公开(公告)号：US20030118429A1

公开(公告)日：2003-06-26

申请号：US10027869

申请日：2001-12-20

Applicant: Autosplice Systems Inc.

Inventor： Jerome L. Weber

IPC: B65B021/02

CPC classification number: H01R43/205 ,  H01R43/0256 ,  Y10T29/5193 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T156/1906

Abstract: A novel feeder construction, and method of operation, that is easily interfaced to a variety of conventional pick-and-place machines and can readily and reliably feed components suspended from a carrier for pickup at a pickup location by the pick-and-place machine. In a preferred embodiment, the carrier with suspended components is fed in a line spaced laterally from the pickup location. The lead component when separated from the strip must then be moved laterally to the pickup location. By laterally spacing the carrier strip of components from the pickup location it is ensured that the feeder parts involved in separating the component from the carrier do not obstruct movement of the vacuum nozzle of the pick-and-place machine during the pickup operation and advancement of the carrier to present the next component.

Abstract translation: 一种新颖的馈线结构和操作方法，其易于与各种常规的拾放机器连接，并且可以容易且可靠地馈送悬挂在载体上的元件，以便通过拾取和放置机器在拾取位置拾取 。 在优选实施例中，具有悬挂部件的载体以与拾取位置横向间隔开的线进给。 然后，与条带分离时的引导部件必须横向移动到拾取位置。 通过将部件的载体带从拾取位置横向间隔，确保参与将部件与载体分离的进给器部分不会妨碍拾取操作期间的拾取和放置机器的真空喷嘴的移动 载体呈现下一个组件。

公开(公告)号：US20040209495A1

公开(公告)日：2004-10-21

申请号：US10843972

申请日：2004-05-13

Applicant: Autosplice Systems Inc.

Inventor： Craig M. Kennedy ,  Donald S. Eisenberg

IPC: H01R012/00

CPC classification number: H01R43/0235 ,  H01R4/028 ,  H01R12/52 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10303 ,  H05K2203/042

Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In on of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.

Abstract translation: 使用冲压或引脚或焊盘的导电的例如金属表面作为车辆的焊接转移方法将熔融焊料从远程焊料储存器转移到待制造的焊点。 在优选实施例中，在第一回流步骤期间预先形成在表面安装焊盘上的焊料沉积物将通过芯吸工艺传递到相邻的接触表面，以提供制造坚固的焊接接头所需的附加焊料。 该方法和结构对于将子板附接到主板是有用的，并且用于将具有多个引脚的长插头表面安装到PCB的接触表面，而不需要在第二回流步骤期间单独添加焊料，以在第二回流步骤之间形成牢固的焊接接头 接触面。