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    OPTICAL WAVEGUIDE NETWORK OF AN INTERCONNECTING IC MODULE
    1.
    发明申请
    OPTICAL WAVEGUIDE NETWORK OF AN INTERCONNECTING IC MODULE 审中-公开
    互连IC模块的光波形网络

    公开(公告)号：US20140270629A1

    公开(公告)日：2014-09-18

    申请号：US13843206

    申请日：2013-03-15

    Applicant: APIC CORPORATION

    Inventor： Birendra Dutt ,  Ashok Kumar Kapoor

    IPC: G02B6/12 ,  H01L31/12 ,  G02B6/136

    CPC classification number: G02B6/12 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/136 ,  G02B6/43 ,  H01L31/12

    Abstract: The subject matter disclosed herein relates to a photonic module comprising: a silicon-on-insulator (SOI) wafer; one or more photonic components on the SOI wafer; a plurality of metal pads to receive integrated circuit (IC) chips to be mounted on the SOI wafer; silicon optical waveguides to transfer optical signals among terminals of individual the IC chips, wherein the silicon optical waveguides comprise portions of the SOI wafer; and silica optical waveguides to transfer optical signals among terminals of different the IC chips.

    Abstract translation: 本文公开的主题涉及一种光子模块，包括：绝缘体上硅（SOI）晶片; SOI晶片上的一个或多个光子分量; 用于接收要安装在SOI晶片上的集成电路（IC）芯片的多个金属焊盘; 硅光波导在单个IC芯片的端子之间传送光信号，其中硅光波导包括SOI晶片的部分; 和二氧化硅光波导在不同IC芯片的端子之间传输光信号。

    PHOTONIC MULTI-CHIP MODULE
    2.
    发明申请
    PHOTONIC MULTI-CHIP MODULE 审中-公开
    光电多芯片模块

    公开(公告)号：US20140270621A1

    公开(公告)日：2014-09-18

    申请号：US13843097

    申请日：2013-03-15

    Applicant: APIC CORPORATION

    Inventor： Birendra Dutt ,  Ashok Kumar Kapoor

    IPC: G02B6/12 ,  G02B6/126

    CPC classification number: G02B6/12 ,  G02B6/12004 ,  G02B6/126 ,  G02B6/43 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/00014

    Abstract: The subject matter disclosed herein relates to a photonic module comprising: a plurality of metal pads to receive CMOS integrated circuit (IC) chips to be mounted on a silicon-on-insulator (SOI) wafer; electrical interface circuits to receive electrical signals from the CMOS IC chips and to modify the electrical signals; optical drivers to receive the modified electrical signals and to convert the modified electrical signals to optical signals; and a photonic layer on the SOI wafer comprising silicon optical waveguides and silica optical waveguides to transmit or receive the optical signals for communication among the CMOS IC chips.

    Abstract translation: 本文公开的主题涉及一种光子模块，包括：多个金属焊盘，用于接收要安装在绝缘体上硅（SOI）晶片上的CMOS集成电路（IC）芯片; 电接口电路，用于从CMOS IC芯片接收电信号并修改电信号; 光学驱动器，用于接收修改的电信号并将修改的电信号转换成光信号; 以及包括硅光波导和石英光波导的SOI晶片上的光子层，用于发送或接收用于在CMOS IC芯片之间通信的光信号。

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