公开(公告)号：US06223431B1

公开(公告)日：2001-05-01

申请号：US09086235

申请日：1998-05-28

Applicant: Peter Doikas ,  David Geis ,  Jeffrey D. Merwin

Inventor： Peter Doikas ,  David Geis ,  Jeffrey D. Merwin

IPC: H01R900

CPC classification number: H05K3/4038 ,  H01R43/0256 ,  H05K1/111 ,  H05K3/44 ,  H05K2201/0305 ,  H05K2201/09554 ,  H05K2201/10416 ,  H05K2203/033 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153

Abstract: A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises the steps of: (i) providing an aperture (204) in the substrate (200); (ii) forming a ground plug (302) out of a metallic blank (300); (iii) inserting the ground plug (300) into the aperture in the substrate (200); (iv) compressing the ground plug (302) into the aperture (204) in the substrate (200); (v) placing the printed circuit board (700) onto the substrate (200); and (vi) applying solder into the aperture in the printed circuit board (700) and onto the ground plug (302). The steps of forming (104), inserting (106), and compressing (108) are carried out in a single punching operation (120). The method (100) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.

Abstract translation: 一种用于在印刷电路板（700）和金属衬底（200）之间提供电接地连接的方法（100）包括以下步骤：（i）在衬底（200）中提供孔（204）; （ii）从金属坯料（300）中形成接地塞（302）; （iii）将接地插头（300）插入基板（200）中的孔中; （iv）将接地插头（302）压缩到衬底（200）中的孔（204）中; （v）将印刷电路板（700）放置在基板（200）上; 和（vi）将焊料施加到印刷电路板（700）中的孔中并到达接地插头（302）上。 在单次冲压操作（120）中进行形成（104），插入（106）和压缩（108）的步骤。 方法（100）有效地提供高质量的电接地连接，并避免对复杂机械的任何需要。