公开(公告)号：US20080106475A1

公开(公告)日：2008-05-08

申请号：US12015535

申请日：2008-01-17

Applicant: Gregory JANDZIO ,  Anders Pedersen ,  Gary Rief ,  Walter Whybrew

Inventor： Gregory JANDZIO ,  Anders Pedersen ,  Gary Rief ,  Walter Whybrew

IPC: H01Q9/04

CPC classification number: H05K1/0243 ,  H01Q3/26 ,  H01Q21/0006 ,  H01Q21/0037 ,  H05K3/429 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/10553 ,  H05K2203/049 ,  Y10T29/49165

Abstract: A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel,

Abstract translation: 结构印刷线路板面板包括具有相对的外表面和层间互连的多层印刷线路板，其布置RF，功率和控制信号。 连接区域形成在至少一个面上或之上，用于连接层间互连和任何电气部件。 金属面板固定在至少一个外表面上，为多层印刷线路板增加结构刚性。 金属面板可以具有定位成允许接近连接区域的孔。 RF部件可以由面板承载并且可操作地连接到连接区域。 天线元件可以定位在相同或相对的面板上并且可操作地连接到RF部件以形成相控阵列印刷线路板（PWB）面板，

公开(公告)号：US20070065983A1

公开(公告)日：2007-03-22

申请号：US11557564

申请日：2006-11-08

Applicant: Robert Vinson ,  Joseph Brief ,  Donald Beck ,  Gregory Jandzio

Inventor： Robert Vinson ,  Joseph Brief ,  Donald Beck ,  Gregory Jandzio

IPC: H01L21/00

CPC classification number: H01L23/50 ,  H01L23/642 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.

公开(公告)号：US20070152882A1

公开(公告)日：2007-07-05

申请号：US11324998

申请日：2006-01-03

Applicant: Ronald Hash ,  Robert Taylor ,  Anthony Jones ,  Gregory Jandzio ,  WILLIAM PALMER

Inventor： Ronald Hash ,  Robert Taylor ,  Anthony Jones ,  Gregory Jandzio ,  WILLIAM PALMER

IPC: H01Q1/38

CPC classification number: H01Q21/062 ,  H01Q21/0087

Abstract: A phased array antenna may include a substrate and a plurality of phased array antenna elements carried by the substrate. A plurality of intermediate circuit boards may be arranged in spaced apart relation and each may extend transversely from the substrate. Each intermediate circuit board may have a forward end connected to a plurality of respective phased array antenna elements. A rear circuit board may be connected to the plurality of intermediate circuit boards at rearward ends thereof opposite the substrate.

Abstract translation: 相控阵天线可以包括衬底和由衬底承载的多个相控阵天线元件。 多个中间电路板可以以间隔的关系布置，并且每个中间电路板可以从衬底横向延伸。 每个中间电路板可以具有连接到多个相应的相控阵天线元件的前端。 背面电路板可以在与基板相对的后端处连接到多个中间电路板。

公开(公告)号：US20070085190A1

公开(公告)日：2007-04-19

申请号：US11557543

申请日：2006-11-08

Applicant: Robert VINSON ,  Joseph Brief ,  Donald Beck ,  Gregory Jandzio

Inventor： Robert VINSON ,  Joseph Brief ,  Donald Beck ,  Gregory Jandzio

IPC: H01L23/02

CPC classification number: H01L23/50 ,  H01L23/642 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.

Abstract translation: 公开了一种集成电路模块，去耦电容器组件和方法。 集成电路模块包括安装在基板上的基板和集成电路管芯，并具有管芯焊盘和与基板相对的暴露表面。 多个衬底接合焊盘位于与集成电路管芯相邻的衬底上。 去耦电容器组件安装在每个集成电路管芯上，并且包括固定在集成电路管芯的暴露表面上的电容器载体和由电容器载体承载的去耦电容器。 引线键从去耦电容器组件延伸到芯片焊盘并从芯片焊盘延伸到衬底焊盘。

公开(公告)号：US20050243527A1

公开(公告)日：2005-11-03

申请号：US10835251

申请日：2004-04-29

Applicant: Gregory Jandzio ,  Anders Pedersen ,  Gary Rief ,  Walter Whybrew

Inventor： Gregory Jandzio ,  Anders Pedersen ,  Gary Rief ,  Walter Whybrew

IPC: H01Q3/26 ,  H01Q21/00 ,  H05K1/02 ,  H05K1/09 ,  H05K3/42 ,  H05K7/06

CPC classification number: H05K1/0243 ,  H01Q3/26 ,  H01Q21/0006 ,  H01Q21/0037 ,  H05K3/429 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/10553 ,  H05K2203/049 ,  Y10T29/49165

Abstract: A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.

Abstract translation: 结构印刷线路板面板包括具有相对的外表面和层间互连的多层印刷线路板，其布置RF，功率和控制信号。 连接区域形成在至少一个面上或之上，用于连接层间互连和任何电气部件。 金属面板固定在至少一个外表面上，为多层印刷线路板增加结构刚性。 金属面板可以具有定位成允许接近连接区域的孔。 RF部件可以由面板承载并且可操作地连接到连接区域。 天线元件可以定位在相同或相对的面板上并且可操作地连接到RF部件以形成相控阵列印刷线路板（PWB）面板。