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    Conductive adhesive and piezo-electric device having piezo-electric element mounted thereon using such adhesive
    82.
    发明申请
    Conductive adhesive and piezo-electric device having piezo-electric element mounted thereon using such adhesive 审中-公开
    具有使用这种粘合剂安装在其上的压电元件的导电粘合剂和压电装置

    公开(公告)号：US20050085578A1

    公开(公告)日：2005-04-21

    申请号：US10915218

    申请日：2004-08-09

    Applicant: Shuichi Iguchi

    Inventor： Shuichi Iguchi

    IPC: C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H01B1/22 ,  H01L21/52 ,  H03H9/02 ,  H03H9/05 ,  H03H9/25 ,  H02N2/00

    CPC classification number: H03H9/1071 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2224/85181 ,  H01L2924/16195 ,  H03H9/0585 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A piezo electric device in which a SAW element 5 is mounted on a base 1 of a package 4 having bonding pads 10,10 connected through bonding wires to corresponding connection terminals 11,11 in the package and having a lid 2 being joined to the base by seam welding and hermetically sealed thereto. The SAW element 5 is bonded and affixed to a mounting surface 6 in the base 1 using a conductive adhesive 7 which contains 80 to 85% resin material by weight and a 20 to 15% flaky conductive filler by weight, or using a conductive adhesive which contains 82.5 to 85% resin material by weight and a 17.5 to 15% conductive filler by weight, wherein the conductive filler comprises a 30% small particulate conductive filler 21 by weight and a 70% large particulate conductive filler 22 by weight.

    Abstract translation: 一种压电装置，其中SAW元件5安装在具有接合焊盘10,10的封装4的基座1上，接合焊盘10,10通过接合线连接到封装中的相应的连接端子11,11，并且具有与基座 通过缝焊和气密密封。 SAW元件5使用包含重量百分比为80-85％的树脂材料的导电粘合剂7和重量为20至15％的片状导电填料或使用导电粘合剂将导电粘合剂7粘合并固定到基座1中的安装表面6上， 含有82.5至85重量％的树脂材料和17.5至15重量％的导电填料，其中导电填料包含30重量％的小颗粒导电填料21和70重量％的大颗粒状导电填料22。

    Laser module
    83.
    发明申请
    Laser module 有权
    激光模块

    公开(公告)号：US20050074039A1

    公开(公告)日：2005-04-07

    申请号：US10954245

    申请日：2004-10-01

    Applicant: Teruhiko Kuramachi ,  Fusao Yamanaka ,  Kazuhiko Nagano

    Inventor： Teruhiko Kuramachi ,  Fusao Yamanaka ,  Kazuhiko Nagano

    IPC: G02B6/42 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J171/02 ,  C09J201/00 ,  H01S3/10 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/024 ,  H01S5/40

    CPC classification number: G02B6/4206 ,  G02B6/4239 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01S5/005 ,  H01S5/0222 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/4012 ,  H01S5/4031 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, generation of organic volatile gas is suppressed in the container and life of the module is prolonged. In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, optical components whose organic volatile gas generation measured by GC/MS is 10 μg/g or less at 150° C. are positioned in the container. In addition, as an organic adhesive to fix the optical components such as a collimating lens is used an organic adhesive whose organic volatile gas generation measured by GC/MS is 100 μg/g or less at 150° C.

    Abstract translation: 在包含发光波长为350〜450nm的半导体激光装置的内部的气密密封容器的激光模块中，在容器中抑制有机挥发性气体的产生，延长了模块的使用寿命。 在包括发光波长为350〜450nm的半导体激光装置的内部的气密密封容器的激光模块中，通过GC / MS测定的有机挥发性气体的产生在150℃下为10mug / g以下的光学部件被定位 在容器中 此外，作为用于固定准直透镜等光学部件的有机粘合剂，使用通过GC / MS测定的有机挥发性气体产生在150℃下为100mug / g以下的有机粘合剂。

    Assembly tape with slits and folds
    86.
    发明申请
    Assembly tape with slits and folds 审中-公开
    带缝和褶皱的装配带

    公开(公告)号：US20050058798A1

    公开(公告)日：2005-03-17

    申请号：US10889758

    申请日：2004-07-13

    Applicant: Marco Sieber ,  Reto Sieber

    Inventor： Marco Sieber ,  Reto Sieber

    IPC: E04F13/07 ,  C09J7/02 ,  C09J201/00 ,  E04B1/68 ,  E04F13/08 ,  E06B1/62 ,  B32B9/00

    CPC classification number: E06B1/62 ,  E04B1/6809 ,  E06B2001/628 ,  Y10T428/14 ,  Y10T428/24215

    Abstract: The invention relates to a pressure-sensitive tape for closing, sealing, and gluing joints, in particular in housing construction, and in particular joints in corners and edges, that has a backing on the tape top side, an adhesive coating of the backing on the tape bottom side, and a removable protective film on the tape bottom side, whereby the protective film has at least one first slit. At least one first fold section of the tape is folded in the transverse direction along a first fold edge that runs in the longitudinal direction of the tape, whereby the first slit runs at a different location than the first fold edge.

    Abstract translation: 本发明涉及一种用于关闭，密封和胶合接头的压敏胶带，特别是在壳体结构中，特别是在角部和边缘上的接头，其在带顶侧上具有背衬，背衬的粘合剂涂层 胶带底侧和带底侧的可移除的保护膜，由此保护膜具有至少一个第一狭缝。 带的至少一个第一折叠部分沿着在带的纵向方向上延伸的第一折叠边沿横向方向折叠，由此第一狭缝在与第一折叠边缘不同的位置处延伸。

    Cleanly removable tapes and methods for the manufacture thereof
    88.
    发明授权
    Cleanly removable tapes and methods for the manufacture thereof 失效
    清洁可拆卸的磁带及其制造方法

    公开(公告)号：US06866928B2

    公开(公告)日：2005-03-15

    申请号：US10118120

    申请日：2002-04-08

    Applicant: Timothy N. Narum ,  James J. Kobe ,  Rodger J. Pereyra ,  Zhiming Zhou

    Inventor： Timothy N. Narum ,  James J. Kobe ,  Rodger J. Pereyra ,  Zhiming Zhou

    IPC: B32B27/00 ,  B32B5/00 ,  B32B7/06 ,  C09J7/02 ,  C09J9/00 ,  C09J11/00 ,  C09J201/00

    CPC classification number: C09J9/00 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/618 ,  Y10S428/92 ,  Y10S428/921 ,  Y10T428/14 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2813 ,  Y10T428/2848 ,  Y10T428/2891

    Abstract: The present invention provides a multi-layer tape, comprising: a first adhesive layer comprising a pressure sensitive adhesive; a core layer having an outer surface, the first adhesive layer adhered to at least a portion of the outer surface; and fibrous reinforcing material dispersed within the core layer, the fibrous reinforcing material imparting stretch release properties to the tape. The tape may comprise a second adhesive layer wherein the outer surface comprises a first major surface and a second major surface, the first adhesive layer being adhered to the first major surface, and the second adhesive layer being adhered to the second major surface. A fire retardant may be disposed in any of the first adhesive layer, the second adhesive layer, and the core layer. The tape may be cleanly removable. The fibrous reinforcing material typically comprises substantially continuous viscoelastic microfibers having a yield strength and a tensile break strength, and the tensile break strength is at least about 150% of the yield strength. In another aspect, the tapes of the invention may be formulated to be cleanly removable without including fibrous reinforcing material therein. The invention also provides a method for the manufacture of the foregoing tape as well as an assembly comprising: a substrate; a carpet overlying the substrate; and a tape according to the invention disposed between the carpet and the substrate and adhering the carpet to the substrate.

    Abstract translation: 本发明提供了一种多层带，包括：包含压敏粘合剂的第一粘合剂层; 芯层，其具有外表面，所述第一粘合剂层粘附到所述外表面的至少一部分; 纤维增强材料分散在芯层内，纤维增强材料赋予带的拉伸脱模性能。 带可以包括第二粘合剂层，其中外表面包括第一主表面和第二主表面，第一粘合剂层粘附到第一主表面，并且第二粘合剂层粘附到第二主表面。 阻燃剂可以设置在第一粘合剂层，第二粘合剂层和芯层中的任一个中。 磁带可能是干净可拆卸的。 纤维增强材料通常包括具有屈服强度和拉伸断裂强度的基本上连续的粘弹性微纤维，并且拉伸断裂强度是屈服强度的至少约150％。 在另一方面，本发明的带可以配制成可干净地移除，而不包括其中的纤维增强材料。 本发明还提供了一种用于制造前述带的方法以及一种组件，其包括：基底; 覆盖衬底的地毯; 以及根据本发明的设置在地毯和基底之间并且将地毯粘附到基底上的带。

    Multi-phase structural adhesives
    89.
    发明申请
    Multi-phase structural adhesives 审中-公开
    多相结构胶

    公开(公告)号：US20050022929A1

    公开(公告)日：2005-02-03

    申请号：US10867652

    申请日：2004-06-15

    Applicant: Rainer Schoenfeld ,  Hubert Schumann

    Inventor： Rainer Schoenfeld ,  Hubert Schumann

    IPC: C08L55/00 ,  C08L63/00 ,  C09J5/06 ,  C09J163/00 ,  C09J201/00 ,  B32B31/00

    CPC classification number: C09J163/00 ,  C08L55/00 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/24 ,  C09J5/06 ,  C09J201/00 ,  C09J2400/163 ,  C09J2400/226 ,  C09J2455/00 ,  C09J2463/00

    Abstract: Hot-curing structural adhesives with multiphase polymer morphology, wherein the binder matrix of the cured chemically reactive adhesive displays (a) a continuous phase containing a polymer P1 having a glass transition temperature of over 100° C.; (b) a heterodisperse phase consisting of individual continuous domains of a thermoplastic or elastomeric polymer P2 having a glass transition temperature of below −30° C. and an average particle size of between 0.5 and 50 μm, which itself contains separate phases of another thermoplastic or elastomeric polymer P3 having a glass transition temperature of below −30° C. and a size of between 1 nm and 100 nm, parts of which can be in aggregated form as larger agglomerates; and (c) another heterodisperse phase embedded in the continuous phase and consisting of domains of the polymer P3, at least parts of which have an average particle size of between 1 nm and 50 nm, wherein P3 is not identical to P2; are suitable as high-strength, impact resistant structural adhesives, for internal stiffeners for cavities in automobile construction and for the production of reinforcing coatings for thin-wall sheet components.

    Abstract translation: 具有多相聚合物形态的热固化结构粘合剂，其中固化的化学反应性粘合剂的粘合剂基质显示（a）含有玻璃化转变温度超过100℃的聚合物P1的连续相; （b）由玻璃化转变温度低于-30℃的平均粒径为0.5-50微米的热塑性或弹性体聚合物P2的单独连续区组成的异分散相，其本身包含另一种热塑性塑料 或具有低于-30℃的玻璃化转变温度和1nm至100nm的尺寸的弹性体聚合物P3，其中的部分可以作为较大的附聚物呈聚集形式; 和（c）嵌入在连续相中并由聚合物P3的结构域组成的另一个异分散相，其中至少部分具有1nm至50nm的平均粒度，其中P3与P2不相同; 适用于高强度，耐冲击的结构粘合剂，用于汽车结构中的腔的内部加强件以及用于生产用于薄壁片材部件的增强涂层。

    Initiator systems comprising β-ketone compounds
    90.
    发明授权
    Initiator systems comprising β-ketone compounds 有权

    公开(公告)号：US06849569B2

    公开(公告)日：2005-02-01

    申请号：US10037074

    申请日：2001-12-31

    Applicant: Dean M. Moren

    Inventor： Dean M. Moren

    IPC: C08F4/54 ,  C08F4/00 ,  C09J4/00 ,  C09J11/06 ,  C09J201/00 ,  B01J31/00

    CPC classification number: C09J4/00

    Abstract: The invention provides initiator systems capable of initiating polymerization. More specifically, the invention relates to initiator systems comprising a complexed initiator and a β-ketone compound decomplexer. The invention further relates to the use of these initiator systems for initiating polymerization, as well as kits, bonding compositions, and polymerized compositions made therewith, and coated substrates and bonded articles prepared therefrom.

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