公开(公告)号：US11728240B2

公开(公告)日：2023-08-15

申请号：US17392301

申请日：2021-08-03

Applicant: Vitesco Technologies GmbH

Inventor： Jens Reiter ,  Rico Hartmann ,  Christian Lammel

IPC: H01L23/40 ,  H05K1/18 ,  H01L25/11

CPC classification number: H01L23/4006 ,  H05K1/18 ,  H01L25/115 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H05K2201/09063 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10757

Abstract: A circuit carrier arrangement includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

公开(公告)号：US20230207899A1

公开(公告)日：2023-06-29

申请号：US18146116

申请日：2022-12-23

Applicant: Black & Decker Inc.

Inventor： Moriah Counts ,  Vy Ho ,  Alexander R. Barton ,  Nathan J. Cruise

IPC: H01M10/42 ,  H05K1/18 ,  H05K3/34 ,  H01M50/213

CPC classification number: H01M10/425 ,  H05K1/184 ,  H05K3/3447 ,  H01M50/213 ,  H01M2010/4271 ,  H01M2220/30 ,  H05K2201/10037 ,  H05K2201/10757 ,  H01M50/271

Abstract: A battery pack comprises a set of battery cells, a battery cell holder holding the battery cells, at least one battery strap having a first end connected to a terminal of one of the battery cells and a second end extending from the battery cell holder, a printed circuit board having a first side and a second side, components mounted on the second side of the printed circuit board, a trace on the second side of the printed circuit board extending from one components to a contact connected to the trace and mated with the second end of the at least one battery strap. Multiple vias extend from the first side to the second side, and the contact comprises a first portion having a through hole and a leg integrally formed with and approximately perpendicular to the first portion, the leg extending from the first side of the PCB to the second side of the PCB through a first via, the trace extending from the first via, the leg soldered to the second side of the PCB and the via and the through hole aligned with a second via adjacent to the first via, the through hole sized and configured to receive a PCB end of the strap, the PCB end of the strap soldered to the contact.

公开(公告)号：US20190221952A1

公开(公告)日：2019-07-18

申请号：US16329749

申请日：2017-08-09

Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.

Inventor： Katsumasa HAGIWARA

IPC: H01R12/57 ,  H01L23/50 ,  H01L23/495 ,  H01R43/20 ,  H01R12/52 ,  H05K1/14

CPC classification number: H01R12/57 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/50 ,  H01R12/52 ,  H01R43/20 ,  H05K1/14 ,  H05K2201/10757

Abstract: A unit connection terminal (26) is formed of an adhesion section (29) to be soldered onto a circuit board (21) and extending in a longitudinal direction, a terminal section (30) extending in the direction approximately orthogonal to the adhesion section extending in the longitudinal direction and to be connected to a counterpart-side circuit board, a bent section (31) bent so as to connect the adhesion section and the terminal section, and of a suction member (28) made of synthetic resin, fixed more to the terminal side than the bent section (31), and having a suction surface. More preferably, a projection position where the gravity center position of the entire unit connection terminal is projected toward the adhesion section side is included in the adhesion range of the adhesion section.

公开(公告)号：US20180247768A1

公开(公告)日：2018-08-30

申请号：US15553430

申请日：2015-12-21

Applicant: Epcos AG

Inventor： Markus Koini ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Georg Kügerl ,  Thomas Wippel

IPC: H01G4/38 ,  H01G4/248 ,  H01G4/232 ,  H05K1/18

CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01R43/26 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10909 ,  Y02P70/613

Abstract: The invention specifies an electrical component (1) which has a plurality of partial bodies (2), a base (3) on which the partial bodies (2) are arranged, and at least one connection contact (4, 5) for electrically connecting the partial bodies (2) to a carrier (13). The invention further specifies a method for producing an electrical component (1) having one or more partial bodies (2).

公开(公告)号：US20180146557A1

公开(公告)日：2018-05-24

申请号：US15875842

申请日：2018-01-19

Applicant: Invensas Corporation

Inventor： Reynaldo Co ,  Grant Villavicencio ,  Wael Zohni

IPC: H05K3/10 ,  B29C45/14 ,  H05K1/02 ,  H05K3/00 ,  B29L31/34

CPC classification number: H05K3/103 ,  B29C45/14065 ,  B29C45/14221 ,  B29C45/14655 ,  B29C45/14754 ,  B29C2045/1477 ,  B29L2031/3425 ,  H01L21/566 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0296 ,  H05K3/0014 ,  H05K2201/10757 ,  H05K2201/10818 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

公开(公告)号：US20180047507A1

公开(公告)日：2018-02-15

申请号：US15550672

申请日：2016-02-25

Applicant: Epcos AG

Inventor： Markus Koini ,  Christoph Auer ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Thomas Wippel

IPC: H01G4/228 ,  H05K1/18 ,  H01G4/30

CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01R43/26 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10909 ,  Y02P70/613

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

公开(公告)号：US09888579B2

公开(公告)日：2018-02-06

申请号：US14639789

申请日：2015-03-05

Applicant: Invensas Corporation

Inventor： Reynaldo Co ,  Grant Villavicencio ,  Wael Zohni

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  B29C45/14 ,  B29L31/34

CPC classification number: H05K3/103 ,  B29C45/14065 ,  B29C45/14221 ,  B29C45/14655 ,  B29C45/14754 ,  B29C2045/1477 ,  B29L2031/3425 ,  H01L21/566 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0296 ,  H05K3/0014 ,  H05K2201/10757 ,  H05K2201/10818 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

公开(公告)号：US09743520B2

公开(公告)日：2017-08-22

申请号：US14650940

申请日：2012-12-11

Applicant: Telefonaktiebolaget L M Ericsson (publ)

Inventor： Martin Dermark

IPC: H05K1/18 ,  H05K1/00 ,  H05K1/14 ,  H02M1/00

CPC classification number: H05K1/18 ,  H02M1/00 ,  H05K1/141 ,  H05K2201/10166 ,  H05K2201/1034 ,  H05K2201/10757

Abstract: A power module (100) arranged to receive an input voltage and to deliver an output voltage, comprising a supporting layer (110) with first and second main surfaces (111, 109) and a rim (122) surrounding the main surfaces. The power module (100) also comprises at least one component (112, 113, 114, 115) on or in the supporting layer (110) which protrudes a first perpendicular distance (d1) from one of the main surfaces. The power module (100) additionally comprises connectors (116-119; 120-123) for attaching the power module (100) to an external component (10). The one or more connectors (116-119; 120-123) protrude a second distance (d2) from said rim (122) in a perpendicular direction from one of the main surfaces (111, 109), so that the at least one component is at a predefined distance (d4, d5) from the external component (10) when the power module is attached to the external component (10).

公开(公告)号：US20170202088A1

公开(公告)日：2017-07-13

申请号：US15326870

申请日：2015-07-01

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd ,  Sumitomo Electric Industries, Ltd.

Inventor： Arinobu Nakamura

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

公开(公告)号：US09681549B2

公开(公告)日：2017-06-13

申请号：US15261389

申请日：2016-09-09

Applicant: Huawei Technologies Co., Ltd.

Inventor： Tewei Chen ,  Huili Fu ,  Nan Zhao

IPC: H01F27/04 ,  H01F5/00 ,  H05K1/18 ,  H05K3/34 ,  H01F27/29 ,  H01F19/00

CPC classification number: H05K1/181 ,  H01F5/00 ,  H01F19/00 ,  H01F27/292 ,  H01F2005/006 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10121 ,  H05K2201/10757 ,  Y02P70/613

Abstract: A conical inductor provided in the present invention includes: a housing, a conical coil located inside the housing, a first pin and a second pin respectively connected to two ends of the conical coil, where one end of the first pin is connected to one end of the conical coil, the other end of the first pin is connected to a hole in a first side wall of the housing in a fastened manner, one end of the second pin is connected to the other end of the conical inductor, and the other end of the second pin is connected to a hole in a second side wall of the housing in a fastened manner; and each of the first pin and the second pin includes one segment of waveform segment fluctuating in a direction perpendicular to a top wall of the housing.