公开(公告)号：US20040209495A1

公开(公告)日：2004-10-21

申请号：US10843972

申请日：2004-05-13

Applicant: Autosplice Systems Inc.

Inventor： Craig M. Kennedy ,  Donald S. Eisenberg

IPC: H01R012/00

CPC classification number: H01R43/0235 ,  H01R4/028 ,  H01R12/52 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10303 ,  H05K2203/042

Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In on of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.

Abstract translation: 使用冲压或引脚或焊盘的导电的例如金属表面作为车辆的焊接转移方法将熔融焊料从远程焊料储存器转移到待制造的焊点。 在优选实施例中，在第一回流步骤期间预先形成在表面安装焊盘上的焊料沉积物将通过芯吸工艺传递到相邻的接触表面，以提供制造坚固的焊接接头所需的附加焊料。 该方法和结构对于将子板附接到主板是有用的，并且用于将具有多个引脚的长插头表面安装到PCB的接触表面，而不需要在第二回流步骤期间单独添加焊料，以在第二回流步骤之间形成牢固的焊接接头 接触面。