公开(公告)号：US4857383A

公开(公告)日：1989-08-15

申请号：US119272

申请日：1987-11-09

Applicant: Johann Greschner ,  Friedrich W. Schwerdt ,  Hans J. Trumpp

Inventor： Johann Greschner ,  Friedrich W. Schwerdt ,  Hans J. Trumpp

IPC: H05K3/16 ,  B29C59/14 ,  G03F7/00 ,  G03F7/11 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38

CPC classification number: B29C59/14 ,  G03F7/00 ,  G03F7/11 ,  H05K3/0041 ,  H05K3/381 ,  H05K2201/0166 ,  H05K2201/2072 ,  H05K3/388 ,  Y10S428/901 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24612 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31

Abstract: A method of improving the adhesion between a synthetic substrate and metallized layers deposited thereon. A glass resin layer is spin-coated onto an epoxide substrate. The glass layer is covered by a photoresist layer which is roughened by reactive ion etching. The roughened contour of the photoresist layer is transferred via reactive ion etching to form a perforation pattern in the glass layer. The substrate is then etched vertically and horizontally to produce recesses in the substrate having overhanging walls. A thin copper layer is sputtered onto the substrate and copper conductors are sputtered onto the thin copper layer, the copper layers filling the recesses. The recesses and overhangs form mortices in the substrate, and the copper layers within the recess form tenons which fittingly engage with the mortices to produce adhesion between the substrate and the metallized layers in the order of 1000 n/m.

Abstract translation: 一种改善合成基底和沉积在其上的金属化层之间的粘附性的方法。 将玻璃树脂层旋涂在环氧树脂基材上。 玻璃层被通过反应离子蚀刻而粗糙化的光致抗蚀剂层覆盖。 通过反应离子蚀刻转移光致抗蚀剂层的粗糙轮廓，以在玻璃层中形成穿孔图案。 然后垂直和水平地蚀刻衬底，以在具有悬垂壁的衬底中产生凹陷。 将薄铜层溅射到基板上，并将铜导体溅射到薄铜层上，铜层填充凹槽。 凹陷和突出部在基底中形成榫眼，并且凹槽内的铜层形成与榫眼嵌合的榫头，以在基板和金属化层之间产生约1000n / m的粘合力。

公开(公告)号：US4642163A

公开(公告)日：1987-02-10

申请号：US547553

申请日：1983-10-31

Applicant: Johann Greschner ,  Friedrich W. Schwerdt ,  Hans J. Trumpp

Inventor： Johann Greschner ,  Friedrich W. Schwerdt ,  Hans J. Trumpp

IPC: H05K3/16 ,  B29C59/14 ,  G03F7/00 ,  G03F7/11 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38 ,  B44C1/22 ,  B05D3/00

CPC classification number: B29C59/14 ,  G03F7/00 ,  G03F7/11 ,  H05K3/0041 ,  H05K3/381 ,  H05K2201/0166 ,  H05K2201/2072 ,  H05K3/388 ,  Y10S428/901 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24612 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31

Abstract: A method of improving the adhesion between a synthetic substrate and metallized layers deposited thereon. A glass resin layer is spin-coated onto an epoxide substrate. The glass layer is covered by a photoresist layer which is roughened by reactive ion etching. The roughened contour of the photoresist layer is transferred via reactive ion etching to form a perforation pattern in the glass layer. The substrate is then etched vertically and horizontally to produce recesses in the substrate having overhanging walls. A thin copper layer is sputtered onto the substrate and copper conductors are sputtered onto the thin copper layer, the copper layers filling the recesses. The recesses and overhangs form mortices in the substrate, and the copper layers within the recess form tenons which fittingly engage with the mortices to produce adhesion between the substrate and the metallized layers in the order of 1000 n/m.

Abstract translation: 一种改善合成基底和沉积在其上的金属化层之间的粘附性的方法。 将玻璃树脂层旋涂在环氧树脂基材上。 玻璃层被通过反应离子蚀刻而粗糙化的光致抗蚀剂层覆盖。 通过反应离子蚀刻转移光致抗蚀剂层的粗糙轮廓，以在玻璃层中形成穿孔图案。 然后垂直和水平地蚀刻衬底，以在具有悬垂壁的衬底中产生凹陷。 将薄铜层溅射到基板上，并将铜导体溅射到薄铜层上，铜层填充凹槽。 凹陷和突出部在基底中形成榫眼，并且凹槽内的铜层形成与榫眼嵌合的榫头，以在基板和金属化层之间产生约1000n / m的粘合力。

公开(公告)号：US4556628A

公开(公告)日：1985-12-03

申请号：US600063

申请日：1984-04-13

Applicant: Johann Greschner ,  Friedrich W. Schwerdt ,  Hans J. Trumpp

Inventor： Johann Greschner ,  Friedrich W. Schwerdt ,  Hans J. Trumpp

IPC: H05K3/42 ,  H05K3/00 ,  H05K3/02 ,  H05K3/04 ,  H05K3/10 ,  H05K3/16 ,  H05K3/24 ,  H05K3/40 ,  G03C5/00

CPC classification number: H05K3/0041 ,  H05K3/048 ,  H05K3/107 ,  H05K2201/0347 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/0554 ,  H05K2203/0585 ,  H05K2203/072 ,  H05K2203/095 ,  H05K3/108 ,  H05K3/16 ,  H05K3/244 ,  H05K3/426

Abstract: A process for producing printed circuit boards having metallic conductor structures embedded in the insulating substrate and whose front and back sides are conductively connected by means of plated through holes. The first steps of the process comprise producing a matrix on an epoxy resin substrate consisting of a lift-off layer, an aluminum barrier layer and a positive photoresist layer. A negative image of the desired conductor pattern is then generated in the photoresist layer using conventional photolithographic techniques. The negative image is etched into the barrier layer and the lift-off layer such that an undercut occurs under the barrier layer. Subsequently, vertical trenches are etched into the epoxy resin substrate. After drilling of the through holes, an activating layer of copper is deposited by means of magnetic field enhanced cathode sputtering on the surfaces of the trenches, the through holes and the barrier layer. The lift-off layer, together with the barrier layer covering it, is removed by immersion in a suitable solvent, and copper conductors are subsequently grown in the etched conductor trenches.

Abstract translation: 一种用于制造印刷电路板的方法，该印刷电路板具有嵌入绝缘基板中的金属导体结构，其前侧和后侧通过电镀通孔导电连接。 该方法的第一步包括在由剥离层，铝阻挡层和正性光致抗蚀剂层组成的环氧树脂基材上制备基质。 然后使用常规光刻技术在光致抗蚀剂层中产生所需导体图案的负像。 负像被蚀刻到阻挡层和剥离层中，使得在阻挡层下方发生底切。 随后，将垂直沟槽蚀刻到环氧树脂基板中。 在通孔钻孔之后，通过磁场强化阴极溅射在沟槽，通孔和阻挡层的表面上沉积铜的激活层。 剥离层与覆盖它的阻挡层一起通过浸入合适的溶剂中除去，然后在蚀刻的导体沟槽中生长铜导体。

公开(公告)号：US4513203A

公开(公告)日：1985-04-23

申请号：US625586

申请日：1984-06-29

Applicant: Harald Bohlen ,  Helmut Engelke ,  Johann Greschner ,  Reinhold Muhl ,  Peter Nehmiz ,  Hans J. Trumpp

Inventor： Harald Bohlen ,  Helmut Engelke ,  Johann Greschner ,  Reinhold Muhl ,  Peter Nehmiz ,  Hans J. Trumpp

IPC: G03B27/32 ,  G03F9/00 ,  H01J37/304 ,  H01L21/027 ,  H01L21/68 ,  G01N21/00 ,  G01N23/00

CPC classification number: H01J37/3174 ,  B82Y10/00 ,  B82Y40/00 ,  G03F9/00 ,  G03F9/7053 ,  H01J37/3045

Abstract: For mutually aligning (registering) mask and substrate in X- or corpuscular ray lithography, an electron beam (16) is used which extends collaterally to the exposure beam (ion beam or X-ray) and which is suppressed during the actual exposure process. For coupling the electron beam to the exposure beam path, a magnetic field (7) is used. The accurate relative position of mask and substrate is determined during alignment by tilting the electron beam. Fine alignment during exposure is effected by suitably tilting the ion beam or shifting the substrate relative to the X-ray. The mask (10) used for exposure consists of a very thin silicon layer with a pattern area (M) and a registration area (R) spatially separated therefrom. The registration area consists of a plurality of openings, the pattern area of blind holes.

Abstract translation: 为了在X射线或微粒光刻中相互对准（配准）掩模和衬底，使用电子束（16），其横向延伸到曝光光束（离子束或X射线），并且在实际曝光过程中被抑制。 为了将电子束耦合到曝光光束路径，使用磁场（7）。 通过倾斜电子束在对准期间确定掩模和衬底的精确相对位置。 通过适当地倾斜离子束或相对于X射线移动衬底来实现曝光期间的精细对准。 用于曝光的掩模（10）由具有图案区域（M）的非常薄的硅层和与其空间分离的对准区域（R）组成。 注册区域由多个开口组成，盲孔的图案区域。