权
    Flexible circuit for establishing electrical connectivity with optical subassembly 有权
    用于与光学组件建立电连接的柔性电路

    公开(公告)号：US07439449B1

    公开(公告)日：2008-10-21

    申请号：US10409837

    申请日：2003-04-09

    Applicant: Dev E. Kumar ,  Giorgio Giaretta ,  Stefano Schiaffino ,  Donald A. Ice

    Inventor： Dev E. Kumar ,  Giorgio Giaretta ,  Stefano Schiaffino ,  Donald A. Ice

    IPC: H05K1/00

    CPC classification number: H05K1/0253 ,  G02B6/4292 ,  H01L23/055 ,  H01L23/10 ,  H01L2924/0002 ,  H01S5/02212 ,  H01S5/02415 ,  H05K1/0203 ,  H05K1/0219 ,  H05K1/0393 ,  H05K1/141 ,  H05K1/147 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10446 ,  H01L2924/00

    Abstract: Flexible printed circuit boards interconnect to adjacent electronic devices through one or more of high speed data, low speed data, high current, and ground lines and pads. The design of the high speed data pads and traces and adjacent ground pads and traces maintains a desired impedance in the flexible circuit and at the transition from the flexible circuit to a printed circuit board, a ceramic header, or other device to ensure high speed operation. The pads are preferably arranged in a two dimensional geometry such that a connecting area of the flexible circuit is narrower than it would preferably be if the pads were arranged linearly. The two dimensional array also allows the use of the high current thermoelectric cooler pads, which require large surface areas that may otherwise not fit in a conventional linear array.

    Abstract translation: 柔性印刷电路板通过高速数据，低速数据，高电流和接地线和焊盘中的一个或多个互连到相邻电子器件。 高速数据焊盘和迹线以及相邻接地焊盘和迹线的设计在柔性电路中保持所需的阻抗，并且在柔性电路到印刷电路板，陶瓷集管或其他器件的过渡期间保持高速运行 。 垫优选地布置成二维几何形状，使得柔性电路的连接区域比优选地如果衬垫线性排列的那样较窄。 二维阵列还允许使用大电流热电冷却器垫，其需要大的表面积，否则其不适合常规线性阵列。

    DIRECT TYPE BACKLIGHT MODULE
    85.
    发明申请
    DIRECT TYPE BACKLIGHT MODULE 审中-公开
    直接型背光模组

    公开(公告)号：US20060198161A1

    公开(公告)日：2006-09-07

    申请号：US11162362

    申请日：2005-09-08

    Applicant: Jhy-Chain Lin

    Inventor： Jhy-Chain Lin

    IPC: F21V7/04

    CPC classification number: H05K1/0203 ,  F21K9/00 ,  G02F2001/133628 ,  H05K7/20972 ,  H05K7/2099 ,  H05K2201/10219

    Abstract: A direct type backlight module (100) includes a substrate (110) and a number of light sources (120) and a plurality of thermal electric coolers (160). The substrate has a first surface (111) and a second surface (112), and the light sources are formed on the first surface of the substrate, the TE coolers are arranged on the second surface of the substrate. Each TE cooler has a cold portion (161) and a hot portion (162), the cold portion contacts with the second surface of the substrate. The hot portion connects with at least one heat pipe (170). The heat pipe includes a evaporation portion and a condensation portion, the evaporation portion contacts with the hot portion. The condensation portion contacts with a heat sink (180). A fan (190) is arranged at one side of the heat sink, and an opposite side of the heat sink defines a plurality of vents (195). The direct type backlight module has improved heat dissipation performance.

    Abstract translation: 直接型背光模块（100）包括基板（110）和多个光源（120）和多个热电冷却器（160）。 衬底具有第一表面（111）和第二表面（112），并且光源形成在衬底的第一表面上，TE冷却器被布置在衬底的第二表面上。 每个TE冷却器具有冷部分（161）和热部分（162），冷部分与基板的第二表面接触。 热部分与至少一个热管（170）连接。 热管包括蒸发部和冷凝部，蒸发部与热部接触。 冷凝部分与散热器（180）接触。 风扇（190）布置在散热器的一侧，并且散热器的相对侧限定多个通风口（195）。 直接型背光模块具有改善的散热性能。

    OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL METHOD
    88.
    发明公开
    OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL METHOD 审中-公开

    公开(公告)号：US20240231023A9

    公开(公告)日：2024-07-11

    申请号：US18493097

    申请日：2023-10-24

    Applicant: Formerica Optoelectronics, Inc.

    Inventor： Yun-Cheng HUANG ,  Yi-Nan SHIH ,  Chih-Chung LIN ,  Yun-Chin TSAI

    IPC: G02B6/42 ,  H05K1/02

    CPC classification number: G02B6/4271 ,  G02B6/4246 ,  G02B6/428 ,  H05K1/0203 ,  H05K2201/10151 ,  H05K2201/10219

    Abstract: An optical transceiver module temperature control device includes a processor, a printed circuit board assembly, an optical transceiver module and a temperature adjustment element. The processor is configured to measure an ambient temperature. The printed circuit board assembly includes a first side and a second side. The first side is opposite to the second side. The optical transceiver module is disposed on the first side of the printed circuit board assembly. The temperature adjustment element is coupled to the processor and disposed on the second side of the printed circuit board assembly. The processor is configured to generate a temperature adjustment signal according to the ambient temperature and an operating temperature range. The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range.

    Thermal management system with phase change and auxiliary cooling systems
    89.
    发明授权
    Thermal management system with phase change and auxiliary cooling systems 有权

    公开(公告)号：US11889664B2

    公开(公告)日：2024-01-30

    申请号：US17356888

    申请日：2021-06-24

    Applicant: Baidu USA LLC

    Inventor： Tianyi Gao

    IPC: H05K7/20

    CPC classification number: H05K7/20836 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20827 ,  H05K2201/10151 ,  H05K2201/10219

    Abstract: A thermal management system includes a cooling unit, a condenser, and a processor. The processor is located within a server, and the system also includes a phase change cooling device in thermal communication with the processor, and in fluid communication with the condenser. The system also includes a single phase cooling device in thermal communication with the phase change cooling device, and in fluid communication with the liquid cooling unit. The system also includes a temperature sensor in thermal communication with the single phase cooling device, and a fluid pump to move fluid between the liquid cooling unit and the single phase cooling device. A TEC device may also be implemented between the phase change cooling device and the single phase cooling device.

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