公开(公告)号：US20130020718A1

公开(公告)日：2013-01-24

申请号：US13189057

申请日：2011-07-22

Applicant: Bruce C.S. Chou

Inventor： Bruce C.S. Chou

IPC: H01L21/58 ,  H01L23/48

CPC classification number: B81B3/0018 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00476 ,  B81C1/00801 ,  B81C2201/0109 ,  H01L24/13 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/13009 ,  H01L2224/13138 ,  H01L2224/80011 ,  H01L2224/80012 ,  H01L2224/80013 ,  H01L2224/80031 ,  H01L2224/80047 ,  H01L2224/8009 ,  H01L2224/80092 ,  H01L2224/80931 ,  H01L2224/81002 ,  H01L2224/81007 ,  H01L2224/811 ,  H01L2224/9202 ,  H01L2924/1461 ,  H01L21/76898 ,  H01L2924/01014 ,  H01L2924/00

Abstract: The present invention provides a MEMS structure comprising confined sacrificial oxide layer and a bonded Si layer. Polysilicon stack is used to fill aligned oxide openings and MEMS vias on the sacrificial layer and the bonded Si layer respectively. To increase the design flexibility, some conductive polysilicon layer can be further deployed underneath the bonded Si layer to form the functional sensing electrodes or wiring interconnects. The MEMS structure can be further bonded to a metallic layer on top of the Si layer and the polysilicon stack.

Abstract translation: 本发明提供一种MEMS结构，其包括受限的牺牲氧化物层和结合的Si层。 多晶硅叠层用于在牺牲层和结合的Si层上分别填充对准的氧化物开口和MEMS通孔。 为了增加设计灵活性，可以将一些导电多晶硅层进一步布置在结合的Si层下面以形成功能感测电极或布线互连。 MEMS结构可以进一步结合到Si层和多晶硅叠层顶部的金属层。

公开(公告)号：US09322862B2

公开(公告)日：2016-04-26

申请号：US14045514

申请日：2013-10-03

Applicant: Bruce C.S. Chou

Inventor： Bruce C.S. Chou ,  Shih Chieh Hsu

IPC: G01R27/26 ,  G06F3/044 ,  G06F3/041 ,  G01R1/00 ,  G06F1/00 ,  H03K17/96

CPC classification number: G01R27/2605 ,  G01R1/00 ,  G06F1/00 ,  G06F3/0416 ,  G06F3/044 ,  G06F2101/00 ,  H03K17/9622 ,  H03K2217/960705

Abstract: A capacitive sensing array device of an electronic apparatus includes sensing electrodes, a shielding conductor layer, a coupling signal source, a constant voltage source and switch modules. The coupling signal source provides a coupling signal coupled to an object. The constant voltage source provides a constant voltage to the shielding conductor layer to form a stable vertical parasitic capacitor between the shielding conductor layer and each sensing electrode. Each switch module is electrically connected to the constant voltage source via the corresponding sensing electrode. When one sensing electrode is selected to perform sensing, the corresponding switch module is configured as an open-circuited state such that the selected sensing electrode is disconnected from the constant voltage source, while the other sensing electrodes are electrically connected to the constant voltage source to form a stable horizontal parasitic capacitor between the selected sensing electrode and the other sensing electrodes.

Abstract translation: 电子设备的电容式感测阵列装置包括感测电极，屏蔽导体层，耦合信号源，恒压源和开关模块。 耦合信号源提供耦合到对象的耦合信号。 恒压源为屏蔽导体层提供恒定的电压，以在屏蔽导体层和每个感测电极之间形成稳定的垂直寄生电容。 每个开关模块通过相应的感测电极电连接到恒压源。 当选择一个感测电极进行感测时，相应的开关模块被配置为开路状态，使得所选择的感测电极与恒定电压源断开，而其它感测电极电连接到恒定电压源 在所选择的感测电极和其他感测电极之间形成稳定的水平寄生电容器。

公开(公告)号：US20130277771A1

公开(公告)日：2013-10-24

申请号：US13452037

申请日：2012-04-20

Applicant: Bruce C.S. Chou ,  Jung-Kuo Tu ,  Chen-Chih Fan

Inventor： Bruce C.S. Chou ,  Jung-Kuo Tu ,  Chen-Chih Fan

IPC: H01L29/84 ,  H01L21/02

CPC classification number: B81C1/00158 ,  B81C1/00301 ,  G01P15/125 ,  H01G5/18 ,  H01L28/60

Abstract: A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane.

公开(公告)号：US20090039449A1

公开(公告)日：2009-02-12

申请号：US12187554

申请日：2008-08-07

Applicant: Bruce C.S. Chou

Inventor： Bruce C.S. Chou

IPC: H01L29/84 ,  H01L21/00

CPC classification number: G06K9/00053

Abstract: A fingerprint sensing device includes a chip substrate, a plurality of first connecting pads and a flexible printed circuit board. The chip substrate has a plurality of fingerprint sensing cells. The first connecting pads are respectively disposed on the fingerprint sensing cells and exposed from a top surface of the chip substrate. The flexible printed circuit board is disposed above the chip substrate and has a plurality of signal transmission structures exposed from a bottom surface of the flexible printed circuit board. The fingerprint sensing cells are respectively electrically connected to the signal transmission structures, and a top surface of the flexible printed circuit board serves as a contact surface for a finger so that sensed fingerprint signals of the finger are transmitted to the fingerprint sensing cells through the signal transmission structures. A method of manufacturing the fingerprint sensing device is also disclosed.

Abstract translation: 指纹感测装置包括芯片基板，多个第一连接焊盘和柔性印刷电路板。 芯片基板具有多个指纹感测单元。 第一连接焊盘分别设置在指纹感测单元上并从芯片基板的顶表面露出。 柔性印刷电路板设置在芯片基板上方，并且具有从柔性印刷电路板的底表面露出的多个信号传输结构。 指纹感测单元分别电连接到信号传输结构，并且柔性印刷电路板的顶表面用作手指的接触表面，使得手指的感测指纹信号通过信号传输到指纹感测单元 传输结构。 还公开了制造指纹感测装置的方法。

公开(公告)号：US20080150050A1

公开(公告)日：2008-06-26

申请号：US12003159

申请日：2007-12-20

Applicant: Bruce C.S. Chou ,  Chen-Chin Fan

Inventor： Bruce C.S. Chou ,  Chen-Chin Fan

IPC: H01L29/84 ,  H01L21/56

CPC classification number: G06K9/00053 ,  H01L23/3185 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An information sensing device includes a substrate, an information sensing chip mounted on and electrically connected to the substrate, at least one electroconductive structure mounted on and electrically connected to the substrate and disposed on one side of the information sensing chip, and a molding compound material partially surrounding the information sensing chip and the electroconductive structure to expose a chip surface of the information sensing chip and a first surface of the electroconductive structure. Thus, an electrostatic charge approaching the information sensing device is conducted from the electroconductive structure to the substrate. The chip surface is to be in contact with an object to sense an image of the object.

Abstract translation: 一种信息感测装置，包括：基板，安装在基板上并与其电连接的信息感测芯片;至少一个导电结构，其安装在基板上并电连接到基板并且设置在信息感测芯片的一侧;以及模制复合材料 部分地围绕信息感测芯片和导电结构以暴露信息感测芯片的芯片表面和导电结构的第一表面。 因此，接近信息感测装置的静电电荷从导电结构传导到衬底。 芯片表面与物体接触以感测物体的图像。

公开(公告)号：US20070222010A1

公开(公告)日：2007-09-27

申请号：US11723907

申请日：2007-03-22

Applicant: Bruce C.S. Chou ,  Chen-Chih Fan

Inventor： Bruce C.S. Chou ,  Chen-Chih Fan

IPC: H01L29/84

CPC classification number: G06K9/00053 ,  Y10S977/701 ,  Y10S977/72 ,  Y10S977/721

Abstract: A semiconductor integrated circuit (IC) chip includes an IC chip body and a nano-structure-surface passivation film. The IC chip body has at least one surface. The nano-structure-surface passivation film is formed on the at least one surface. The nano-structure-surface passivation film including nano-particles and a carrier resin protects the IC chip body from encountering any external interference.

Abstract translation: 半导体集成电路（IC）芯片包括IC芯片体和纳米结构表面钝化膜。 IC芯片主体具有至少一个表面。 纳米结构表面钝化膜形成在至少一个表面上。 包括纳米颗粒和载体树脂的纳米结构表面钝化膜保护IC芯片体免受任何外部干扰。

公开(公告)号：US20120049299A1

公开(公告)日：2012-03-01

申请号：US12870444

申请日：2010-08-27

Applicant: Bruce C.S. Chou

Inventor： Bruce C.S. Chou

IPC: H01L29/84 ,  H01L21/02

CPC classification number: B81B7/0032 ,  B81B2201/025 ,  B81C1/00246 ,  B81C2203/0109 ,  B81C2203/0714 ,  H01L2224/83805

Abstract: A composite wafer semiconductor device includes a first wafer and a second wafer. The first wafer has a first side and a second side, and the second side is substantially opposite the first side. The composite wafer semiconductor device also includes an isolation set is formed on the first side of the first wafer and a free space is etched in the isolation set. The second wafer is bonded to the isolation set. A floating structure, such as an inertia sensing device, is formed in the second wafer over the free space. In an embodiment, a surface mount pad is formed on the second side of the first wafer. Then, the floating structure is electrically coupled to the surface mount pad using a through silicon via (TSV) conductor.

Abstract translation: 复合晶片半导体器件包括第一晶片和第二晶片。 第一晶片具有第一侧和第二侧，第二侧基本上与第一侧相对。 复合晶片半导体器件还包括在第一晶片的第一侧上形成隔离组件，并且在隔离组件中蚀刻自由空间。 第二个晶片结合到隔离组件上。 在自由空间中的第二晶片中形成诸如惯性感测装置的浮动结构。 在一个实施例中，表面安装焊盘形成在第一晶片的第二侧上。 然后，使用硅通孔（TSV）导体将浮动结构电耦合到表面安装焊盘。

公开(公告)号：US20130277777A1

公开(公告)日：2013-10-24

申请号：US13450223

申请日：2012-04-18

Applicant: Chang-Chia Chang ,  Chen-Chih Fan ,  Bruce C.S. Chou

Inventor： Chang-Chia Chang ,  Chen-Chih Fan ,  Bruce C.S. Chou

IPC: H01L21/58 ,  H01L29/84

CPC classification number: B81C1/00269 ,  B81B3/0018 ,  B81B3/0067 ,  B81B3/007 ,  B81B7/00 ,  B81B7/0006 ,  B81B7/0016 ,  B81B7/0029 ,  B81B7/0041 ,  B81B7/0051 ,  B81B7/0058 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2201/025 ,  B81B2207/07 ,  B81B2207/096 ,  B81C1/00 ,  B81C1/00293 ,  B81C1/00325 ,  B81C2203/0118

Abstract: A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.

Abstract translation: 微机电系统（MEMS）装置可以包括在第一衬底上方的MEMS结构。 MEMS结构包括中心静态元件，可移动元件和外部静态元件。 在中心静电元件和第一衬底之间的一部分接合材料。 在MEMS结构上方的第二衬底，在中心静态元件和第二衬底之间具有介电层的一部分。 支撑柱包括接合材料部分，中心静电元件和介电材料部分。

公开(公告)号：US20050244037A1

公开(公告)日：2005-11-03

申请号：US11115212

申请日：2005-04-27

Applicant: Li-Kuo Chiu ,  Bruce C.S. Chou

Inventor： Li-Kuo Chiu ,  Bruce C.S. Chou

IPC: G06F21/00 ,  G06K9/00

CPC classification number: G06F21/32

Abstract: A portable encrypted storage device with biometric identification includes a host interface connected to a terminal host, a controller connected to the host interface, a memory module, a fingerprint sensor, an encryption/decryption chip and a portable large-capacity storage unit connected to the controller. The controller communicates with the host by handshakes and enables the host to automatically run a fingerprint identification driver and application program from the memory module to the host. The host receives an instruction from the user through the driver and program, and informs the controller to control the fingerprint sensor to read to-be-recognized fingerprint data of the user. The host judges whether or not the to-be-recognized fingerprint data substantially matches with a fingerprint template stored in the memory module. If a match occurs, the host can recognize and access the hidden portable large-capacity storage unit through the encryption/decryption chip.

Abstract translation: 具有生物识别的便携式加密存储装置包括连接到终端主机的主机接口，连接到主机接口的控制器，存储器模块，指纹传感器，加密/解密芯片和便携式大容量存储单元 控制器。 控制器通过握手与主机进行通信，并使主机能够自动将指纹识别驱动程序和应用程序从内存模块运行到主机。 主机通过驱动程序和程序接收用户的指令，并通知控制器控制指纹传感器读取用户的未被识别的指纹数据。 主机判断被识别的指纹数据是否与存储在存储器模块中的指纹模板基本匹配。 如果发生匹配，主机可以通过加密/解密芯片识别和访问隐藏的便携式大容量存储单元。