公开(公告)号：US20070041589A1

公开(公告)日：2007-02-22

申请号：US11205403

申请日：2005-08-17

Applicant: Atin Patel ,  Gora Ganguli ,  Randall Mileski ,  Cameron Smith ,  Sukhminder Binapal ,  Kamal Ali

Inventor： Atin Patel ,  Gora Ganguli ,  Randall Mileski ,  Cameron Smith ,  Sukhminder Binapal ,  Kamal Ali

IPC: H04R3/02

CPC classification number: H04M1/6066 ,  G10L21/02 ,  G10L2021/02165 ,  H04R1/1083

Abstract: In accordance with the teachings described herein, systems and methods are provided for providing environmental specific noise reduction algorithms (ESNRAs) in a head-mounted device. A network server may be used to store a plurality of ESNRAs. One or more of the ESNRAs may be downloaded from the network server for use in the head-mounted device. The head-mounted device may use one or more of the downloaded ESNRAs to filter environmental noise from an audio signal.

Abstract translation: 根据本文所述的教导，提供了用于在头戴式装置中提供环境特定噪声降低算法（ESNAR）的系统和方法。 网络服务器可以用于存储多个ESNRAs。 可以从网络服务器下载一个或多个ESNRA，以用于头戴式设备。 头戴式装置可以使用一个或多个下载的ESNRA来从音频信号中滤除环境噪声。

公开(公告)号：US20050117272A1

公开(公告)日：2005-06-02

申请号：US10997344

申请日：2004-11-24

Applicant: Ivoyl Koutsaroff ,  Mark Vandermeulen ,  Andrew Cervin-Lawry ,  Atin Patel

Inventor： Ivoyl Koutsaroff ,  Mark Vandermeulen ,  Andrew Cervin-Lawry ,  Atin Patel

IPC: H01G4/06 ,  H01G4/12 ,  H01G4/33 ,  H01L21/77 ,  H01L23/498 ,  H01L27/00 ,  H01L27/01

CPC classification number: H01L27/016 ,  H01G4/1227 ,  H01G4/33 ,  H01L23/49822 ,  H01L28/40 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K1/16

Abstract: In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, the electrode layers being formed from a conductive thin film material. A buffer layer may be included between the ceramic substrate and the thin film MLC. The buffer layer may have a smooth surface with a surface roughness (Ra) less than or equal to 0.08 micrometers (um).

Abstract translation: 根据本文所述的教导，提供了陶瓷基板上的多层薄膜电容器及其制造方法。 多层薄膜电容器（MLC）可以在至少两个电极层之间包括至少一个高介电常数介电层，电极层由导电薄膜材料形成。 陶瓷基板和薄膜MLC之间可以包括缓冲层。 缓冲层可以具有小于或等于0.08微米（μm）的表面粗糙度（Ra）的光滑表面。

公开(公告)号：US20050090295A1

公开(公告)日：2005-04-28

申请号：US10961762

申请日：2004-10-08

Applicant: Kamal Ali ,  Sukhminder Binapal ,  Atin Patel ,  Gora Ganguli ,  Brad Marshall

Inventor： Kamal Ali ,  Sukhminder Binapal ,  Atin Patel ,  Gora Ganguli ,  Brad Marshall

IPC: H04M1/00 ,  H04M9/00 ,  H04R1/00 ,  H04R1/08 ,  H04R1/10 ,  H04R3/00 ,  H04R25/00

CPC classification number: H04R25/554 ,  H03G9/005 ,  H03G9/025 ,  H04R1/10 ,  H04R3/005 ,  H04R25/407 ,  H04R2420/07

Abstract: In accordance with the teachings described herein, a communication headset with signal processing capabilities is provided. A radio communications circuitry may be included to communicate wirelessly with a communications device. A speaker may be included for directing acoustical signals into the ear canal of a headset user. A microphone may be included for receiving acoustical signals. A digital signal processor may be included for processing acoustical signals, the digital signal processor being operable in a first mode, such as a communication mode, and in a second mode, such as a hearing instrument mode.

Abstract translation: 根据本文所述的教导，提供具有信号处理能力的通信耳机。 可以包括无线电通信电路以与通信设备进行无线通信。 可以包括用于将声信号引导到耳机用户的耳道中的扬声器。 可以包括麦克风以接收声信号。 可以包括数字信号处理器来处理声音信号，数字信号处理器可以在诸如通信模式的第一模式以及诸如听力仪器模式的第二模式中操作。

公开(公告)号：US20070049361A1

公开(公告)日：2007-03-01

申请号：US11212296

申请日：2005-08-26

Applicant: Paul Coote ,  Atin Patel ,  Gora Ganguli ,  Kamal Ali ,  Randall Mileski

Inventor： Paul Coote ,  Atin Patel ,  Gora Ganguli ,  Kamal Ali ,  Randall Mileski

IPC: H04M1/00

CPC classification number: H04R1/1066 ,  H04R1/1016 ,  H04R2201/107 ,  H04R2201/109

Abstract: In accordance with the teachings described herein, a side mounted wireless headset is provided. The wireless headset may be configured to communicate with a remote device over a short range wireless link. The wireless headset may include an eartip extending from a headset body that is configured to be inserted into an ear canal when the wireless headset is positioned on a user's head. The eartip, when inserted into the ear canal, may occlude the ear canal and secure the wireless headset to the user's head. An earhook may be attached to the headset body and may be configured to extend around an outer surface of the user's ear to further secure the wireless headset to the user's head.

Abstract translation: 根据本文所述的教导，提供了侧面安装的无线耳机。 无线耳机可以被配置为通过短距离无线链路与远程设备进行通信。 无线耳机可以包括从头戴耳机主体延伸的耳塞，其配置成当无线耳机位于用户的头部上时被插入到耳道中。 耳塞插入耳道时可能会堵塞耳道，并将无线耳机固定在用户的头部。 耳挂可以附接到耳机主体，并且可以被配置为围绕用户耳朵的外表面延伸，以进一步将无线耳机固定到用户的头部。

公开(公告)号：US20080037200A1

公开(公告)日：2008-02-14

申请号：US11734798

申请日：2007-04-13

Applicant: Ivoyl Koutsaroff ,  Mark Vandermeulen ,  Andrew Cervin-Lawry ,  Atin Patel

Inventor： Ivoyl Koutsaroff ,  Mark Vandermeulen ,  Andrew Cervin-Lawry ,  Atin Patel

IPC: H01G4/06

CPC classification number: H01L27/016 ,  H01G4/1227 ,  H01G4/33 ,  H01L23/49822 ,  H01L28/40 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K1/16

Abstract: In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, the electrode layers being formed from a conductive thin film material. A buffer layer may be included between the ceramic substrate and the thin film MLC. The buffer layer may have a smooth surface with a surface roughness (Ra) less than or equal to 0.08 micrometers (um).

Abstract translation: 根据本文所述的教导，提供了陶瓷基板上的多层薄膜电容器及其制造方法。 多层薄膜电容器（MLC）可以在至少两个电极层之间包括至少一个高介电常数介电层，电极层由导电薄膜材料形成。 陶瓷基板和薄膜MLC之间可以包括缓冲层。 缓冲层可以具有小于或等于0.08微米（μm）的表面粗糙度（Ra）的光滑表面。

公开(公告)号：US20070209201A1

公开(公告)日：2007-09-13

申请号：US11736408

申请日：2007-04-17

Applicant: Ivoyl Koutsaroff ,  Mark Vandermeulen ,  Andrew Cervin-Lawry ,  Atin Patel

Inventor： Ivoyl Koutsaroff ,  Mark Vandermeulen ,  Andrew Cervin-Lawry ,  Atin Patel

IPC: H01L29/32 ,  H05K3/10

CPC classification number: H01G4/38 ,  H01G4/33 ,  H01G13/04 ,  H01L27/016 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/38 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: In accordance with the teachings described herein, a multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same are provided. The multi-level thin film capacitor (MLC) may include at least one high permittivity dielectric layer between at least two electrode layers, the electrode layers being formed from a conductive thin film material. A buffer layer may be included between the ceramic substrate and the thin film MLC. The buffer layer may have a smooth surface with a surface roughness (Ra) less than or equal to 0.08 micrometers (um).

Abstract translation: 根据本文所述的教导，提供了陶瓷基板上的多层薄膜电容器及其制造方法。 多层薄膜电容器（MLC）可以在至少两个电极层之间包括至少一个高介电常数介电层，电极层由导电薄膜材料形成。 陶瓷基板和薄膜MLC之间可以包括缓冲层。 缓冲层可以具有小于或等于0.08微米（μm）的表面粗糙度（Ra）的光滑表面。