Abstract:
A bond pad structure of an integrated circuit includes a conductive pad disposed on a first dielectric layer, a first conductive block formed in a second dielectric layer below the first dielectric layer and electrically connected to the conductive pad through a first via plug formed in the first dielectric layer, and an electrically floating first conductive plate situated under the conductive pad.
Abstract:
An ESD protection device is provided. The ESD protection device comprises an SCR and an ESD detection circuit. The SCR is coupled between a high voltage and a ground and has a special semiconductor structure which saves area. When the ESD detection circuit detects an ESD event, the ESD detection circuit drives the SCR to provide a discharging path.
Abstract:
An ESD protection device is provided. The ESD protection device comprises an SCR and an ESD detection circuit. The SCR is coupled between a high voltage and a ground and has a special semiconductor structure which saves area. When the ESD detection circuit detects an ESD event, the ESD detection circuit drives the SCR to provide a discharging path.
Abstract:
A pre-buffer level shifter and an I/O buffer apparatus are provided. The pre-buffer level shifter includes a switchable current source, a current mirror, a buffer unit, a first clamping circuit and a second clamping circuit. Because of a clamping circuit inside a thin oxide MOS transistor device of the pre-buffer level shifter, the present invention can control the voltage swing of the signal for driving an output buffer within a suitable voltage range. Thus, the pre-buffer level shifter can correctly drive the output buffer made of thin oxide MOS transistor devices, increase the operating speed and ensure the reliability thereof.
Abstract:
A poly fuse trimming circuit. The poly fuse trimming circuit comprises a poly fuse and a silicon controlled rectifier (SCR) device. The poly fuse is coupled between a first fixed potential and an output node. The SCR device is controlled by a trimming signal and has an anode coupled to the output node and a cathode coupled to a second fixed potential.
Abstract:
A pre-buffer level shifter and an I/O buffer apparatus are provided. The pre-buffer level shifter includes a switchable current source, a current mirror, a buffer unit, a first clamping circuit and a second clamping circuit. Because of a clamping circuit inside a thin oxide MOS transistor device of the pre-buffer level shifter, the present invention can control the voltage swing of the signal for driving an output buffer within a suitable voltage range. Thus, the pre-buffer level shifter can correctly drive the output buffer made of thin oxide MOS transistor devices, increase the operating speed and ensure the reliability thereof.
Abstract:
A driver impedance control apparatus and system for determining the impedance of at least one driver are provided. The driver impedance control apparatus includes a first reference impedance, a second reference impedance, a dummy pull-up array, a dummy pull-down array, a pull-up array control unit and a pull-down array control unit. The pull-up array control unit controls the pull-up impedance of the driver by detecting a voltage from a first voltage divide point between the first reference impedance and the dummy pull-up array. The pull-down array control unit controls the pull-down impedance of the driver by detecting a voltage from a second voltage divide point between the second reference impedance and the dummy pull-down array.
Abstract:
A power-rail ESD (electrostatic discharge) protection circuit with a dual trigger design is proposed, which is coupled between a first power line and a second power line connected to an IC device for protecting the IC device against ESD on the first power line and the second power line. The proposed power-rail ESD protection circuit comprises a control circuit and at least one MOS device. The control circuit is coupled between the first power line and the second power line, and which is capable of, in the event of ESD in the first power line and the second power line, being triggered by the ESD to output a substrate-triggering voltage and a gate-driving voltage to the MOS device, causing the MOS device to bypass the ESD current from the first power line and the second power line. The circuit configuration of the proposed power-rail ESD protection circuit can help reduce the junction breakdown voltage in a MOS device and increase in ESD robustness.
Abstract:
An electrostatic discharge (ESD) protection circuit for protecting input and output buffers. The ESD protection circuit is driven by a first voltage source and a second voltage source and coupled to a bonding pad. The ESD protection circuit has a first resistor, a first PMOS transistor, a first NMOS transistor, a first diode series, a second PMOS transistor, a second resistor, a third PMOS transistor, a second NMOS transistor, a second diode series and a third NMOS transistor. The electrical devices combine to form different types of ESD protection circuits, each capable of protecting the input buffer or output buffer against the damaging effects of an electrostatic discharge.
Abstract:
A bond pad structure of an integrated circuit includes a conductive pad disposed on a first dielectric layer, a first conductive block formed in a second dielectric layer below the first dielectric layer and electrically connected to the conductive pad through a first via plug formed in the first dielectric layer, and an electrically floating first conductive plate situated under the conductive pad.