公开(公告)号：US06410861B1

公开(公告)日：2002-06-25

申请号：US09454342

申请日：1999-12-03

Applicant: Rong-Fong Huang ,  Chia-Yu Fu

Inventor： Rong-Fong Huang ,  Chia-Yu Fu

IPC: H05K116

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L2224/06102 ,  H01L2224/14 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/09781 ,  H05K2203/041 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49142 ,  Y10T29/49144

Abstract: Low profile interconnect structure includes an electronic circuit module with a plurality of mounting areas and a plurality of electrical contact areas defined by the mounting surface. The plurality of mounting areas are spaced a first distance from a mounting and interconnect surface parallel to and spaced from the mounting surface and the plurality of electrical contact areas are spaced a second distance, less than the first distance, from the mounting and interconnect surface. Large solder balls are used between the mounting areas and the mounting and interconnect surface to form a solid mount and smaller solder members are used for electrical interconnections.

Abstract translation: 薄型互连结构包括具有多个安装区域的电子电路模块和由安装表面限定的多个电接触区域。 多个安装区域与平行于安装表面并与安装表面间隔开的安装和互连表面间隔开第一距离，并且多个电接触区域与安装和互连表面间隔第二距离，小于第一距离。 在安装区域和安装和互连表面之间使用大的焊球以形成固体安装座，并且较小的焊接构件用于电互连。

公开(公告)号：US20090135142A1

公开(公告)日：2009-05-28

申请号：US11945331

申请日：2007-11-27

Applicant: Chia-Yu Fu ,  Manuel Oliver

Inventor： Chia-Yu Fu ,  Manuel Oliver

IPC: H03K17/969 ,  G06F3/02

CPC classification number: G06F3/0233 ,  G06F3/016 ,  H03K17/96

Abstract: A method of entering data into an electronic device (110, 210) includes touching (902, 912) with continual pressure a touch input region (114). Feedback is received (904, 914, 916, 920, 922) indicating a plurality of input possibilities for selection, wherein the touch is released (906, 924) in response to the feedback (904, 914, 916, 920, 922) in one of a temporal or spatial displacement (918) to select one of the plurality of input possibilities.

Abstract translation: 将数据输入电子设备（110,210）的方法包括以连续压力触摸（902,912）触摸输入区域（114）。 接收反馈（904,914,916,920,922），其指示多个用于选择的输入可能性，其中响应于反馈（904,914,916,920,922）中的反馈（904,914,916,920,922）释放触摸（906,924） 选择多个输入可能性中的一个的时间或空间位移（918）中的一个。

公开(公告)号：US20060028428A1

公开(公告)日：2006-02-09

申请号：US10912978

申请日：2004-08-05

Applicant: Xunhu Dai ,  Manuel Oliver ,  Daniel Sadler ,  Chia-Yu Fu

Inventor： Xunhu Dai ,  Manuel Oliver ,  Daniel Sadler ,  Chia-Yu Fu

IPC: G09G5/00

CPC classification number: G06F3/016 ,  G06F1/1626 ,  G06F3/0202 ,  G06F3/041

Abstract: An electronic device (100) for performing intelligent operations includes a housing (112), a manually operable input (118, 122) for providing information to the electronic device, and a material (124) positioned between the manually operable input and the housing. An electromechanical transducer (218, 220) has a mechanical connection consisting of to the manually operable input and an electrical connection for receiving power, wherein substantially all of a mechanical output from the electromechanical transducer is provided to the manually operable input, the material preventing the mechanical output from being transmitted from the manually operable input to the housing. An electric circuit (210) is coupled mechanically to the housing and electronically to the electromechanical transducer for driving the electromechanical transducer in response to the intelligent operations so as to cause the electromechanical transducer to generate a tactile response that can be felt by a user through the manually operable input.

Abstract translation: 用于执行智能操作的电子设备（100）包括壳体（112），用于向电子设备提供信息的可手动操作的输入（118,122）以及位于手动可操作的输入和壳体之间的材料（124）。 机电换能器（218,220）具有由可手动操作的输入和用于接收功率的电连接组成的机械连接，其中机电换能器的机械输出基本上全部提供给可手动操作的输入，该材料防止 机械输出从手动操作的输入传送到外壳。 电路（210）机械耦合到壳体并且电子地耦合到机电变换器，用于响应于智能操作来驱动机电换能器，以便使机电换能器产生触觉响应，该触觉响应可由用户通过 手动输入。

公开(公告)号：US07506438B1

公开(公告)日：2009-03-24

申请号：US09712749

申请日：2000-11-14

Applicant: Chia-Yu Fu ,  Thomas A. Wetteroth ,  Rong-Fong Huang

Inventor： Chia-Yu Fu ,  Thomas A. Wetteroth ,  Rong-Fong Huang

IPC: H01K3/10

CPC classification number: H05K3/403 ,  H01L21/4857 ,  H01L23/49805 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/341 ,  H05K3/3442 ,  H05K3/3484 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09781 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.

Abstract translation: 制造薄型集成模块以包括固定在一起的片材材料，例如陶瓷或PCB，并且包括通过多个片材中的至少一个从下模块表面部分地延伸到上模块表面并在侧面 模块表面。 通孔填充有导电材料。 然后将该模块安装在具有在安装表面上的焊盘的支撑基板上，其面积大于通孔的下表面。 通孔的下表面邻近安装焊盘的上表面定位并焊接，使得焊料沿着侧模块表面吸取通孔。