公开(公告)号：US3703603A

公开(公告)日：1972-11-21

申请号：US3703603D

申请日：1971-05-10

Applicant: CIRCUIT STIK INC

Inventor： LEVESOUE NORMAN R ,  HARPER DONALD E

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/20 ,  H05K3/22 ,  H05K3/28 ,  H05K3/38 ,  H05K1/02

CPC classification number: H05K3/207 ,  H05K1/0286 ,  H05K1/0386 ,  H05K1/095 ,  H05K3/222 ,  H05K3/28 ,  H05K3/386 ,  H05K2201/0284 ,  H05K2201/10287 ,  H05K2203/0156 ,  H05K2203/0531 ,  H05K2203/1105 ,  H05K2203/1476

Abstract: An electronic sub-element is provided having a particular circuit configuration, and which in conjunction with other similar sub-elements of the same or different circuit configuration, may be adhesively attached to a panel-like base member so as to constitute a printed circuit assembly. The electronic sub-element of the invention is in the form of conductive metallic particles which are adhesively attached to a carrier strip, such as plastic or wax paper, and which form a multiplicity of electrical conductors separated from one another, the particles being intermixed with adhesive material.

Abstract translation: 提供具有特定电路结构的电子子元件，并且其结合具有相同或不同电路结构的其它类似子元件可以粘合地附接到面板状基座构件，以构成印刷电路组件 。 本发明的电子元件是导电金属颗粒的形式，其粘合地附接到载体条，例如塑料或蜡纸，并且形成彼此分离的多个电导体，所述颗粒与 粘合剂材料。

公开(公告)号：US3774232A

公开(公告)日：1973-11-20

申请号：US3774232D

申请日：1971-11-11

Applicant: CIRCUIT STIK INC

Inventor： MAY D

IPC: H01L23/057 ,  H01L23/498 ,  H05K5/00

CPC classification number: H01L23/49861 ,  H01L23/057 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: An improved microcircuit package is provided for integrated circuit chips, or the like, and which greatly simplifies the manner in which electrical connections may be made between the contacts on the chip and the terminal electrodes and other connections of the microcircuit. The package of the invention comprises a substrate of glass ceramic, polymide, or the like, having adhesive electric conductors formed on its surface, which conductors make connection between the contacts on the integrated circuit chip and the terminal electrodes, merely by pressing the chip over the adhesive electric conductors, the conductors serving additionally to hold and position the chip in the flat pack.

Abstract translation: 为集成电路芯片等提供了改进的微电路封装，并且极大地简化了芯片上的触头与端子电极之间的电连接以及微电路的其它连接的方式。 本发明的封装包括玻璃陶瓷，聚酰亚胺等基板，其表面上形成有粘结电导体，这些导体仅通过将芯片压在芯片上而形成集成电路芯片上的触点和端子电极之间的连接 粘合电导体，另外用于将芯片保持并定位在扁平封装中的导体。