公开(公告)号：US3703603A

公开(公告)日：1972-11-21

申请号：US3703603D

申请日：1971-05-10

Applicant: CIRCUIT STIK INC

Inventor： LEVESOUE NORMAN R ,  HARPER DONALD E

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/20 ,  H05K3/22 ,  H05K3/28 ,  H05K3/38 ,  H05K1/02

CPC classification number: H05K3/207 ,  H05K1/0286 ,  H05K1/0386 ,  H05K1/095 ,  H05K3/222 ,  H05K3/28 ,  H05K3/386 ,  H05K2201/0284 ,  H05K2201/10287 ,  H05K2203/0156 ,  H05K2203/0531 ,  H05K2203/1105 ,  H05K2203/1476

Abstract: An electronic sub-element is provided having a particular circuit configuration, and which in conjunction with other similar sub-elements of the same or different circuit configuration, may be adhesively attached to a panel-like base member so as to constitute a printed circuit assembly. The electronic sub-element of the invention is in the form of conductive metallic particles which are adhesively attached to a carrier strip, such as plastic or wax paper, and which form a multiplicity of electrical conductors separated from one another, the particles being intermixed with adhesive material.

Abstract translation: 提供具有特定电路结构的电子子元件，并且其结合具有相同或不同电路结构的其它类似子元件可以粘合地附接到面板状基座构件，以构成印刷电路组件 。 本发明的电子元件是导电金属颗粒的形式，其粘合地附接到载体条，例如塑料或蜡纸，并且形成彼此分离的多个电导体，所述颗粒与 粘合剂材料。