公开(公告)号：US07994428B2

公开(公告)日：2011-08-09

申请号：US12335449

申请日：2008-12-15

Applicant: Kuo-Ching Tsai ,  Chang-fu Lin Chang

Inventor： Kuo-Ching Tsai ,  Chang-fu Lin Chang

IPC: H01L23/48 ,  H05K1/03

CPC classification number: H05K1/111 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/161 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2924/0002 ,  H01L2924/01033 ,  H05K3/3436 ,  H05K2201/09418 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/05552

Abstract: An electronic carrier board for a chip to be mounted thereon is provided, which includes a body and a plurality of solder pads. The solder pads have carrying surfaces for carrying the chip thereon through conductive bumps. The carrying surfaces of at least two solder pads are oppositely inclined with respect to each other, thereby preventing the conductive bumps mounted on the carrying surfaces from displacement and thereby further preventing two adjacent conductive bumps subject to displacement from coming into short-circuit contact.

Abstract translation: 提供一种用于安装在其上的芯片的电子载板，其包括主体和多个焊盘。 焊盘具有用于通过导电凸块承载芯片的承载表面。 至少两个焊盘的承载表面相对于彼此相对地倾斜，从而防止安装在承载表面上的导电凸块的位移，从而进一步防止两个相邻的导电凸块经受位移而进入短路接触。